METAL CORE THERMOELECTRIC DEVICE
A metal core thermoelectric device and a method of manufacturing such a device are provided herein. In some embodiments, a thermoelectric heat exchanger component includes a metal core circuit board and thermoelectric legs that are attached to the metal core circuit board. A top header is attached to the thermoelectric legs opposite the metal core circuit board. A top heat spreading lid is thermally connected to the top header. In this way, the thermoelectric heat exchanger component does not need the bottom header, bottom side thermal interface material, bottom side attach material, and/or bottom heat spreading lid. This may result in a significant reduction in materials and/or the processing steps required to create the thermoelectric heat exchanger component being greatly simplified. In some embodiments, at least some steps of the manufacturing may use standard surface mount technology equipment.
1 . A thermoelectric heat exchanger component, comprising:
a metal core circuit board;
a plurality of thermoelectric legs that are attached to the metal core circuit board;
a top header attached to the plurality of thermoelectric legs opposite the metal core circuit board; and
a top heat spreading lid thermally connected to the top header.
2 . The thermoelectric heat exchanger component of claim 1 further comprising:
a thermal interface material between the top header and the top heat spreading lid.
3 . The thermoelectric heat exchanger component of claim 2 wherein the thermal interface material is chosen from the group consisting of: solder and thermal grease.
4 . The thermoelectric heat exchanger component of claim 3 further comprising:
an attach material between the top heat spreading lid and the metal core circuit board.
5 . The thermoelectric heat exchanger component of claim 4 wherein the attach material between the top heat spreading lid and the metal core circuit board is chosen from the group consisting of: an epoxy and a resin.
6 . The thermoelectric heat exchanger component of claim 5 wherein the attach material between the top heat spreading lid and the metal core circuit board is able to absorb force applied to the top heat spreading lid so as to protect the plurality of thermoelectric legs.
7 . The thermoelectric heat exchanger component of claim 6 wherein the attach material between the top heat spreading lid and metal core circuit board provides a hermetic seal between the top heat spreading lid and metal core circuit board to protect the plurality of thermoelectric legs.
8 . The thermoelectric heat exchanger component of claim 7 wherein the metal core circuit board comprises:
a metal core layer;
a dielectric layer attached to the metal core layer; and
an electrically conducting layer attached to the dielectric layer opposite the metal core layer.
9 . The thermoelectric heat exchanger component of claim 8 wherein the metal core layer of the metal core circuit board is chosen from the group consisting of: aluminum and an alloy of aluminum.
10 . The thermoelectric heat exchanger component of claim 8 wherein the metal core layer of the metal core circuit board is chosen from the group consisting of: copper and an alloy of copper.
11 . The thermoelectric heat exchanger component of claim 10 wherein the dielectric layer of the metal core circuit board is a dielectric polymer layer with high thermal conductivity.
12 . A method of fabricating a thermoelectric heat exchanger component, comprising:
assembling a top header and a metal core circuit board to a plurality of thermoelectric legs; and
attaching the top header with the plurality of thermoelectric legs to a top heat spreading lid.
13 . The method of fabricating the thermoelectric heat exchanger component of claim 12 further comprising:
applying a thermal interface material between the top header and the top heat spreading lid.
14 . The method of fabricating the thermoelectric heat exchanger component of claim 13 wherein applying the thermal interface comprises applying a material chosen from the group consisting of: solder and thermal grease.
15 . The method of fabricating the thermoelectric heat exchanger component claim 14 further comprising:
applying an attach material between the top heat spreading lid and the metal core circuit board.
16 . The method of fabricating the thermoelectric heat exchanger component of claim 15 wherein applying the attach material between the top heat spreading lid and the metal core circuit board comprises applying a material chosen from the group consisting of: an epoxy and a resin.
17 . The method of fabricating the thermoelectric heat exchanger component of claim 16 wherein the attach material between the top heat spreading lid and the metal core circuit board is able to absorb force applied to the top heat spreading lid so as to protect the plurality of thermoelectric legs.
18 . The method of fabricating the thermoelectric heat exchanger component of claim 17 wherein the attach material between the top heat spreading lid and metal core circuit board provides a hermetic seal between the top heat spreading lid and the metal core circuit board to protect the plurality of thermoelectric legs.
19 . The method of fabricating the thermoelectric heat exchanger component of claim 18 wherein the metal core circuit board comprises:
a metal core layer;
a dielectric layer attached to the metal core layer; and
an electrically conducting layer attached to the dielectric layer opposite the metal core layer.
20 . The method of fabricating the thermoelectric heat exchanger component of claim 19 wherein the metal core layer of the metal core circuit board is chosen from the group consisting of: aluminum and an alloy of aluminum.
21 . The method of fabricating the thermoelectric heat exchanger component of claim 19 wherein the metal core layer of the metal core circuit board is chosen from the group consisting of: copper and an alloy of copper.
22 . The method of fabricating the thermoelectric heat exchanger component of claim 21 wherein the dielectric layer of the metal core circuit board is a dielectric polymer layer with high thermal conductivity.