DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
A display device and a method of manufacturing the same are provided. A display device includes: a plastic substrate including: a display portion including organic light emitting diodes, and a pad portion including chip-on-films, a lower protective member attached to an entire lower surface of the plastic substrate, and an upper protective member attached to an upper surface of the plastic substrate, the upper protective member covering at least the display portion and both edges of the pad portion.
1 . A display device, comprising:
a plastic substrate comprising:
a display portion comprising organic light emitting diodes; and
a pad portion comprising chip-on-films;
a lower protective member attached to an entire lower surface of the plastic substrate; and
an upper protective member attached to an upper surface of the plastic substrate, the upper protective member covering at least the display portion and both edges of the pad portion.
2 . The display device of claim 1 , wherein at least one side of the upper protective member ends coincidentally with at least one side of the plastic substrate.
3 . The display device of claim 1 , wherein the upper protective member comprises first protrusions covering both edges of the pad portion.
4 . The display device of claim 3 , wherein the upper protective member comprises second protrusions extended between the chip-on-films.
5 . The display device of claim 1 , wherein at least one side of the upper protective member and at least one side of the lower protective member protrude to the outside of at least one side of the plastic substrate.
6 . The display device of claim 5 , wherein the upper protective member and the lower protective member protruding to the outside of at least one side of the plastic substrate are attached to each other.
7 . The display device of claim 5 , wherein the upper protective member comprises third protrusions covering both edges of the pad portion.
8 . The display device of claim 7 , wherein the upper protective member comprises fourth protrusions extended between the chip-on-films.
9 . The display device of claim 5 , wherein the lower protective member comprises fifth protrusions covering both edges of the pad portion.
10 . The display device of claim 9 , wherein the lower protective member comprises sixth protrusions extended between the chip-on-films.
11 . The display device of claim 1 , further comprising a resin layer covering the chip-on-films on the pad portion and the pad portion.
12 . A method of manufacturing a display device, comprising:
providing a plastic substrate comprising:
providing a display portion comprising organic light emitting diodes;
providing a pad portion;
attaching chip-on-films to the pad portion;
attaching a lower protective member to an entire lower surface of the plastic substrate; and
attaching an upper protective member to an upper surface of the plastic substrate, the upper protective member covering at least the display portion and both edges of the pad portion.
13 . The method of claim 12 , wherein at least one side of the upper protective member ends coincidentally with at least one side of the plastic substrate.
14 . The method of claim 12 , wherein the attaching the upper protective member comprises providing first protrusions covering both edges of the pad portion.
15 . The method of claim 14 , wherein the attaching the upper protective member comprises providing second protrusions extended between the chip-on-films.
16 . The method of claim 12 , wherein at least one side of the upper protective member and at least one side of the lower protective member protrude to the outside of at least one side of the plastic substrate.
17 . The method of claim 16 , wherein the upper protective member and the lower protective member protruding to the outside of at least one side of the plastic substrate are attached to each other.
18 . The method of claim 16 , wherein the attaching the upper protective member comprises providing third protrusions covering both edges of the pad portion.
19 . The method of claim 18 , wherein the attaching the upper protective member comprises providing fourth protrusions extended between the chip-on-films.
20 . The method of claim 16 , wherein the attaching the lower protective member comprises providing fifth protrusions covering both edges of the pad portion.
21 . The method of claim 20 , wherein the attaching the lower protective member comprises providing sixth protrusions extended between the chip-on-films.
22 . The method of claim 12 , further comprising covering the chip-on-films on the pad portion and the pad portion with a resin layer.