Multi-die memory device
A memory is disclosed that includes a logic die having first and second memory interface circuits. A first memory die is stacked with the logic die, and includes first and second memory arrays. The first memory array couples to the first memory interface circuit. The second memory array couples to the second interface circuit. A second memory die is stacked with the logic die and the first memory die. The second memory die includes third and fourth memory arrays. The third memory array couples to the first memory interface circuit. The fourth memory array couples to the second memory interface circuit. Accesses to the first and third memory arrays are carried out independently from accesses to the second and fourth memory arrays.
1. A packaged semiconductor device, comprising:
a package substrate;
a memory die comprising:
interface logic, and
independently accessible memory storage arrays; and
a control logic die mounted on the package substrate comprising:
a first signal interface coupled to a first set of signal lines for communicating a first set of row and column address values from the control logic die to the memory die, and
a second signal interface coupled to a second set of signal lines for communicating a second set of row and column address values from the control logic die to the memory die, and
circuitry to use the first signal interface to facilitate a first independent memory transaction with the independently accessible memory storage arrays of the memory die and the second signal interface to facilitate a second independent memory transaction with the independently accessible memory storage arrays of the memory die.
2. The packaged semiconductor device according to claim 1 , wherein the first set of signal lines and the second set of signal lines each route command, address and data signals.
3. The packaged semiconductor device according to claim 2 , wherein:
the first set of signal lines are routed in a point-to-point manner between the first signal interface and a first one of the independently accessible memory storage arrays; and
the second set of signal lines are routed in a point-to-point manner between the second signal interface and a second one of the independently accessible memory storage arrays.
4. The packaged semiconductor device according to claim 2 , wherein:
the first set of signal lines are routed in a multi-drop manner between the first signal interface, a first one of the independently accessible memory storage arrays of the memory die, and a memory storage array of a second memory die; and
the second set of signal lines are routed in a multi-drop manner between the second signal interface, a second one of the independently accessible memory storage arrays of the memory die, and another memory storage array of the second memory die.
5. The packaged semiconductor device according to claim 1 , wherein:
the circuitry is further to use the first signal interface to facilitate the first independent memory transaction with a first memory storage array within the independently accessible memory storage arrays of the memory die and the second signal interface to facilitate the second independent memory transaction with the first memory storage array within the independently accessible memory storage arrays of the memory die.
6. The packaged semiconductor device according to claim 1 , wherein:
the circuitry is further to use the first signal interface to facilitate the first independent memory transaction with a first memory storage array within the independently accessible memory storage arrays of the memory die and the second signal interface to facilitate the second independent memory transaction with a second memory storage array within the independently accessible memory storage arrays of the memory die.
7. The packaged semiconductor device according to claim 1 , wherein each of the independently accessible memory storage arrays includes multiple addressable storage banks.
8. The packaged semiconductor device according to claim 1 , wherein the control logic die is stacked vertically with the memory die.
9. A packaged semiconductor device, comprising:
a package substrate;
a memory die comprising:
interface logic, and
independently accessible memory storage arrays; and
a control logic die mounted on the package substrate comprising:
a first signal interface coupled to a first set of signal lines communicating a first set of row and column address values from the control logic die to a first memory storage array of the independently accessible memory storage arrays of the memory die, and
a second signal interface coupled to a second set of signal lines communicating a second set of row and column address values from the control logic die to a second memory storage array of the independently accessible memory storage arrays of the memory die, and
circuitry to use the first signal interface to facilitate memory transactions with the first memory storage array of the memory die and use the second signal interface to facilitate memory transactions with the second memory storage array of the memory die.
10. The packaged semiconductor device according to claim 9 , wherein the first set of signal lines and the second set of signal lines each route command, address and data signals.
11. The packaged semiconductor device according to claim 9 , wherein:
the first set of signal lines are routed in a point-to-point manner between the first signal interface and a first one of the independently accessible memory storage arrays; and
the second set of signal lines are routed in a point-to-point manner between the second signal interface and a second one of the independently accessible memory storage arrays.
12. The packaged semiconductor device according to claim 9 , wherein:
the first set of signal lines are routed in a multi-drop manner between the first signal interface, a first one of the independently accessible memory storage arrays of the memory die, and a memory storage array of a second memory die; and
the second set of signal lines are routed in a multi-drop manner between the second signal interface, a second one of the independently accessible memory storage arrays of the memory die, and another memory storage array of the second memory die.
13. The packaged semiconductor device according to claim 9 , wherein each of the independently accessible memory storage arrays includes multiple addressable storage banks.
14. The packaged semiconductor device according to claim 9 , wherein the control logic die is stacked vertically with the memory die.
15. A method of operation in a packaged semiconductor device having a control logic die and a memory die disposed on a package substrate, the control logic die including a first signal interface coupled to a first set of signal lines for communicating a first set of row and column address values from the control logic die to the memory die, and a second signal interface coupled to a second set of signal lines for communicating a second set of row and column address values from the control logic die to the memory die, the method comprising:
using the first signal interface to facilitate a first independent memory transaction with independently accessible memory storage arrays of the memory die and the second signal interface to facilitate a second independent memory transaction with the independently accessible memory storage arrays of the memory die.
16. The method according to claim 15 , further comprising:
transferring command, address and data signals via each of the first signal interface and the second signal interface.
17. The method according to claim 16 , wherein:
the transferring along the first set of signal lines is carried out in a point-to-point manner between the first signal interface and a first one of the independently accessible memory storage arrays; and
the transferring along the second set of signal lines is carried out in a point-to-point manner between the second signal interface and a second one of the independently accessible memory storage arrays.
18. The method according to claim 16 , wherein:
the transferring along the first set of signal lines is carried out in a multi-drop manner between the first signal interface, a first one of the independently accessible memory storage arrays of the memory die, and a memory storage array of a second memory die; and
the transferring along the second set of signal lines is carried out in a multi-drop manner between the second signal interface, a second one of the independently accessible memory storage arrays of the memory die, and another memory storage array of the second memory die.
19. The method according to claim 15 , further comprising:
using the first signal interface to facilitate the first independent memory transaction with a first memory storage array within the independently accessible memory storage arrays of the memory die and the second signal interface to facilitate the second independent memory transaction with the first memory storage array within the independently accessible memory storage arrays of the memory die.
20. The method according to claim 15 , further comprising:
using the first signal interface to facilitate the first independent memory transaction with a first memory storage array within the independently accessible memory storage arrays of the memory die and the second signal interface to facilitate the second independent memory transaction with a second memory storage array within the independently accessible memory storage arrays of the memory die.