IP Library Granted Patent US 10,433,447
Granted Patent B2
US 10,433,447 · App. 15/805,070 · Granted Oct 1, 2019

Interconnect structure for coupling an electronic unit and an optical unit, and optoelectronic module

Inventors: Andrei Kaikkonen (Jaerfaella, SE); Lennart Per Olof Lundqvist (Jaerfaella, SE); Lars-Goete Svensson (Vallentuna, SE); Peter Lindberg (Uppsala, SE)
Assignee: Finisar Corporation
H05K7/026G01J1/029G01J1/44H01S5/02276H01S5/0427H04B10/801H05K1/025H05K1/0216G01J2001/446G02B6/4279H01S5/06226H01S5/423H05K1/0243H05K2201/10121
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,433,447
App. No.
15/805,070
Granted
Oct 1, 2019
Kind
B2
Abstract

An optoelectronic module is provide and includes an electronic unit, an optical unit, and an interconnect structure. The electronic unit is capable of outputting and/or receiving electric signals, while the optical unit is capable of converting the electric signals into optical signals. The interconnect structure connects the electronic unit and the optical unit, and includes an electrically conducting substrate and a pair of transmission leads connecting electronic unit and the optical unit. The pair of transmission leads includes a signal lead and a ground lead having lower impedance than the signal lead.

Claims (35)

1. An optoelectronic module, comprising:

a driver circuit configured to output and/or receive an electrical signal;

a laser configured to convert the electrical signal into an optical signal;

an interconnect structure connecting the driver circuit and the laser, the interconnect structure comprising an electrically conductive substrate and a pair of transmission leads connecting the driver circuit and the laser and having a signal lead and a ground lead having lower impedance than the signal lead; and

a ground plane layer underlying the ground lead, wherein the ground lead is electrically coupled to the ground plane layer;

wherein an impedance of the signal lead is defined by its width and a distance to the ground plane layer, and the ground lead has a width that is larger than a width of the signal lead.

2. The optoelectronic module of claim 1 , wherein the ground lead has a width that is at least five times larger than the width of the signal lead.

3. The optoelectronic module of claim 1 , wherein the ground lead is electrically coupled to the ground plane layer by a via.

4. The optoelectronic module of claim 1 , wherein the signal lead is connected to an anode of the laser.

5. The optoelectronic module of claim 1 , wherein the ground lead is connected to a cathode of the laser.

6. The optoelectronic module of claim 1 , further comprising an array of lasers including the laser.

7. The optoelectronic module of claim 6 , further comprising a 12-channel laser mounted in the electrically conductive substrate.

8. The optoelectronic module of claim 1 , further comprising an optical receiver and an amplifying circuit for amplifying output signals of the optical receiver.

9. The optoelectronic module of claim 8 , wherein the optical receiver includes an array of PIN (positive intrinsic negative) photo diodes and the amplifying circuit includes a transimpedance amplifier (TIA) array.

10. The optoelectronic module of claim 1 , wherein the laser is a vertical cavity surface emitting laser (VCSEL).

11. The optoelectronic module of claim 1 , wherein a majority of a return signal is guided by the ground lead rather than the signal lead.

12. An optoelectronic module, comprising:

a driver array configured to output and/or receive electrical signals;

a laser array configured to convert the electrical signals into optical signals;

an interconnect structure connecting the driver array and the laser array, the interconnect structure comprising an electrically conductive substrate and transmission leads connecting the driver array and the laser array and having signal leads and ground leads having lower impedance than the signal leads; and

a ground plane layer underlying the ground leads, wherein the ground leads are electrically coupled to the ground plane layer;

wherein the ground leads have a width that is larger than a width of the signal leads.

13. The optoelectronic module of claim 12 , wherein the ground leads have a width that is at least five times larger than the width of the signal leads.

14. The optoelectronic module of claim 12 , wherein the ground leads are electrically coupled to the ground plane layer by vias.

15. The optoelectronic module of claim 12 , wherein each of the signal leads are connected to an anode of a laser of the laser array.

16. The optoelectronic module of claim 12 , wherein each of the ground leads are connected to a cathode of a laser of the laser array.

17. The optoelectronic module of claim 12 , the laser array comprising vertical cavity surface emitting laser (VCSEL).

18. The optoelectronic module of claim 12 , wherein the signal leads are narrower than the ground leads.

19. The optoelectronic module of claim 12 , wherein a majority of return signals are guided by the ground leads rather than adjacent signal leads.

20. An optoelectronic module, comprising:

a driver array configured to output and/or receive electrical signals;

a laser array configured to convert the electrical signals into optical signals;

an interconnect structure connecting the driver array and the laser array, the interconnect structure comprising an electrically conductive substrate and transmission leads connecting the driver array and the laser array and having signal leads and ground leads having lower impedance than the signal leads; and

a ground plane layer underlying the ground leads, wherein the ground leads are electrically coupled to the ground plane layer;

wherein the ground leads are electrically coupled to the ground plane layer by vias and the signal leads are narrower than the ground leads such that return signals are guided by the ground leads.

Assignments (6)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2018
From: KAIKKONEN, ANDREI; LUNDQVIST, LENNART PER OLOF; SVENSON, LARS-GOETE; LINDBERG, PETER
To: TYCO ELECTRONICS SVENSKA HOLDINGS AB
Reel/Frame 044686/0171 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2018
From: TYCO ELECTRONICS SVENSKA HOLDINGS AB
To: FINISAR CORPORATION
Reel/Frame 044686/0226 →
Priority Claims (1)
EP 12196474 · Dec 11, 2012 · regional
Continuity (3)
Continuation 14736462 · Jun 11, 2015
Continuation PCTEP2013075005 · Nov 28, 2013
Related Publication 20180124942A1 · May 3, 2018