Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package
Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application. The light emitting device package includes: a flip-chip type light emitting device having a first terminal and a second terminal installed therebeneath; a substrate having a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side thereof; a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device; a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device; a reflection encapsulant molded and installed on the substrate so as to form a reflection cup part reflecting light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part; and a filler filled between the reflection cup part and the first and second conductive bonding members.
1. A light emitting device package comprising:
a light emitting device including a first terminal and a second terminal;
a substrate including a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side of the electrode separating space;
a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device;
a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device; and
a reflection encapsulant installed on the substrate so as to form a reflection cup part configured to reflect light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part,
wherein a height of the first terminal from the bottom of the substrate is the same as a height of the second terminal from the bottom of the substrate, and the electrode separating part has a height higher than that of the substrate, and
wherein the first terminal of the light emitting device includes:
a reinforcing metal layer installed to be close to the light emitting device and formed of a conductive material; and
a buffering metal layer installed beneath the reinforcing metal layer and formed of a conductive material, and contacted with the first conductive bonding member.
2. The light emitting device package of claim 1 , wherein a height of the first conductive bonding member is the same as that of the second conductive bonding member.
3. The light emitting device package of claim 1 , wherein a height of the first terminal is the same as that of the second terminal.
4. The light emitting device package of claim 1 , wherein the centers of the light emitting device and the electrode separating part coincide.
5. The light emitting device package of claim 1 , further comprising:
a filler filled between the reflection cup part and the first and second conductive bonding members.
6. The light emitting device package of claim 5 , wherein the filler is filled between the bottom of the light emitting device and the top of the electrode separating part.
7. The light emitting device package of claim 1 , wherein a volume of the first conductive bonding member is the same as that of the second conductive bonding member.
8. The light emitting device package of claim 1 , wherein a height of the electrode separating part has a height smaller than those of the first and second electrodes.
9. The light emitting device package of claim 1 , wherein a height of the electrode separating part has a height smaller than those of the first and second conductive bonding members.
10. The light emitting device package of claim 1 , wherein the reflection encapsulant has a coefficient of thermal expansion that is in 80% of a coefficient of thermal expansion of the first and second electrodes.
11. The light emitting device package of claim 1 , wherein the buffering metal layer includes a thermal stress alleviating protrusion formed thereon or a thermal stress alleviating groove part installed therein.
12. The light emitting device package of claim 1 , wherein the buffering metal layer includes a thermal stress alleviating rugged surface formed thereon.
13. A backlight unit comprising:
a light emitting device including a first terminal and a second terminal;
a substrate including a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side of the electrode separating space;
a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device;
a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device;
a reflection encapsulant installed on the substrate so as to form a reflection cup part configured to reflect light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part; and
a light guide plate installed in a light path of the light emitting device,
wherein a height of the first terminal from the bottom of the substrate is the same as a height of the second terminal from the bottom of the substrate, and the electrode separating part has a height higher than that of the substrate, and
wherein the first terminal of the light emitting device includes:
a reinforcing metal layer installed to be close to the light emitting device and formed of a conductive material; and
a buffering metal layer installed beneath the reinforcing metal layer and formed of a conductive material, and contacted with the first conductive bonding member.
14. The backlight unit of claim 13 , wherein a height of the first conductive bonding member is the same as that of the second conductive bonding member.
15. The backlight unit of claim 13 , wherein a height of the first terminal is the same as that of the second terminal.
16. The backlight unit of claim 13 , wherein the centers of the light emitting device and the electrode separating part coincide.
17. The backlight unit of claim 13 , further comprising:
a filler filled between the reflection cup part and the first and second conductive bonding members.
18. The backlight unit of claim 13 , wherein a volume of the first conductive bonding member is the same as that of the second conductive bonding member.
19. The backlight unit of claim 13 , wherein a height of the electrode separating part has a height smaller than those of the first and second electrodes.
20. The backlight unit of claim 13 , wherein a height of the electrode separating part has a height smaller than those of the first and second conductive bonding members.