Gate-all-around structure and manufacturing method for the same
Present disclosure provides gate-all-around structure including a first transistor. The first transistor includes a semiconductor substrate having a top surface, a first nanowire over the top surface of the semiconductor substrate and between a first source and a first drain, a first gate structure around the first nanowire, an inner spacer between the first gate structure and the first source and first drain, and an isolation layer between the top surface of the semiconductor substrate and the first source and the first drain. Present disclosure also provides a method for manufacturing the gate-all-around structure described herein.
1. A gate-all-around structure, comprising:
a first transistor, comprising:
a semiconductor substrate having a top surface;
a first fin extended from the semiconductor substrate;
a first nanostructure over the first fin and between a first source and a first drain, wherein the first source and the first drain are at longitudinal ends of the first nanostructure, and the first nanostructure extends above an isolation structure;
a first gate structure around the first nanostructure;
an inner spacer between the first gate structure and the first source; and
an isolation layer between the top surface of the semiconductor substrate and the first source and the first drain, wherein the isolation layer is in direct contact with an extended top surface of the first fin, and
wherein the inner spacer and the isolation layer are composed of same material, and
wherein the isolation layer is in contact with the inner spacer.
2. The structure of claim 1 , wherein the isolation layer is in contact with the first nanostructure.
3. The structure of claim 2 , wherein a distance between the top surface of the semiconductor substrate and a bottom of the first nanostructure is greater than a thickness of the inner spacer.
4. The structure of claim 2 , wherein the first nanostructure comprises silicon germanium nanostructure.
5. The structure of claim 1 , wherein the isolation layer is in contact with the first source and the first drain.
6. The structure of claim 5 , wherein the first nanostructure comprises silicon nanostructure.
7. The structure of claim 1 , further comprising:
a second transistor, comprising:
a second nanostructure over the top surface of the substrate and between a second source and a second drain;
a second gate structure around the second nanostructure,
wherein the first nanostructure and the second nanostructure are configured to allow carriers of opposite conductivity types to pass.
8. A semiconductor structure, comprising:
a transistor, comprising:
a semiconductor substrate having a top surface;
a plurality of nanostructures stacked over the top surface of the semiconductor substrate and extended above an isolation structure;
a source wrapping around the plurality of nanostructures at a longitudinal end of the plurality of nanostructures;
an inner spacer sandwiched between the each of the plurality of nanostructures and the source; and
an isolation layer in contact with the top surface of the semiconductor substrate,
wherein the isolation layer is lower than a bottom nanostructure of the plurality of nanostructures and higher than a top surface of the isolation structure, and the isolation layer is in contact with the bottom nanostructure of the plurality of nanostructures and the top surface of the semiconductor substrate, and
wherein the isolation layer is in contact with the inner spacer.
9. The semiconductor structure of claim 8 , wherein the source is separating the bottom nanostructure of the plurality of nanostructures and the isolation layer.
10. The semiconductor structure of claim 8 , wherein a distance between the top surface of the semiconductor substrate and the bottom nanostructure is greater than a thickness of the inner spacer.
11. A transistor structure, comprising:
a semiconductor substrate having a top surface;
a fin structure extended from the semiconductor substrate;
a liner formed on a sidewall of the fin structure;
a plurality of nanostructures stacked over the top surface of the semiconductor substrate;
a source wrapping around the plurality of nanostructures at a longitudinal end of the plurality of nanostructures;
an inner spacer sandwiched between the each of the plurality of nanostructures and the source; and
an isolation layer in contact with the top surface of the semiconductor substrate and the liner,
wherein the isolation layer is separating a bottom nanostructure of the plurality of nanostructures from the top surface of the semiconductor substrate, and
wherein the isolation layer is in contact with the inner spacer.
12. The transistor structure of claim 11 , wherein a distance between the top surface of the semiconductor substrate and the bottom nanostructure is greater than a thickness of the inner spacer.
13. The transistor structure of claim 11 , wherein the source is separating the bottom nanostructure of the plurality of nanostructures and the isolation layer.
14. The transistor structure of claim 1 , wherein the isolation layer is higher than a top surface of the isolation structure.
15. The transistor structure of claim 8 , further comprising:
a fin structure extended above the isolation structure; and
a liner formed on a sidewall of the fin structure, wherein the isolation layer is in direct contact with the liner.
16. The transistor structure of claim 11 , further comprising:
an etch stop layer formed on the source, wherein the isolation layer is in direct contact with the etch stop layer.
17. The transistor structure of claim 1 , further comprising:
a liner formed on a sidewall of the first fin, wherein the isolation layer is in direct contact with the liner.
18. The transistor structure of claim 1 , wherein the inner spacer has a C-shaped structure with a recessed central portion, and a portion of the source is embedded in the recessed central portion.
19. The transistor structure of claim 8 , wherein the inner spacer has a C-shaped structure with a recessed central portion, and a portion of the source is embedded in the recessed central portion.
20. The transistor structure of claim 11 , wherein the inner spacer has a C-shaped structure with a recessed central portion, and a portion of the first source is embedded in the recessed central portion.