IP Library › Granted Patent US 10,816,681
Granted Patent B2
US 10,816,681 · App. 15/773,618 · Granted Oct 27, 2020

Radiation detector and manufacturing method for radiation detector

Inventors: Keiji Abe (Hamamatsu, JP); Toshiyuki Izawa (Hamamatsu, JP); Koei Yamamoto (Hamamatsu, JP)
Assignee: HAMAMATSU PHOTONICS K.K.
G01T1/241H01G9/0036H01G9/2009H01G9/2018H01L27/308H01L51/0004H01L51/0014H01L51/426
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Quick Facts
Patent No.
US 10,816,681
App. No.
15/773,618
Granted
Oct 27, 2020
Kind
B2
Abstract

A radiation detector includes a substrate including a charge collection electrode, a radiation absorption layer disposed on one side with respect to the substrate and including perovskite structure particles and a binder resin; and a voltage application electrode disposed on the one side with respect to the radiation absorption layer, a bias voltage being applied to the voltage application electrode so that a potential difference is generated between the voltage application electrode and the charge collection electrode.

Claims (14)

1. A radiation detector comprising:

a substrate including a charge collection electrode;

a radiation absorption layer disposed on one side with respect to the substrate and including perovskite structure particles and a binder resin; and

a voltage application electrode disposed on the one side with respect to the radiation absorption layer, a bias voltage being applied to the voltage application electrode so that a potential difference is generated between the voltage application electrode and the charge collection electrode.

2. The radiation detector according to claim 1 , wherein the radiation absorption layer further includes inorganic semiconductor particles other than the perovskite structure particles.

3. The radiation detector according to claim 2 , wherein an average particle diameter of the perovskite structure particles is larger than an average particle diameter of the inorganic semiconductor particles.

4. The radiation detector according to claim 2 , further comprising a semiconductor charge collection layer disposed between the substrate and the radiation absorption layer.

5. The radiation detector according to claim 4 , wherein a conductivity type of the inorganic semiconductor particles and a conductivity type of the semiconductor charge collection layer are the same.

6. The radiation detector according to claim 1 , further comprising a hole transport layer disposed between the radiation absorption layer and the voltage application electrode.

7. A method of manufacturing a radiation detector, the method comprising:

preparing a coating solution containing perovskite structure particles, a binder resin, and an organic solvent;

forming a radiation absorption layer on one side with respect to a substrate including a charge collection electrode through screen printing using the coating solution after the preparing of the coating solution, the radiation absorption layer containing the perovskite structure particles and the binder resin; and

forming a voltage application electrode on the one side with respect to the radiation absorption layer after the forming of the radiation absorption layer, a bias voltage being applied to the voltage application electrode such that a potential difference is generated between the voltage application electrode and the charge collection electrode.

8. The method according to claim 7 , further comprising pulverizing a perovskite structure crystal block to obtain the perovskite structure particles before the preparing of the coating solution.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2018
From: ABE, KEIJI; IZAWA, TOSHIYUKI; YAMAMOTO, KOEI
To: HAMAMATSU PHOTONICS K.K.
Reel/Frame 045998/0572 →
Priority Claims (1)
JP 2015-219211 · Nov 9, 2015 · national
Continuity (1)
Related Publication 20200257006A1 · Aug 13, 2020