Component carrier with adhesion promoting shape of wiring structure

1. A component carrier, comprising:

a base structure;

an electrically conductive wiring structure on the base structure;

wherein the wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure, and a transition between the base structure and the wiring structure, and

wherein the adhesion promoting constriction is formed by a kink at the transition between the base structure and the wiring structure.

2. The component carrier according to claim 1 , comprising an electrically insulating layer structure in contact with the electrically conductive wiring structure.

3. The component carrier according to claim 1 , wherein the adhesion promoting constriction is formed by a side wall of the wiring structure.

4. The component carrier according to claim 1 , wherein the wiring structure has a first horizontal extension at a contact position with the base structure, has a second horizontal extension at an end position opposing the contact position, and has a third horizontal extension at an intermediate position between the contact position and the end position, wherein the third horizontal extension is smaller than the first horizontal extension and is smaller than the second horizontal extension.

5. The component carrier according to claim 4 , wherein the intermediate position corresponds to the constriction or to a narrowest section of the wiring structure.

6. The component carrier according to claim 1 , wherein the constriction is defined by an acute angle extending from a surface of the base structure up to a tangent on a side wall of the wiring structure, wherein the tangent on the side wall of the wiring structure corresponds to the position of the transition.

7. The component carrier according to claim 1 , comprising at least one of the following features:

wherein the constriction is formed by a trapezoidal cross-section of the wiring structure with a narrow end on the base structure;

wherein the constriction is formed by a double trapezoidal cross-section of the wiring structure with narrow ends of both trapezoids facing each another;

wherein the constriction is formed by a curved side wall of the wiring structure;

wherein the constriction is formed by a trapezoidal cross-sectional portion of the wiring structure with a wide end on the base structure and a narrow end facing a bottom end of another portion of the wiring structure with a concave side wall;

wherein the constriction is formed by a trapezoidal cross-sectional portion of the wiring structure with a wide end on the base structure and a narrow end facing a bottom end of a rectangular cross-sectional portion of the wiring structure;

wherein the wiring structure has a smooth surface;

wherein the wiring structure has a surface roughness of less than 3 μm;

wherein the adhesion promoting constriction is a mechanical feature with a dimension of at least 10 μm;

wherein the adhesion promoting constriction is designed with a ratio between a most narrow horizontal extension of the wiring structure and a widest horizontal extension of the wiring structure in a range between 40% and 95%;

wherein the wiring structure is arranged with a line/space value of less than 50 μm;

wherein the base structure comprises at least one of an electrically conductive layer structure and a dielectric layer structure;

wherein the wiring structure is configured as a conductor track extending within a horizontal plane of the component carrier.

8. The component carrier according to claim 1 , further comprising:

an electronic component mounted on and/or embedded in at least one of the base structure and the electrically insulating layer structure.

9. The component carrier according to claim 8 , comprising at least one of the following features:

wherein the electronic component is configured for executing a radio frequency application involving frequencies above 1 GHz;

wherein the electronic component is selected from a group consisting of an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a further component carrier and a logic chip.

10. The component carrier according to claim 1 , comprising at least one of the following features:

wherein at least one of the electrically conductive wiring structure and the base structure comprises at least one of the group consisting of copper, aluminum, and nickel;

wherein at least one of the electrically insulating layer structure and the base structure comprises at least one of the group consisting of resin, in particular Epoxy resin, Bismaleimide-Triazine resin, cyanate ester, glass, in particular glass fibers, prepreg material, polyimide, polyamide, polytetrafluoroethylene, liquid crystal polymer, epoxy-based Build-Up Film, FR4 material, FR5 material, a ceramic, and a metal oxide;

wherein the component carrier is shaped as a plate;

wherein the component carrier is configured as one of the group consisting of a printed circuit board, and an IC substrate;

the component carrier is configured as a laminate-type component carrier.

11. A method of manufacturing a component carrier, wherein the method comprises:

forming an electrically conductive wiring structure on a base structure;

wherein the wiring structure is formed with a nonrectangular cross-sectional shape so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure, and a transition between the base structure and the wiring structure, wherein when the adhesion promoting constriction is formed between the base structure and the wiring structure, the adhesion promoting constriction is a kink.

12. The method according to claim 11 , comprising at least one of the following features:

wherein the method further comprises forming an electrically insulating layer structure in contact with a side wall of the electrically conductive wiring structure;

wherein the constriction is formed by an anisotropic etching procedure;

wherein the constriction is formed by a subtractive process;

wherein the constriction is formed by a semi-additive process or a modified semi-additive process.

13. A method of using a wiring structure of a component carrier, the method comprising:

providing an electrically conductive wiring structure on a base structure, the wiring structure having a nonrectangular cross-sectional shape over at least a portion thereof;

forming an adhesion promoting constriction by at least one of the group consisting of the wiring structure, and a transition between the base structure and the wiring structure, wherein when the adhesion promoting constriction is formed with the transition, the adhesion promoting constriction is a kink; and

applying a radio-frequency signal to the electrically conductive wiring structure with a frequency above 1 GHz.

14. A component carrier, comprising:

a base structure;

an electrically conductive wiring structure on the base structure;

wherein the wiring structure has a non-rectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure, and a transition between the base structure and the wiring structure,

wherein the constriction comprises an undercut.