Transfer of vertically aligned ultra-high density nanowires onto flexible substrates

1. A method, comprising:

forming a plurality of vertically aligned nanowires inside channels of an anodized alumina (AAO) template on an aluminum substrate, where individual nanowires of the plurality of vertically aligned nanowires extend to a distal end from a proximal end adjacent to the aluminum substrate;

removing the aluminum substrate and a portion of the AAO template adjacent to the aluminum substrate to expose a surface of the AAO template and a portion of the proximal end of the individual nanowires, the exposed surface formed on a remaining portion of the AAO template by the removal of the portion of the AAO template, where the plurality of vertically aligned nanowires are retained in alignment by the channels of the remaining portion of the AAO template with the portion of the proximal ends of the individual nanowires exposed;

depositing a conductive interlayer on the exposed surface of the AAO template and the exposed portion of the individual nanowires, the vertically aligned nanowires embedded in the conductive interlayer deposited between the exposed proximal ends of adjacent nanowires;

forming a flexible substrate on a surface of the conductive interlayer opposite the plurality of vertically aligned nanowires embedded in the conductive interlayer; and

removing the remaining portion of the AAO template from around the plurality of vertically aligned nanowires embedded in the conductive interlayer after forming the flexible substrate.

2. The method of claim 1 , wherein the flexible substrate comprises polydimethylsiloxane (PDMS).

3. The method of claim 1 , further comprising anodizing an aluminum film to form the AAO template on the aluminum substrate.

4. The method of claim 1 , wherein the plurality of vertically aligned nanowires inside the channels of the AAO template are synthesized by sol-gel, hydrothermal or chemical vapor deposition.

5. The method of claim 1 , wherein the portion of the proximal end of the individual nanowires is exposed by etching away the portion of the AAO template that is exposed by the removal of the aluminum substrate.

6. The method of claim 1 , wherein the conductive interlayer is deposited on the exposed surface of the AAO template and the exposed portion of the individual nanowires by e-beam deposition, thermal evaporation deposition, or sputter deposition.

7. The method of claim 1 , wherein the conductive interlayer comprises gold (Au), silver (Ag), or indium tin oxide (ITO).

8. The method of claim 1 , wherein the conductive interlayer is deposited on the exposed surface of the AAO template and the exposed portion of the individual nanowires by spin coating.

9. The method of claim 8 , wherein the conductive interlayer comprises a conductive polymer.

10. The method of claim 9 , wherein the conductive polymer comprises PEDOT:PS or poly(3,4-ethylenedioxythiophene) polystyrene sulfonate.

11. The method of claim 8 , wherein the conductive interlayer is annealed after deposition by spin coating.

12. The method of claim 8 , wherein charges are applied to tips of the plurality of vertically aligned nanowires using an electrostatic repulsion technique.

13. The method of claim 1 , wherein the plurality of vertically aligned nanowires have a density of about 10 11 nanowires/cm 2 .

14. The method of claim 1 , wherein the plurality of vertically aligned nanowires inside the channels of the AAO template are synthesized by electrodeposition.