IP Library Granted Patent US 10,199,998
Granted Patent B2
US 10,199,998 · App. 15/805,385 · Granted Feb 5, 2019

Method and system for a pseudo-differential low-noise amplifier at Ku-band

Inventors: Abhishek Jajoo (Carlsbad, CA); Vamsi Paidi (Carlsbad, CA)
Assignee: Maxlinear, Inc.
H03F3/45179H03F1/523H03F3/195H03F3/45188H03F2200/171H03F2200/222H03F2200/294H03F2200/336H03F2200/451H03F2203/45166H03F2203/45386H03F2203/45464
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,199,998
App. No.
15/805,385
Granted
Feb 5, 2019
Kind
B2
Abstract

Methods and systems for a pseudo-differential low-noise amplifier at Ku-band may comprise a low-noise amplifier (LNA) integrated on a semiconductor die, where the LNA includes first and second differential pair transistors with an embedded inductor tail integrated on the semiconductor die. The embedded inductor tail may include: a first inductor with a first terminal capacitively-coupled to a gate terminal of the first differential pair transistor and a second terminal of the first inductor coupled to second, third, and fourth inductors. The second inductor may be coupled to a source terminal of the first differential pair transistor, the fourth inductor may be coupled to a source terminal of the second differential pair transistor, and the third inductor may be capacitively-coupled to a gate terminal of the second differential pair transistor and also to ground. The second inductor may be embedded within the first inductor.

Claims (27)

1. A semiconductor device, the device comprising:

a low-noise amplifier (LNA) integrated on a semiconductor die, the LNA comprising a first differential pair transistor, a second differential pair transistor, and embedded inductors integrated on the semiconductor die, wherein the embedded inductors comprise:

a first inductor with a first terminal capacitively-coupled to a gate terminal of the first differential pair transistor and with a second terminal coupled to second, third, and fourth inductors, wherein the second inductor is coupled to a source terminal of the first differential pair transistor, the fourth inductor is coupled to a source terminal of the second differential pair transistor, and the third inductor is capacitively-coupled to a gate terminal of the second differential pair transistor.

2. The device according to claim 1 , wherein the second inductor is embedded within the first inductor.

3. The device according to claim 1 , wherein the fourth inductor is embedded within the third inductor.

4. The device according to claim 1 , wherein cascode transistors are coupled to drain terminals of the first and second differential pair transistors.

5. The device according to claim 4 , wherein the cascode transistors have inductive loads comprising inductors integrated on the semiconductor die.

6. The device according to claim 4 , wherein the first and second differential pair transistors and the cascode transistors comprise complementary metal-oxide semiconductor (CMOS) transistors.

7. The device according to claim 1 , wherein the first inductor is capacitively-coupled to the gate of the first differential pair transistor and the fourth inductor is capacitively-coupled to the gate of the second differential pair transistor utilizing CMOS capacitors.

8. The device according to claim 1 , wherein the LNA is operable to receive a single-ended signal and generate a differential output signal.

9. The device according to claim 1 , wherein the embedded inductors are operable to provide electro-static discharge (ESD) protection for the LNA.

10. The device according to claim 1 , wherein the semiconductor die is bonded to a packaging substrate.

11. A method for communication, the method comprising:

in a low-noise amplifier (LNA) integrated on a semiconductor die, the LNA comprising a first differential pair transistor, a second differential pair transistor, and embedded inductors integrated on the semiconductor die,

amplifying a radio frequency (RF) signal, wherein the embedded inductors comprise:

a first inductor with a first terminal capacitively-coupled to a gate terminal of the first differential pair transistor and with a second terminal coupled to second, third, and fourth inductors, wherein the second inductor is coupled to a source terminal of the first differential pair transistor, the fourth inductor is coupled to a source terminal of the second differential pair transistor, and the third inductor is capacitively-coupled to a gate terminal of the second differential pair transistor.

12. The method according to claim 11 , wherein the second inductor is embedded within the first inductor.

13. The method according to claim 11 , wherein the fourth inductor is embedded within the third inductor.

14. The method according to claim 11 , wherein cascode transistors are coupled to drain terminals of the first and second differential pair transistors.

15. The method according to claim 14 , wherein the cascode transistors have inductive loads comprising inductors integrated on the semiconductor die.

16. The method according to claim 14 , wherein the first and second differential pair transistors and the cascode transistors comprise complementary metal-oxide semiconductor (CMOS) transistors.

17. The method according to claim 11 , wherein the first inductor is capacitively-coupled to the gate of the first differential pair transistor and the fourth inductor is capacitively-coupled to the gate of the second differential pair transistor utilizing CMOS capacitors.

18. The method according to claim 17 , comprising generating a differential output signal from the received RF signal using the LNA.

19. The method according to claim 11 , comprising providing electro-static discharge (ESD) protection for the LNA utilizing the embedded inductors.

20. A semiconductor device comprising:

a low-noise amplifier (LNA) integrated on a complementary metal-oxide semiconductor (CMOS) die, the LNA comprising a first differential pair transistor, a second differential pair transistor, and embedded inductors integrated on the semiconductor die, wherein the embedded inductors comprise:

a first inductor with a first terminal capacitively-coupled to a gate terminal of the first differential pair transistor and with a second terminal coupled to second, third, and fourth inductors, wherein the second inductor is coupled to a source terminal of the first differential pair transistor, the fourth inductor is coupled to a source terminal of the second differential pair transistor, the third inductor is capacitively-coupled to a gate terminal of the second differential pair transistor, and wherein a differential output of the LNA is provided at drain terminals of cascode transistors coupled to drain terminals of the first and second differential pair transistors.

Assignments (1)
SECURITY AGREEMENT Recorded Jul 9, 2021
From: MAXLINEAR, INC.; MAXLINEAR COMMUNICATIONS, LLC; EXAR CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 056816/0089 →
Continuity (4)
Continuation 15232056 · Aug 9, 2016
Continuation 14260214 · Apr 23, 2014
Provisional Application 61815318 · Apr 24, 2013
Related Publication 20180091104A1 · Mar 29, 2018