Structural adhesive with improved corrosion resistance

1. A method for bonding parts, the method comprising:

i. Providing a first part and a second part;

ii. Providing a thermosettable structural adhesive composition to at least one surface of the first part and/or the second part, with the structural adhesive composition comprising:

(a) an epoxy compound;

(b) a thermoplastic compound;

(c) an epoxy curing agent that does not act as a catalyst;

(d) at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water and is selected from the group consisting of metal oxides and metal hydroxides; and

(e) at least one component comprising at least one epoxy moiety and at least one linear or branched alkyl group, wherein component (e) is different from (a) the epoxy compound;

iii. Adhering together the first part and the second part using the structural adhesive composition at a temperature lower than the activation temperature of the epoxy curing agent, thereby forming a joint between the first and the second part, and

iv. Heating the joint at a temperature higher than the activation temperature of the epoxy curing agent, so as to cause thermosetting of the thermosettable composition.

2. The method according to claim 1 , wherein the at least one mineral filler (d) is capable of chemically reacting with water.

3. The method according to claim 1 , wherein the composition comprises the at least one component (e) in an amount of from 0.1 to 20 wt. % relative to the total weight of the composition.

4. The method according to claim 1 , wherein the composition comprises the at least one mineral filler (d) in an amount of from 0.5 to 50 wt. % relative to the total weight of the composition.

5. The method according to claim 1 , wherein the at least one component (e) is a compound according to formula (I)

(R 1 ) n -A-B—C—(R 2 ) m   (formula (I))

wherein

R 1 is linear or branched alkyl,

R 2 is an epoxy moiety

A, B, C are different or the same and are linear or branched alkyl, alkoxy, alkene, alkyne, phenyl, phenoxy, carboxy and are optionally substituted with linear or branched alkyl, alkoxy, alkene, alkine, phenyl, phenoxy and carboxy;

n is 1, 2, or 2;

m is 1, 2, or 3.

6. The method according to claim 5 , wherein the at least one component (e) is a glycidyl ether.

7. The method according to claim 1 , which provides an overlap shear strength according to DIN EN 1465 of at least 21 MPa at −40° C. and/or of at least 17 MPa at 23° C. and/or at least 11 MPa at 80° C.

8. The method according to claim 1 , which provides a T-peel strength according to ASTM D1876 of at least 165 N.

9. The method according to claim 1 , which provides a drop of overlap shear strength according to DIN EN 1465 after cataplasma conditions of 30% or less.

10. The method according to claim 1 , wherein the mineral filler (d) is selected from the group consisting of MgO, CaO, BaO, K 2 O, Li 2 O, Na 2 O, SrO, and mixtures thereof.

11. The method according to claim 10 , wherein the composition comprises the at least one component (e) in an amount of from 0.1 to 20 wt.-% relative to the total weight of the composition.

12. The method according to claim 11 , wherein the composition comprises the at least one mineral filler (d) in an amount of from 0.5 to 50 wt.-% relative to the total weight of the composition.

13. The method according to claim 12 , which provides a T-peel strength according to ASTM D1876 of at least 165 N.

14. The method according to claim 13 , which provides a drop of overlap shear strength according to DIN EN 1465 after cataplasma conditions of 30% or less.

15. The method according to claim 1 , wherein the epoxy curing agent is a latent curing agent.

16. The method according to claim 1 , wherein the epoxy curing agent is selected from the group of compounds consisting of aliphatic amines, aromatic tertiary amines, boron complexes, imidazoles, guanidines, dicyanodiamide, substituted ureas, acid anhydrides, polyamines, mercaptans, phenols, encapsulated amines and mixtures thereof.

17. The method according to claim 1 , wherein the epoxy curing agent is selected from the group consisting of amines, acid anhydrides, guanidines, dicyandiamide, substituted ureas and mixtures thereof.