IP Library Granted Patent US 10,297,929
Granted Patent B2
US 10,297,929 · App. 15/797,942 · Granted May 21, 2019

Pane having an electrical connection element

Inventors: Klaus Schmalbuch (Goult, FR); Bernhard Reul (Herzogenrath, DE); Mitja Rateiczak (Wuerselen, DE); Lothar Lesmeister (Landgraaf, NL)
Assignee: SAINT-GOBAIN GLASS FRANCE
H01R4/187H01Q1/3291H01R4/183H01R12/53H01R12/57H05B3/84H05K1/0212H01R4/02H01R4/184H01R2201/02H01R2201/26H05B2203/016H05K2201/0323H05K2201/0326H05K2201/068Y10T29/49149
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Quick Facts
Patent No.
US 10,297,929
App. No.
15/797,942
Granted
May 21, 2019
Kind
B2
Abstract

A pane having an electrical connection element, said pane having: a substrate; an electrically conductive structure in a region of the substrate; and a connection element in a region of the electrically conductive structure, the connection element containing at least a chromium-containing steel. The connection element has a region which is crimped about a connecting cable and connected to the electrically conductive structure by means of a solder.

Claims (31)

1. A pane, comprising:

a substrate,

on a region of the substrate, an electrically conductive structure,

on a region of the electrically conductive structure, an electrical connection element that comprises at least a chromium-containing steel,

wherein the electrical connection element comprises at least 66.5 wt.-% to 89.5 wt.-% iron, 10.5 wt.-% to 20 wt.-% chromium, 0 wt.-% to 1 wt.-% carbon, 0 wt.-% to 5 wt.-% nickel, 0 wt.-% to 2 wt.-% manganese, 0 wt.-% to 2.5 wt.-% molybdenum, 0 wt.-% to 2 wt.-% niobium, and 0 wt.-% to 1 wt.-% titanium,

wherein a coefficient of thermal expansion of the connection element is from 9×10 −6 /° C. to 13×10 −6 /° C. in a temperature range from 0° C. to 300° C.,

wherein a difference between a coefficient of thermal expansion of the substrate and a coefficient of thermal expansion of the electrical connection element is less than 5×10 −6 /° C.,

wherein the electrical connection element has a region crimped around a connection cable wherein a lead-free solder material is disposed between the crimped region and the electrically conductive structure so that the crimped region of the electrical connection element is directly connected to the electrically conductive structure via the lead-free solder material, and

wherein the connection cable includes a wire conductor.

2. The pane according to claim 1 , wherein a material thickness of the electrical connection element is from 0.1 mm to 2 mm.

3. The pane according to claim 2 , wherein the material thickness of the connection element is from 0.2 mm to 1 mm.

4. The pane according to claim 2 , wherein the material thickness of the connection element is from 0.3 mm to 0.5 mm.

5. The pane according to claim 1 , wherein the electrical connection element comprises at least 77 wt.-% to 84 wt.-% iron, 16 wt.-% to 18.5 wt.-% chromium, 0 wt.-% to 0.1 wt.-% carbon, 0 wt.-% to 1 wt.-% manganese, 0 wt.-% to 1 wt.-% niobium, 0 wt.-% to 1.5 wt.-% molybdenum, and 0 wt.-% to 1 wt.-% titanium.

6. The pane according to claim 1 , wherein the substrate contains glass.

7. The pane according to claim 6 , wherein the substrate contains flat glass, float glass, quartz glass, borosilicate glass, or soda lime glass.

8. The pane according to claim 1 , wherein the electrically conductive structure contains at least silver and has a layer thickness of 5 μm to 40 μm.

9. The pane according to claim 8 , wherein the electrically conductive structure contains silver particles and glass frits.

10. The pane according to claim 1 , wherein a layer thickness of the lead-free solder material is less than or equal to 6.0×10 −4 m.

11. The pane according to claim 1 , wherein the lead-free solder material contains 35 wt.-% to 69 wt.-% bismuth, 30 wt.-% to 50 wt.-% tin, 1 wt.-% to 10 wt.-% silver, and 0 wt.-% to 5 wt.-% copper.

12. The pane according to claim 1 , wherein the lead-free solder material contains 90 wt.-% to 99.5 wt.-% tin, 0.5 wt.-% to 5 wt.-% silver, and 0 wt.-% to 5 wt.-% copper.

13. The pane according to claim 1 , wherein the electrical connection element is coated with nickel, tin, copper, or silver.

14. The pane according to claim 1 , wherein the lead-free solder material contains tin and bismuth, indium, zinc, copper, silver, or compositions thereof.

15. The pane according to claim 1 , wherein the connection element consists of the crimped region.

16. A method comprising:

applying the pane according to claim 1 , in buildings or in means of transportation for travel on land, in the air, or on water.

17. The method of claim 16 , comprising:

applying the pane in rail vehicles or motor vehicles.

18. The method of claim 16 , comprising:

applying the pane in buildings or in means of transportation as a windshield, rear window, side window, or glass roof.

19. The method of claim 16 , comprising:

applying the pane as a heatable pane or as a pane with an antenna function.

Assignments (2)
NUNC PRO TUNC ASSIGNMENT Recorded May 16, 2025
From: SAINT-GOBAIN GLASS FRANCE
To: SAINT-GOBAIN SEKURIT FRANCE
Reel/Frame 071969/0743 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2017
From: SCHMALBUCH, KLAUS; REUL, BERNHARD; RATEICZAK, MITJA; LESMEISTER, LOTHAR
To: SAINT-GOBAIN GLASS FRANCE
Reel/Frame 043986/0305 →
Priority Claims (1)
EP 12184408 · Sep 14, 2012 · regional
Continuity (2)
Continuation 14424939
Related Publication 20180048079A1 · Feb 15, 2018