Flip-chip beamforming integrated circuit with integral thermal mass
A beamforming integrated circuit system for use in a phased array has a microchip with RF circuitry, a bottom surface, and a plurality of interfaces electrically connected with the RF circuitry. The plurality of interfaces includes a plurality of static interfaces and a plurality of RF interfaces. The plurality of static interfaces are on the bottom surface of the microchip and adjacent to each other. The plurality of RF interfaces are also on the bottom surface of the microchip, but radially outward of the plurality of static interfaces. The microchip is configured to be flip chip mounted.
1. A beamforming integrated circuit system for use in a phased array, the integrated circuit system comprising:
a microchip having radio frequency (RF) circuitry, a bottom surface, and a plurality of interfaces, at least one of the plurality of interfaces electrically connected with the RF circuitry, the plurality of interfaces including a plurality of static interfaces and a plurality of RF interfaces; and
a heat sink conductively thermally coupled with the plurality of static interfaces of the microchip,
the plurality of static interfaces being on the bottom surface of the microchip and adjacent to each other,
the plurality of RF interfaces being on the bottom surface of the microchip and radially outward of the plurality of static interfaces,
the microchip being configured to be flip chip mounted; and
a material ring circumscribing the static interfaces and the RF interfaces, and a plurality of RF ground paths coupled with the material ring.
2. The beamforming integrated circuit system as defined by claim 1 wherein the plurality of static interfaces forms a two dimensional array of static interfaces.
3. The beamforming integrated circuit system as defined by claim 1 wherein the microchip has an edge, the plurality of RF interfaces being between the edge and the plurality of static interfaces.
4. The beamforming integrated circuit system as defined by claim 3 wherein the plurality of RF interfaces are adjacent to the edge of the microchip.
5. The beamforming integrated circuit system as defined by claim 1 wherein the plurality of static interfaces comprises a plurality of ground interfaces.
6. The beamforming integrated circuit system as defined by claim 1 wherein the plurality of static interfaces comprises a plurality of power interfaces.
7. The beamforming integrated circuit system as defined by claim 1 wherein the plurality of RF interfaces circumscribe the plurality of static interfaces.
8. The beamforming integrated circuit system as defined by claim 1 further comprising a first ground interface and a second ground interface, the plurality of RF interfaces including a given RF interface with a first side and a second side, the first ground interface being adjacent to the first side of the given RF interface, the second ground interface being adjacent to the second side of the given RF interface.
9. The beamforming integrated circuit system as defined by claim 1 further comprising a printed circuit board with a top surface having an exposed metal layer conductively thermally coupled to a plurality of vias, the microchip being flip-chip mounted to the printed circuit board onto the exposed metal layer to couple the plurality of ground interfaces with the plurality of vias in the printed circuit board.
10. The beamforming integrated circuit system as defined by claim 9 wherein the heat sink is coupled with the printed circuit board and conductively thermally coupled with the plurality of static interfaces of the microchip through the plurality of vias, the exposed metal layer forming a thermal mass to conduct heat from the microchip toward the heat sink.
11. The beamforming integrated circuit system as defined by claim 1 wherein the microchip has an edge, further wherein all RF interfaces on the microchip are adjacent to the edge of the microchip.
12. The beamforming integrated circuit system as defined by claim 1 wherein the RF circuitry operates at between about 5 GHz and 300 GHz.
13. A beamforming system comprising:
a printed circuit board with a top surface having a metal layer, the printed circuit board also having a plurality of vias conductively thermally coupled with the metal layer;
a microchip having high frequency radio frequency (RF) circuitry, an edge, and a bottom surface, the microchip being flip-chip mounted with the top surface of the printed circuit board; and
a heat sink coupled with the printed circuit board,
the bottom surface of the microchip having a plurality of interfaces, at least one of the plurality of interfaces electrically connected with the RF circuitry, the plurality of interfaces including a plurality of static interfaces and a plurality of RF interfaces, the plurality of RF interfaces electrically connected with the RF circuitry,
the plurality of static interfaces being adjacent to each other,
the plurality of RF interfaces being adjacent to the edge of the microchip,
the plurality of static interfaces being conductively thermally coupled with the RF circuitry, the metal layer, and the plurality of vias, and
the heat sink being conductively thermally coupled with the plurality of static interfaces of the microchip through the plurality of vias in the printed circuit board;
the beamforming system further comprising a material ring circumscribing the static interfaces and the RF interfaces, and a plurality of RF ground paths coupled with the material ring.
14. The beamforming system as defined by claim 13 wherein the plurality of static interfaces forms a two dimensional array of static interfaces.
15. The beamforming system as defined by claim 13 wherein the plurality of static interfaces comprises a plurality of ground interfaces or power interfaces.
16. The beamforming system as defined by claim 13 wherein the plurality of RF interfaces circumscribe the plurality of static interfaces.
17. The beamforming system as defined by claim 13 wherein all RF interfaces on the microchip are adjacent to the edge of the microchip.
18. A method of forming a radio frequency (RF) beamforming system comprising:
providing a printed circuit board with a top surface having a metal layer, the printed circuit board also having a plurality of vias conductively thermally coupled with the metal layer; and
flip-chip mounting a microchip on the printed circuit board, the microchip having high frequency RF circuitry, an edge, and a bottom surface, the bottom surface of the microchip having a plurality of interfaces, at least one of the plurality of interfaces electrically connected with the RF circuitry, the plurality of interfaces including a plurality of static interfaces and a plurality of RF interfaces, the microchip having a material ring circumscribing the static interfaces and the RF interfaces, and a plurality of RF ground paths coupled with the material ring; and
coupling a heat sink to the printed circuit board to be conductively thermally coupled with the plurality of static interfaces of the microchip through the plurality of vias in the printed circuit board,
the plurality of static interfaces being adjacent to each other,
the plurality of RF interfaces being adjacent to the edge of the microchip,
flip-chip mounting comprising conductively thermally coupling the plurality of static interfaces with the RF circuitry, the metal layer, and the plurality of vias to form a conductive thermal path configured to conduct heat from the microchip during use.
19. The method as defined by claim 18 wherein the plurality of static interfaces forms a two dimensional array of static interfaces.
20. The method as defined by claim 18 wherein the plurality of static interfaces comprises a plurality of ground interfaces or power interfaces.