Electronic device for liquid immersion cooling and cooling system using the same
An electronic device, immersed in a coolant filled in a cooling apparatus, and directly cooled, is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with board retainers disposed in the housing part, and substrate groups attached to a first surface of the metal board and a second surface opposite the first surface. The substrate group includes first circuit boards, each including sockets for mounting processors and main memories on one surface of a substrate, and a component for interconnecting the processors, a second circuit board including a mother board component which includes a chipset for controlling the main memory, and a flow channel formed in a gap between a surface opposite the one surface of the first circuit boards, and one surface of the second circuit board, which faces the surface opposite the one surface of the first circuit boards.
1. An electronic device that is immersed in a coolant filled in a cooling apparatus, and directly cooled, the electronic device being configured to be housed in each of a plurality of housing parts of the cooling apparatus, the electronic device comprising:
a metal board held with a pair of board retainers disposed in the housing part; and
one or more substrate groups attached to a first surface of the metal board and a second surface opposite the first surface, wherein the substrate group includes one or more first circuit boards, each including a plurality of sockets for mounting a plurality of processors and main memories on one surface of a substrate, and a component for interconnecting the processors, a second circuit board including a mother board component which includes at least a chipset for controlling the main memory, but does not include the sockets for mounting the processors and the main memories, and the component for interconnecting the processors, a connector for electrically connecting between the one or more first circuit boards and the second circuit board, and a flow channel formed in a gap between a surface opposite the one surface of the one or more first circuit boards, and one surface of the second circuit board, which faces the surface opposite the one surface of the one or more first circuit boards.
2. The electronic device according to claim 1 , further comprising a plurality of spacers for holding the gap, and a plurality of screws, wherein each of the screws pierces through the first circuit board, the second circuit board, and the respective spacers for fastening.
3. The electronic device according to claim 1 , wherein an external shape of a connected body formed by attaching the one or more substrate groups respectively to the first and the second surfaces of the metal board is similar to an internal shape of the housing part.
4. The electronic device according to claim 3 , wherein the connected body has a rectangular parallelepiped external shape.
5. An electronic device that is immersed in a coolant filled in a cooling apparatus, and directly cooled, the electronic device being configured to be housed in each of a plurality of housing parts of the cooling apparatus, the cooling apparatus including a cooling tank with an open space defined by a bottom wall and side walls, a plurality of arranged housing parts formed by dividing the open space using a plurality of internal partition walls in the cooling tank, and an inflow opening and an outflow opening for the coolant, the inflow opening being formed in a bottom part or a side surface of each of the housing parts, and the outflow opening being formed around a surface of the coolant circulating in the respective housing parts, wherein:
the electronic device includes a metal board held with a pair of board retainers disposed in the housing part, and one or more substrate groups attached to a first surface of the metal board and a second surface opposite the first surface;
the substrate group includes one or more first circuit boards, each including a plurality of sockets for mounting a plurality of processors and main memories on one surface of a substrate, and a component for interconnecting the processors, a second circuit board including a mother board component which includes at least a chipset for controlling the main memory, but does not include the sockets for mounting the processors and the main memories, and the component for interconnecting the processors, a connector for electrically connecting between the one or more first circuit boards and the second circuit board, and a flow channel formed in a gap between a surface opposite the one surface of the one or more first circuit boards, and one surface of the second circuit board, which faces the surface opposite the surface of the one or more first circuit boards.
6. The electronic device according to claim 5 , further comprising a plurality of spacers for holding the gap, and a plurality of screws, wherein each of the screws pierces through the first circuit board, the second circuit board, and the respective spacers for fastening.
7. The electronic device according to claim 5 , wherein an external shape of a connected body formed by attaching the one or more substrate groups respectively to the first and the second surfaces of the metal board is similar to an internal shape of the housing part.
8. The electronic device according to claim 7 , wherein the connected body has a rectangular parallelepiped external shape.