Thermal management in high power RF MEMS switches
The present disclosure generally relates to a mechanism for making a MEMS switch that can switch large electrical powers. Extra landing electrodes are employed that provide added electrical contact along the MEMS device so that when in contact current and heat are removed from the MEMS structure close to the hottest points.
1. A MEMS device, comprising:
a substrate having a plurality of electrodes formed therein, wherein the plurality of electrodes comprises at least an anchor electrode, a pull-in electrode and an RF electrode;
a first insulating layer disposed over the plurality of electrodes and the substrate;
a switching element disposed over the first insulating layer, wherein the switching element includes an anchor portion, a leg portion and a bridge portion and wherein the anchor portion is electrically coupled to the anchor electrode;
a first post coupled to the RF electrode, wherein the first post comprises an electrically conductive material and the first post is disposed directly on both the RF electrode and the first insulating layer; and
a second post electrically coupled to the anchor electrode through a first opening formed in the first insulating layer, wherein the switching element is movable between a first position spaced from the first post and the second post, and a second position in contact with the first post and the second post.
2. The MEMS device of claim 1 , wherein the second post comprises an electrically and thermally conductive material.
3. The MEMS device of claim 1 , wherein the second post and the first post each have a top surface and wherein the top surfaces comprise the same material.
4. The MEMS device of claim 1 , wherein the second post is positioned at a location such that the bridge portion is in contact with the second post when the switching element is in the second position.
5. The MEMS device of claim 1 , wherein the first post is positioned at a location such that the bridge portion is in contact with the first post when the switching element is in the second position.
6. The MEMS device of claim 1 , further comprising a pull-up electrode disposed over the switching element.
7. The MEMS device of claim 1 , wherein the anchor portion is electrically coupled to the anchor electrode through a second opening formed in the first insulating layer.
8. A MEMS device, comprising:
a substrate having a plurality of electrodes formed therein, wherein the plurality of electrodes comprises at least an anchor electrode, a pull-in electrode and an RF electrode;
a first insulating layer disposed over the plurality of electrodes and the substrate;
a switching element disposed over the first insulating layer, wherein the switching element includes an anchor portion, a leg portion and a bridge portion and wherein the anchor portion is electrically coupled to the anchor electrode, and wherein the switching element comprises an electrically conductive material;
a first post coupled to the RF electrode, and the first post is disposed directly on both the RF electrode and the first insulating layer;
a second post disposed over the anchor electrode and electrically coupled to the anchor electrode through a first opening formed in the first insulating layer, wherein the switching element is movable between a first position spaced from the first post and the second post, and a second position in contact with the first post and the second post; and
a second insulating layer disposed on a bottom surface of the switching element, wherein the first post contacts the electrically conductive material of the switching element through the second insulating layer when the switching element is in the second position.
9. The MEMS device of claim 8 , wherein the second post comprises an electrically and thermally conductive material.
10. The MEMS device of claim 8 , wherein the second post and the first post each have a top surface and wherein the top surfaces comprise the same material.
11. The MEMS device of claim 8 , wherein the second post is positioned at a location such that the bridge portion is in contact with the second post when the switching element is in the second position.
12. The MEMS device of claim 8 , wherein the first post is positioned at a location such that the bridge portion is in contact with the first post when the switching element is in the second position.
13. The MEMS device of claim 8 , further comprising a pull-up electrode disposed over the switching element.
14. The MEMS device of claim 8 , wherein the anchor portion is electrically coupled to the anchor electrode through a second opening formed in the first insulating layer.
15. A method of forming a MEMS device, comprising:
depositing an insulating layer over a substrate, the substrate having a plurality of electrodes formed therein, wherein the plurality of electrodes includes at least an anchor electrode, a pull-in electrode and an RF electrode, wherein the insulating layer is disposed over the plurality of electrodes and the substrate;
removing at least a portion of the insulating layer to expose at least a portion of the anchor electrode and at least a portion of the RF electrode;
forming a first post over and in contact with the RF electrode, wherein the first post comprises an electrically conductive material, and the first post is disposed directly on both the RF electrode and the insulating layer;
forming a second post over and in contact with the anchor electrode through an opening formed in the insulating layer; and
forming a switching element over the substrate, first post and second post, wherein the switching element is disposed over the insulating layer, wherein the switching element includes an anchor portion that is electrically coupled to the anchor electrode, a bridge portion, and a leg portion and the RF electrode, wherein the switching element is movable between a first position spaced from the first post and the second post and a second position in contact with the first post and the second post.
16. The method of claim 15 , wherein the second post comprises an electrically and thermally conductive material.
17. The method of claim 16 , wherein the switching element has a bottom surface having a first portion that is both electrically and thermally conductive and a second portion that is electrically insulating.
18. The method of claim 15 , wherein the second post and the first post each have a top surface and wherein the top surfaces comprise the same material.
19. The method of claim 15 , wherein the second post is positioned at a location such that the bridge portion is in contact with the second post when the switching element is in the second position.
20. The method of claim 15 , wherein the first post is positioned at a location such that the bridge portion is in contact with the first post when the switching element is in the second position.
21. The method of claim 15 , further comprising forming a pull-up electrode disposed over the switching element.
22. A method of forming a MEMS device, comprising:
depositing an insulating layer over a substrate, the substrate having a plurality of electrodes formed therein, wherein the plurality of electrodes includes at least an anchor electrode, a pull-in electrode and an RF electrode;
removing at least a portion of the insulating layer to expose at least a portion of the anchor electrode and at least a portion of the RF electrode;
forming a first post over and in contact with the RF electrode, wherein the first post comprises an electrically conductive material and the first post is disposed directly on both the RF electrode and the insulating layer;
forming a second post over the anchor electrode, wherein the second post is electrically coupled to the anchor electrode through an opening formed in the insulating layer; and
forming a switching element over the substrate, first post and second post, wherein the switching element includes an anchor portion that is electrically coupled to the anchor electrode, a leg portion and the RF electrode, wherein the switching element is movable from a first position spaced from the first post and the second post and a second position in contact with the first post and the second post, wherein the switching element has a bottom surface that has an insulating portion and a conductive portion, and wherein the insulating portion contacts the second post in the second position and the conductive portion contacts the first post in the second position.
23. The method of claim 22 , wherein the second post comprises an electrically and thermally conductive material.
24. The method of claim 23 , wherein the switching element has the bottom surface having a first portion that is both electrically and thermally conductive and a second portion that is electrically insulating.
25. The method of claim 22 , wherein the second post and the first post each have a top surface and wherein the top surfaces comprise the same material.
26. The method of claim 22 , wherein the second post is positioned at a location such that a bridge portion of the switching element is in contact with the second post when the switching element is in the second position.
27. The method of claim 22 , wherein the first post is positioned at a location such that a bridge portion of the switching element is in contact with the first post when the switching element is in the second position.
28. The method of claim 22 , further comprising forming a pull-up electrode disposed over the switching element.