Imaging apparatus, imaging system, and moving object
An imaging apparatus includes first and second substrates respectively including first pixels and second pixels arranged thereon. The first pixels each includes a first photoelectric conversion unit and a first transistor configured to output a first signal based on a charge generated in the first photoelectric conversion unit. The second pixels each includes a second photoelectric conversion unit and a second transistor configured to output a second signal based on a charge generated in the second photoelectric conversion unit. The first and second substrates are stacked via an insulation film.
1. An imaging apparatus comprising:
a first substrate including a plurality of first pixels arranged thereon, the plurality of first pixels each including a first photoelectric conversion unit and a first transistor configured to output a first signal based on a charge generated in the first photoelectric conversion unit; and
a second substrate including a plurality of second pixels arranged thereon, the plurality of second pixels each including a second photoelectric conversion unit and a second transistor configured to output a second signal based on a charge generated in the second photoelectric conversion unit,
wherein the first substrate and the second substrate are stacked via an insulation film interposed therebetween,
wherein an orthogonal projection of the first photoelectric conversion unit onto a plane in parallel with an interface between the first substrate and the insulation film and an orthogonal projection of the second photoelectric conversion unit onto the plane at least partially overlap each other, and
wherein an input node of the first transistor and an input node of the second transistor are separated from each other.
2. The imaging apparatus according to claim 1 , further comprising:
a first output line connected to the plurality of first pixels;
a second output line connected to the plurality of second pixels; and
a signal processing circuit disposed on the second substrate and configured to process the first signal to the first output line and the second signal to the second output line.
3. The imaging apparatus according to claim 2 , wherein the signal processing circuit adds or averages the first signal and the second signal.
4. The imaging apparatus according to claim 2 , wherein the signal processing circuit outputs the first signal and the second signal to outside independently of each other.
5. The imaging apparatus according to claim 4 , wherein the first signal and the second signal are used for purposes different from each other.
6. The imaging apparatus according to claim 2 , wherein the signal processing circuit adds or averages the first signal and the second signal in a first mode, and
wherein the signal processing circuit outputs the first signal and the second signal to outside independently of each other in a second mode.
7. The imaging apparatus according to claim 2 , wherein the signal processing circuit converts each of the first signal and the second signal from an analog signal to a digital signal.
8. The imaging apparatus according to claim 2 , wherein incident light is incident on the first photoelectric conversion unit, and
wherein a part of the incident light incident on the first photoelectric conversion unit passes through the first photoelectric conversion unit to be incident on the second photoelectric conversion unit.
9. The imaging apparatus according to claim 2 , wherein the first output line and the second output line are disposed between the first substrate and the second substrate,
wherein a part of the insulation film is disposed between the first output line and a part of the first substrate, and
wherein another part of the insulation film is disposed between the first output line and a part of the second substrate.
10. The imaging apparatus according to claim 9 , wherein a connection portion where a wiring of the first substrate and a wiring of the second substrate are connected to each other is included in a wiring path connecting the first output line and the signal processing circuit to each other.
11. The imaging apparatus according to claim 1 , further comprising:
a first output line connected to the plurality of first pixels;
a first signal processing circuit disposed on the first substrate and configured to process a first signal output from the first transistor to the first output line;
a second output line connected to the plurality of second pixels; and
a second signal processing circuit disposed on the second substrate and configured to process a second signal output from the second transistor to the second output line.
12. The imaging apparatus according to claim 11 , wherein the first signal and the second signal are different from each other.
13. The imaging apparatus according to claim 11 , wherein the first signal processed by the first signal processing circuit and the second signal processed by the second signal processing circuit are added or averaged.
14. The imaging apparatus according to claim 11 , wherein the first signal processing circuit converts the first signal from an analog signal to a digital signal, and
wherein the second signal processing circuit converts the second signal from an analog signal to a digital signal.
15. The imaging apparatus according to claim 11 , wherein incident light is incident on the first photoelectric conversion unit, and
wherein a part of the incident light incident on the first photoelectric conversion unit passes through the first photoelectric conversion unit to be incident on the second photoelectric conversion unit.
16. The imaging apparatus according to claim 11 , wherein the first output line and the second output line are disposed between the first substrate and the second substrate,
wherein a part of the insulation film is disposed between the first output line and a part of the first substrate, and
wherein another part of the insulation film is disposed between the first output line and a part of the second substrate.
17. The imaging apparatus according to claim 11 , wherein a connection portion where a wiring of the first substrate and a wiring of the second substrate are connected to each other is included in a wiring path connecting the first signal processing circuit and the second signal processing circuit to each other.
18. An imaging apparatus comprising:
a first substrate including a plurality of first pixels arranged thereon, the plurality of first pixels each including a first photoelectric conversion unit and a first transistor configured to output a first signal based on a charge generated in the first photoelectric conversion unit; and
a second substrate including a plurality of second pixels arranged thereon, the plurality of second pixels each including a second photoelectric conversion unit and a second transistor configured to output a second signal based on a charge generated in the second photoelectric conversion unit,
wherein the first substrate and the second substrate are stacked via an insulation film interposed therebetween,
wherein a part of incident light incident on the first photoelectric conversion unit passes through the first photoelectric conversion unit to be incident on the second photoelectric conversion unit, and
wherein an input node of the first transistor and an input node of the second transistor are separated from each other.
19. A system comprising:
the imaging apparatus according to claim 1 ; and
a processing apparatus configured to process the first or second signal output from the imaging apparatus to acquire an image signal.
20. A moving object comprising:
the imaging apparatus according to claim 1 ;
a processing apparatus configured to perform processing on the first or second signal output from the imaging apparatus; and
a control unit configured to control the moving object based on a result of the processing.