IP Library › Granted Patent US 10,020,107
Granted Patent B1
US 10,020,107 · App. 15/787,228 · Granted Jul 10, 2018

Hybrid inductor

Inventors: Jeong Hae Kim (Suwon-si, KR); Seong Jong Cheon (Suwon-si, KR); Sung Jae Yoon (Suwon-si, KR); Se Jong Kim (Suwon-si, KR)
Assignee: Samsung Electro-Mechanics Co., Ltd.
H01F27/006H01F27/2804H01F27/292H05K1/182H01F2027/2809
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Quick Facts
Patent No.
US 10,020,107
App. No.
15/787,228
Granted
Jul 10, 2018
Kind
B1
Abstract

A hybrid inductor includes a board, a first inductor provided in the board and including conductive patterns disposed at different heights, and a second inductor mounted on the board and an end of the second inductor being connected to the conductive patterns. Since mutual inductance is generated, inductance higher than a capacity value of a single inductor may be obtained.

Claims (19)

1. A hybrid inductor comprising: a board; a first inductor provided in the board and comprising conductive patterns disposed at different heights; and a second inductor mounted on the board and an end of the second inductor being connected to the conductive patterns.

2. The hybrid inductor of claim 1 , wherein the conductive patterns form a first coil member.

3. The hybrid inductor of claim 2 , wherein the second inductor comprises a second coil member within a ceramic body.

4. The hybrid inductor of claim 3 , wherein the second coil member is concentric with the first coil member.

5. The hybrid inductor of claim 4 , wherein a winding direction of the first coil member and a winding direction of the second coil member are same.

6. The hybrid inductor of claim 4 , wherein each conductive pattern of the conductive patterns comprise a coil turn on a layer, and the conductive patterns are connected to each other by a connection conductor penetrating through an insulating layer.

7. The hybrid inductor of claim 3 , wherein a central axial line of the second coil member is offset from and parallel to a central axial line of the first coil member.

8. The hybrid inductor of claim 7 , wherein a winding direction of the first coil member and a winding direction of the second coil member are same.

9. The hybrid inductor of claim 7 , wherein the conductive patterns are linearly formed on a first layer and are spaced apart from each other, and the conductive patterns formed on the first layer are connected to other conductive patterns formed on a second layer by a connection conductor penetrating through an insulating layer.

10. The hybrid inductor of claim 1 , further comprising: a connection pad provided on a surface of the board and the second inductor being mounted on the connection pad.

11. The hybrid inductor of claim 10 , further comprising: an electronic component mounted on the board.

12. The hybrid inductor of claim 3 , wherein the second coil member comprises stacked conductive patterns and conductive vias connecting the stacked conductive patterns.

13. The hybrid inductor of claim 12 , wherein the stacked conductive patterns are connected in parallel.

14. The hybrid inductor of claim 12 , wherein the stacked conductive patterns are connected in series.

15. The hybrid inductor of claim 12 , wherein each stacked conductive pattern of the stacked conductive patterns comprise a conductive metal having a preset thickness being disposed in a ceramic layer.

16. A hybrid inductor comprising: a board-type inductor comprising conductive patterns that are disposed at different heights of the board; and a surface-mounted device type inductor mounted on the board type inductor and having an end connected to the conductive patterns, wherein the board type inductor is embedded in a board.

17. The hybrid inductor of claim 16 , wherein a coil member of the surface-mounted device type inductor is disposed to be concentric with a coil member of the board type inductor.

18. The hybrid inductor of claim 17 , wherein the coil member of the surface-mounted device type inductor and the coil member of the board type inductor each have a solenoid structure, and a central axial line of the coil member of the surface-mounted device type inductor is parallel to a central axial line of the coil member of the board type inductor.

19. The hybrid inductor of claim 16 , wherein the board type inductor is mounted on a board.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2017
From: KIM, JEONG HAE; CHEON, SEONG JONG; YOON, SUNG JAE; KIM, SE JONG
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 043896/0348 →
Priority Claims (1)
KR 10-2017-0003424 · Jan 10, 2017 · national
Cited By (1)
US 12,191,932