Molded photosensitive assembly for array imaging module for electronic device
An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units coupled at the chip coupling area of the circuit board, at least two lead wires electrically connected the photosensitive units at the chip coupling area of the circuit board, and a mold sealer which includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
1. A molded photosensitive assembly for an array imaging module comprising at least two optical lenses, comprising:
at least a circuit board having one or more electronic elements electrically coupled at said circuit board;
at least two photosensitive units electrically coupled at said circuit board, wherein each of said photosensitive units has a photosensitive area and a non-photosensitive encircling said photosensitive area; and
a molded base integrally molded at said circuit board to integrally and sealedly embed and enclose said electronic elements and said connecting elements therein to form an integrated body, wherein said molded base has at least two optical windows formed therein to communicate and align with said at least two photosensitive units respectively to define at least two photosensitive paths for said at least two photosensitive units respectively, wherein each of said optical windows is configured to have a tapered size that a cross section of said optical window is gradually increased from bottom to top, wherein said at least two optical windows form at least two light channels through said photosensitive units and the optical lenses respectively, wherein said top side of said molded base is molded to have at least one flat outer lateral top surface and at least one flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base; and
at least one light filter, which is coupled at a top side of said molded base and positioned above said light window and said photosensitive unit, wherein said at least one light filter is coupled at said inner lateral top surface within said indention slot of said top side of said molded base and positioned above said light window and said photosensitive unit, wherein said light filter, said molded base and said circuit board form a sealed enclosure for said photosensitive unit.
2. The molded photosensitive assembly, as recited in claim 1 , wherein said molded base further comprises at least a blocking protrusion protruded from said top side thereof, wherein said blocking protrusion is a partition wall protruded between said respective inner lateral top surface and said respective outer lateral top surface for blocking adhesive applied on said outer lateral top surface of said molded base to adhere the respective optical lens from entering into said inner lateral top surface.
3. A molded photosensitive assembly for an array imaging module comprising at least two optical lenses, comprising:
at least a circuit board having one or more electronic elements electrically coupled at said circuit board;
at least two photosensitive units electrically coupled at said circuit board, wherein each of said photosensitive units has a photosensitive area and a non-photosensitive encircling said photosensitive area; and
a molded base integrally molded at said circuit board to integrally and sealedly embed and enclose said electronic elements and said connecting elements therein to form an integrated body, wherein said molded base has at least two optical windows formed therein to communicate and align with said at least two photosensitive units respectively to define at least two photosensitive paths for said at least two photosensitive units respectively, wherein each of said optical windows is configured to have a tapered size that a cross section of said optical window is gradually increased from bottom to top, wherein said at least two optical windows form at least two light channels through said photosensitive units and the optical lenses respectively;
at least one light filter, which is coupled at a top side of said molded base and positioned above said light window and said photosensitive unit; and
an enclosing film provided at a mold engaging surface of said circuit board that is substantially the surface being molded by said molded base on said circuit board, so that when a first mold body and a second mold body are coupled with each other in a mold closing state, said enclosing film is sandwiched between said mold engaging surface of said first mold body and said circuit board to prevent said first mold body from direct contacting with said circuit board so as to provide a buffering and sealing effect between said mold engaging surface and said circuit board to ensure a sealing engagement that prevents a fluid state mold material flowing to said coupling areas of said circuit board and ensures a flatness of said coupling areas of said circuit board.
4. The molded photosensitive assembly, as recited in claim 3 , wherein said circuit board has at least a receiving chamber and said photosensitive unit is received in said receiving chamber.
5. The molded photosensitive assembly, as recited in claim 4 , wherein said receiving chamber is a receiving through hole and said photosensitive unit is disposed in aid receiving chamber, wherein said circuit board further comprises an reinforcing layer coupled at a bottom side of said circuit board.
6. The molded photosensitive assembly, as recited in claim 4 , wherein said circuit board is one of a rigid-flex combination board, ceramic substrate, a rigid PCB board, and FPC and said injection molding material is nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, or the combination of above.
7. The molded photosensitive assembly, as recited in claim 5 , wherein said circuit board is one of a rigid-flex combination board, ceramic substrate, a rigid PCB board, and FPC and said injection molding material is nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, or the combination of above.
8. A molded photosensitive assembly for an array imaging module comprising at least two optical lenses, comprising:
at least a circuit board having one or more electronic elements electrically coupled at said circuit board;
at least two photosensitive units electrically coupled at said circuit board, wherein each of said photosensitive units has a photosensitive area and a non-photosensitive encircling said photosensitive area; and
a molded base integrally molded at said circuit board to integrally and sealedly embed and enclose said electronic elements and said connecting elements therein to form an integrated body, wherein said molded base has at least two optical windows formed therein to communicate and align with said at least two photosensitive units respectively to define at least two photosensitive paths for said at least two photosensitive units respectively, wherein each of said optical windows is configured to have a tapered size that a cross section of said optical window is gradually increased from bottom to top, wherein said at least two optical windows form at least two light channels through said photosensitive units and the optical lenses respectively, wherein said top side of said molded base is molded to have at least one flat outer lateral top surface and at least one flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base;
at least one light filter, which is coupled at a top side of said molded base and positioned above said light window and said photosensitive unit; and
an enclosing film provided at a mold engaging surface of said circuit board that is substantially the surface being molded by said molded base on said circuit board, so that when a first mold body and a second mold body are coupled with each other in a mold closing state to form said molded base, said enclosing film is sandwiched between said mold engaging surface of said first mold body and said circuit board to prevent said first mold body from direct contacting with said circuit board so as to provide a buffering and sealing effect between said mold engaging surface and said circuit board to ensure a sealing engagement that prevents a fluid state mold material flowing to said coupling areas of said circuit board and ensures a flatness of said coupling areas of said circuit board.