Composite panel material

1. A method for making a composite material, comprising:

preparing a curable resin composition comprising: (a) at least one thermosettable resin; and (b) a curative, wherein the curative (b) comprises: (i) a mixture of at least one low temperature curative and at least one high temperature curative; or (ii) a dual function curative compound having a low temperature curative part and a high temperature curative part;

applying the curable resin composition to one or more continuous fibre tow(s) to impregnate the fiber tow(s), each fibre tow comprising a plurality of fibre filaments;

winding the impregnated fiber tow(s) around a mandrel in a filament winding process to form a woven structure;

removing the woven structure from the mandrel to form a blank;

allowing B-staging of the blank at a temperature of about 23° C. to about 25° C., wherein said B-staging involves an addition reaction between the at least one thermosettable resin (a) and either the at least one low temperature curative of the mixture (i) or the low temperature curative part of the dual function curative compound (ii), and wherein said B-staging results in a partially cured resin material having an isolatable intermediate state such that the resin can still be stimulated by heat or radiation to achieve a maximum cured state;

moulding said blank or a plurality of said blank in a mould; and

curing the moulded blank(s) in a final cure cycle at a temperature of 40° C. to 200° C. to form a fully cured moulded article, wherein said curing involves catalytic curing of the partially cured resin material with either the at least one high temperature curative of the mixture (i) or the high temperature curative part of the dual function curative compound (ii).

2. The method of claim 1 , wherein the curative (b) comprises the mixture (i) of at least one low temperature curative and at least one high temperature curative.

3. The method of claim 2 , wherein:

the least one low temperature curative is selected from: isophorone diamine (IPDA); trimethylhexamethylene diamine; diethylenetriamine (DETA); triethylenetetramine (TETA); tetraethylenepentamine (TEPA); TCD-diamine; N,N-dimethylpropane-1,3-diamine; N,N-diethylpropane-1,3-diamine; 1,2-diaminocyclohexane; 1,3-diaminocyclohexane; 1,3-bisaminocyclohexylamine; 1,3-bis(aminomethyl)cyclohexane (1,3-BAC); 1,2-bis(aminomethyl)cyclohexane; 4,4′-methylenebis(cyclohexylamine); 4,4′-methylenebis(2-methylcyclohexylamine); N-aminoethylpiperazine (AEP); Bis(aminopropyl)piperazine (BAPP); poly(oxyalkyl)diamines; and 4,7,10-trioxatridecane-1,13-diamine (TTD); and

the at least one high temperature curative is selected from: 1-cyanoethyl-2-ethyl-4-methylimidazole (EMPI), 2-ethyl-4-methylimidazole (EMI), 1-cyanoethyl-2-methylimidazole, 1-methyl imidazole, 4-methyl imidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-(3-aminopropyl)imidazole (API), 1,2-dimethylimidazole, 1-cyanoethyl-2-undecylimidazole, and 4.5-bis[(2-cyanoethoxy)methyl]-2-phenyl-1H-imidazole-1-propiononitrile.

4. The method of claim 1 , wherein the curative (b) comprises the mixture (i) of at least one low temperature curative and at least one high temperature curative, and the at least one high temperature curative is an imidazole.

5. The curable resin composition of claim 4 wherein the imidazole is 2-ethyl-4-methyl imidazole (EMI).

6. The method of claim 1 , wherein the curative (b) comprises the dual function curative compound (ii) having a low temperature curative part and a high temperature curative part.

7. The method of claim 6 , wherein the dual function curative compound (ii) having a low temperature curative part and a high temperature curative part is selected from: N-(3-aminopropyl)imidazole (API), N,N-diethylpropane diamine (DEPD), and N,N-dimethylpropane diamine (DMPD).

8. The method of claim 1 , wherein the one or more continuous fibre tow(s) is/are carbon fibre tow(s).

9. The method of claim 1 , wherein the final cure cycle is carried out for less than 10 minutes.

10. The method of claim 1 , wherein the at least one thermosettable resin (a) in the curable resin composition is monofunctional or multifunctional epoxy resin.

11. The method of claim 1 , wherein the curable resin composition is solvent-free.

12. The method of claim 1 , wherein the weight ratio of the at least one thermosettable resin (a) to the curative (b) in the curable resin composition is greater than or equal to 5.

13. The method of claim 12 , wherein the weight ratio of the at least one thermosettable resin (a) to the curative (b) in the curable resin composition is 5 to 20.