Environmental sensor and manufacturing method thereof
An environmental sensor and manufacturing method thereof. The environmental sensor comprises: a substrate comprising at least one recess disposed at an upper portion of the substrate; and a sensitive film layer disposed above the substrate, comprising a fixed portion fixed on an end surface of the substrate and a bent portion configured to extend inside the recess. The bent portion and a side wall of the recess form a capacitor configured to detect a signal. The bent portion, fixed portion, and the recess form a closed cavity. A conventional capacitive structure configured on a substrate surface is changed to a capacitive structure of the environmental sensor vertically extending into the inside of the substrate, increasing a depth of the recess, and in turn, increasing a sensing area between two polar plates of the capacitor, significantly shrinking a coverage area of the capacitor on the substrate, and satisfying a requirement of a modern compact electronic component.
1. An environmental sensor comprising:
a base material ( 1 ), wherein the upper end of the base material ( 1 ) is provided with at least one groove ( 1 a ); and
a sensitive film layer ( 3 ) on the base material ( 1 ), the sensitive film layer ( 3 ) comprises a fixed part ( 3 b ) fixed on the end surface of the base material ( 1 ) and a bending part ( 3 a ) extending into the groove ( 1 a ), the bending part ( 3 a ) and the side wall of the groove ( 1 a ) form a capacitor configured for signal detection;
wherein:
the bending part ( 3 a ), the fixed part ( 3 b ) and the groove ( 1 a ) form an airtight cavity, and
the sensitive film layer ( 3 ) further comprises a connecting part ( 3 d ) connected to two adjacent bending parts ( 3 a ), and the connecting part ( 3 d ) is suspended above the end surface of the base material ( 1 ).
2. The environmental sensor according to claim 1 , wherein the bending part ( 3 a ) is suspended in the groove ( 1 a ).
3. The environmental sensor according to claim 1 , wherein the bottom end of the bending part ( 3 a ) is fixed on the bottom end of the groove ( 1 a ) by a first sacrificial layer ( 2 ).
4. The environmental sensor according to claim 1 , wherein the connecting part ( 3 d ) is further provided with a hollow ( 3 c ), and the two adjacent bending parts ( 3 a ) are insulated by the hollow ( 3 c ); and the environmental sensor further comprises a second sacrificial layer ( 4 ) filling the hollow ( 3 c ).
5. An environmental sensor comprising:
a base material ( 1 ), wherein the upper end of the base material ( 1 ) is provided with at least one groove ( 1 a );
a fixed film layer ( 8 ) at least disposed on the side wall of the groove ( 1 a ) of the base material ( 1 ) by an insulating layer; and
a sensitive film layer ( 3 ) on the base material ( 1 ), the sensitive film layer ( 3 ) comprises a fixed part ( 3 b ) fixed on the end surface of the base material ( 1 ) and a bending part ( 3 a ) extending into the groove ( 1 a ), the bending part ( 3 a ) and the side wall of the fixed film layer ( 8 ) form a capacitor configured for signal detection;
wherein:
the bending part ( 3 a ), the fixed part ( 3 b ) and the groove ( 1 a ) form an airtight cavity, and
the sensitive film layer ( 3 ) further comprises a connecting part ( 3 d ) connected to two adjacent bending parts ( 3 a ), and the connecting part ( 3 d ) is suspended above the end surface of the base material ( 1 ).
6. The environmental sensor according to claim 5 , wherein the bending part ( 3 a ) is suspended in the groove ( 1 a ).
7. The environmental sensor according to claim 5 , wherein the bottom end of the bending part ( 3 a ) is fixed on the bottom end of the groove ( 1 a ) by a first sacrificial layer ( 2 ).
8. The environmental sensor according to claim 5 , wherein the connecting part ( 3 d ) is further provided with a hollow ( 3 c ), the two adjacent bending parts ( 3 a ) are insulated by the hollow ( 3 c ), and the environmental sensor further comprises a second sacrificial layer ( 4 ) filling the hollow ( 3 c ).
9. A manufacturing method for an environmental sensor, the method comprising:
a) etching a groove ( 1 a ) in the upper end surface of a base material ( 1 ), and depositing a first sacrificial layer ( 2 ) on the upper end surface of the base material ( 1 ) and the inner wall of the groove ( 1 a );
b) depositing a sensitive film layer ( 3 ) on the first sacrificial layer ( 2 ), wherein the sensitive film layer ( 3 ) comprises a fixed part ( 3 b ) fixed on the end surface of the base material ( 1 ) and a bending part ( 3 a ) extending into the groove ( 1 a );
c) etching the sensitive film layer ( 3 ) on the end surface of the base material ( 1 ) to form a hollow ( 3 c );
d) at least corroding the first sacrificial layer ( 2 ) located between the bending part ( 3 a ) and the side wall of the groove ( 1 a ) by the hollow ( 3 c );
e) depositing a second sacrificial layer ( 4 ) on the sensitive film layer ( 3 ), wherein the second sacrificial layer ( 4 ) seals the hollow ( 3 c ); and
f) corroding the second sacrificial layer ( 4 ) located on the bending part ( 3 a ).
10. The manufacturing method according to claim 9 , wherein, between the step e) and the step f), the method further comprises etching the positions on the second sacrificial layer ( 4 ) on both sides of the hollow ( 3 c ) to form a side wall groove ( 4 a ), and depositing a protective layer ( 5 ) on the upper end of the second sacrificial layer ( 4 ), wherein the protective layer ( 5 ) is filled in the side wall groove ( 4 a ).
11. The manufacturing method according to claim 9 , wherein in the step d), the first sacrificial layer ( 2 ) between the bending part ( 3 a ) and the groove ( 1 a ) is completely corroded, such that the bending part ( 3 a ) is suspended in the groove ( 1 a ).
12. The manufacturing method according to claim 9 , wherein, before the first sacrificial layer ( 2 ) is deposited in the step a), the method further comprises depositing a third sacrificial layer ( 7 ) and a fixed film layer ( 8 ) on the inner wall of the groove ( 1 a ) in sequence.
13. The manufacturing method according to claim 9 , wherein the bending part ( 3 a ) comprises at least two bending parts ( 3 a ), the sensitive film layer ( 3 ) further comprises a connecting part ( 3 d ) connected to two adjacent of the bending parts ( 3 a ), and the connecting part ( 3 d ) is suspended above the end surface of the base material ( 1 ).
14. The manufacturing method according to claim 13 , wherein the two adjacent bending parts ( 3 a ) are insulated by the hollow ( 3 c ).