Defect inspecting method and defect inspecting apparatus
View Patent ↗A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.
1. A defect inspecting apparatus for inspecting a surface state including a defect on a surface of a wafer, the apparatus comprising:
an illuminating optical system that irradiates a laser beam onto the surface of the wafer;
a stage that holds the wafer; and
an optical detection system that detects a scattered light by an illumination of the laser to the wafer;
a polarization filter that is divided into segments having different polarization axes;
a beam splitter that separates the scattered light into a first scattering light and a second scattering light;
a first detector that detects the first scattering light; and
a second detector that detects the second scattering light.
2. A defect inspection apparatus according to claim 1 , comprising:
a signal processor configured to execute the signal from the first detector and the second detector.
3. A defect inspection apparatus according to claim 2 , wherein the beam splitter is a polarized beam splitter.
4. A defect inspection apparatus according to claim 2 , comprising:
a display that displays a map from the result of the execution on the first scattering light or the second scattering light.
5. A defect inspecting apparatus for inspecting a surface state including a defect on a surface on a wafer the apparatus comprising:
an illuminating optical system that irradiates a laser beam onto the surface of the wafer;
a stage that holds the wafer; and
an optical detection system that detects a scattered light by an illumination of the laser to the wafer;
said optical detection system further comprising:
a polarization filter that is configured to enable or disable a polarization axis rotation;
a beam splitter that separates the scattering light into a first scattering light and a second scattering light;
a first detector that detects the first scattering light; and
a second detector that detects the second scattering light.