Semiconductor device and manufacturing method thereof
A semiconductor device includes a substrate, a liner, and an epitaxy structure. The substrate has a recess. The liner is disposed in the recess. The liner is denser than the substrate. The epitaxy structure is disposed in the recess. The liner is disposed between the epitaxy structure and the substrate.
1. A semiconductor device, comprising:
a substrate comprising silicon;
an epitaxy structure in the substrate;
an isolation structure in the substrate and having a sidewall facing the epitaxy structure;
a gate stack adjacent the epitaxy structure;
a spacer on a sidewall of the gate stack;
a silicide region over the epitaxy structure and in contact with the spacer; and
a liner in contact with the silicide region and between the substrate and the epitaxy structure, wherein the liner includes silicon denser than that in the substrate, the sidewall of the isolation structure facing the epitaxy structure has a first portion in contact with the liner and a second portion over the first portion, the second portion is free from coverage by the liner, and the epitaxy structure is spatially separated from the spacer.
2. The semiconductor device of claim 1 , wherein the liner defines at least one round corner.
3. The semiconductor device of claim 2 , wherein a radius of curvature of the round corner is about 20 nm to about 60 nm.
4. The semiconductor device of claim 1 , wherein the gate stack is over the substrate, and the liner is between the gate stack and the epitaxy structure.
5. The semiconductor device of claim 4 , wherein the epitaxy structure is arranged between the isolation structure and the gate stack.
6. The semiconductor device of claim 4 , wherein the substrate has a doped region between the epitaxy structure and the gate stack.
7. The semiconductor device of claim 1 , wherein the liner and the substrate are made of substantially the same material.
8. A semiconductor device, comprising:
a substrate;
a liner in the substrate;
an isolation structure in the substrate;
an epitaxy structure over the liner and in contact with the isolation structure;
a gate stack over the substrate; and
a spacer on a sidewall of the gate stack, wherein the epitaxy structure is spatially separated from the spacer by the liner and the liner includes an outer surface and an inner surface that has less number of corners than the outer surface thereof.
9. The semiconductor device of claim 8 , wherein the epitaxy structure has a top portion that extends from the liner and protrudes above a top surface of the substrate.
10. The semiconductor device of claim 9 , wherein the epitaxy structure further has a bottom portion between the top portion and the substrate, and the bottom and top portions of the epitaxy structure are made from a same material.
11. The semiconductor device of claim 9 , wherein the epitaxy structure further has a bottom portion between the top portion and the substrate, and the bottom and top portions of the epitaxy structure have a same lattice constant.
12. The semiconductor device of claim 8 , further comprising a silicide region over the epitaxy structure and in contact with the spacer.
13. The semiconductor device of claim 12 , wherein the epitaxy structure is between the silicide region and the liner.
14. The semiconductor device of claim 8 , wherein the outer surface and the inner surface of the liner are in contact with the substrate and the epitaxy structure, respectively.
15. A semiconductor device, comprising:
a substrate;
an epitaxy structure in the substrate;
an isolation structure in the substrate;
a liner between the substrate and the epitaxy structure;
a gate stack over the substrate;
a spacer on a sidewall of the gate stack; and
a silicide region over the epitaxy structure and in contact with the isolation structure, the liner, and the spacer, wherein an interface between the liner and the silicide region is level with a bottom surface of the spacer.
16. The semiconductor device of claim 15 , wherein an inner surface of the liner is smoother than an outer surface of the liner.
17. The semiconductor device of claim 15 , wherein the liner and the substrate are made of substantially the same material.
18. The semiconductor device of claim 15 , wherein the epitaxy structure has at least one round corner.
19. The semiconductor device of claim 15 , wherein the epitaxy structure has facets.
20. The semiconductor device of claim 15 , wherein the gate stack is over the substrate and adjacent to the epitaxy structure.