Stress relaxation substrate and textile type device
The present invention provides a stress relaxation substrate for relaxing stress generated due to differences in the hardness of a circuit substrate and a cloth body. This stress relaxation substrate is disposed between a cloth body and a circuit board having a wiring, wherein the stress relaxation substrate includes a stress relaxation layer harder than the cloth body, and softer than the circuit board, an adhesive layer provided on one surface of the stress relaxation layer, and a conductive portion provided on the stress relaxation layer to be formed between a first surface and a second surface.
1. A stress relaxation substrate disposed between a cloth body and a circuit board having a wiring, the stress relaxation substrate comprising:
a stress relaxation layer which is harder than the cloth body, and softer than the circuit board,
an adhesive layer provided on one surface of the stress relaxation layer, and
a conductive portion disposed on both a first surface and a second surface of the stress relaxation substrate,
wherein the stress relaxation substrate and the circuit board are directly bonded to each other, or directly bonded through an adhesive layer.
2. The stress relaxation substrate according to claim 1 ,
wherein a bendability of the stress relaxation substrate is greater than a bendability of the circuit board and a bendability of the cloth body.
3. The stress relaxation substrate according to claim 1 ,
wherein the adhesive layer is a thermoplastic resin layer.
4. The stress relaxation substrate according to claim 1 ,
wherein the conductive portion comprises a via wiring provided in a through hole penetrating through the adhesive layer and the stress relaxation layer.
5. The stress relaxation substrate according to claim 1 ,
wherein the conductive portion comprises a conductive thread which penetrates the stress relaxation layer and the adhesive layer, and a portion of which is exposed on both sides.
6. The stress relaxation substrate according to claim 1 ,
wherein the stress relaxation substrate comprises a circuit board placement area at a center in a plan view, and the conductive portion is disposed from an outer periphery toward the circuit board placement area.
7. The stress relaxation substrate according to claim 6 ,
wherein a wiring density of the conductive portion becomes higher toward the outer periphery on the circuit board placement area.
8. The stress relaxation substrate according to claim 1 ,
wherein when a hardness of the cloth body is 10 to 1000 N/m, and a hardness of the circuit board is 3.0×10 5 to 7.5×10 5 N/m, a hardness of the stress relaxation layer is 1000 to 3.0×10 5 N/m; and
when a bendability of the cloth body is 1.0×10 −10 N·m or less, and a bendability of the circuit board is from 1.0×10 −4 to 5.0×10 −3 N·m, a bendability of the stress relaxation layer is 5.0×10 −3 to 0.5 N·m.
9. A textile device, comprising:
a cloth body,
a stretchable wire,
a circuit board on which a circuit wire is formed, and
a stress relaxation substrate according to claim 1 , which is disposed between the circuit board and the cloth body,
wherein the stretchable wire and the circuit wire are connected by the conductive portion of the stress relaxation substrate.
10. The textile device according to claim 9 ,
wherein a wiring density of the conductive portion in a plan view becomes higher toward the circuit board.
11. The textile device according to claim 9 ,
wherein
an area of the stress relaxation substrate is larger than that of the circuit board, and
the circuit board is disposed at a position overlapping the stress relaxation substrate in a plan view.