Thermosetting adhesive sheet and semiconductor device manufacturing method
Provided are a thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing semiconductor wafer warping and chipping. The thermosetting adhesive sheet includes a thermosetting adhesive layer containing a resin component and a filler, the resin component containing a (meth)acrylate and a polymerization initiator, the (meth)acrylate containing a solid (meth)acrylate and a trifunctional or higher functional (meth)acrylate, content of the solid (meth)acrylate in the resin component being 55 wt % or more; a total value obtained by multiplying the number of functional groups per unit molecular weight of the (meth)acrylate by content of the (meth)acrylate in the resin component being 2.7E-03 or more, and blending amount of the filler being 80 to 220 pts. mass with respect to 100 pts. mass of the resin component.
1. A thermosetting adhesive sheet comprising:
a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing a (meth)acrylate and a polymerization initiator,
wherein the (meth)acrylate contains a solid (meth)acrylate and a trifunctional or higher functional (meth)acrylate,
wherein content of the solid (meth)acrylate in the resin component is 55 wt % or more,
wherein a total value obtained by multiplying the number of functional groups per unit molecular weight of the (meth)acrylate by content of the (meth)acrylate in the resin component is 2.7E-03 or more, and
wherein blending amount of the filler is 80 to 220 pts. mass with respect to 100 pts. mass of the resin component.
2. The thermosetting adhesive sheet according to claim 1 , wherein weight average molecular weight of the (meth)acrylate is 200 to 50,000.
3. The thermosetting adhesive sheet according to claim 2 , wherein the solid (meth)acrylate comprises a bisphenol epoxy (meth)acrylate.
4. The thermosetting adhesive sheet according to claim 2 , wherein content of the (meth)acrylate in the resin component is 90 wt % or more.
5. The thermosetting adhesive sheet according to claim 2 , wherein the filler includes a black pigment.
6. The thermosetting adhesive sheet according to claim 1 , wherein the solid (meth)acrylate comprises a bisphenol epoxy (meth)acrylate.
7. The thermosetting adhesive sheet according to claim 6 , wherein content of the (meth)acrylate in the resin component is 90 wt % or more.
8. The thermosetting adhesive sheet according to claim 6 , wherein the filler includes a black pigment.
9. The thermosetting adhesive sheet according to claim 1 , wherein content of the (meth)acrylate in the resin component is 90 wt % or more.
10. The thermosetting adhesive sheet according to claim 9 , wherein the filler includes a black pigment.
11. The thermosetting adhesive sheet according to claim 1 , wherein the filler includes a black pigment.
12. A method for manufacturing a semiconductor device comprising:
a grinding step of grinding a semiconductor wafer;
a thermosetting adhesive sheet applying step of applying a thermosetting adhesive sheet to a ground surface of the semiconductor wafer;
a curing step of curing the thermosetting adhesive sheet to reduce warping of the semiconductor wafer;
a dicing tape applying step of applying a dicing tape to a side of the semiconductor wafer to which the thermosetting adhesive sheet is applied; and
a dicing step of dicing the semiconductor wafer to which the dicing tape is applied to obtain individual semiconductor chips,
wherein the thermosetting adhesive sheet comprises a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing a (meth)acrylate and a polymerization initiator,
wherein the (meth)acrylate contains a solid (meth)acrylate and a trifunctional or higher functional (meth)acrylate,
wherein content of the solid (meth)acrylate in the resin component is 55 wt % or more,
wherein a total value obtained by multiplying the number of functional groups per unit molecular weight of the (meth)acrylate by content of the (meth)acrylate in the resin component is 2.7E-03 or more, and
wherein blending amount of the filler is 80 to 220 pts. mass with respect to 100 pts. mass of the resin component.
13. The method for manufacturing a semiconductor device according to claim 12 , wherein the grinding step includes grinding to a thickness of 200 μm or less.