Electronic package with tapered pedestal
An electrical package may comprise a first substrate with a first substrate surface, and a microprocessor chip connected to the first substrate surface. The microprocessor chip may comprise a first chip surface that electrically connects to the first substrate surface, and a second chip surface located opposite the first chip surface. The electrical package may comprise a heat spreader assembly that comprises a lid section and a contact surface thermally connected to the second-chip surface. The electrical package may also comprise a pedestal between the contact surface and the lid section. The pedestal may comprise a first end that is located near the contact surface and a second end that is located near the lid section. The second end may be wider than the first end.
1. An electrical package comprising:
a first substrate with a first substrate surface;
at least one microprocessor chip connected to the first substrate surface, the microprocessor chip comprising:
a first chip surface that electrically connects to the first substrate surface; and
a second chip surface located opposite the first chip surface; and
a heat-spreader assembly, the heat spreader assembly comprising:
a lid section;
a contact surface thermally connected to the second chip surface;
a pedestal between the contact surface and the lid section, the pedestal comprising:
a first end that is connected to the contact surface; and
a second end that is connected to the lid section, wherein the pedestal is wider at the second end than at the first end.
2. The electrical package of claim 1 , further comprising a stiffener, the stiffener comprising:
a complementary stiffener surface that complements a shape of the pedestal, wherein the shape of the pedestal is defined by the first end of the pedestal and second end of the pedestal; and
a lower stiffener surface.
3. The electrical package of claim 2 , wherein the stiffener further comprises a top stiffener surface, located opposite the lower stiffener surface with respect to a remainder of the stiffener.
4. The electrical package of claim 3 , wherein the lower lid surface of the lid section structurally connects with the top stiffener surface.
5. The electrical package of claim 2 , wherein the lower stiffener surface is structurally connected to the first substrate surface.
6. The electrical package of claim 1 , wherein the first substrate contains a second substrate surface that is opposite the first substrate surface, and wherein the second substrate surface electrically connects with a second substrate.
7. The electrical package of claim 6 , wherein the lower stiffener surface is structurally connected to the second substrate.
8. The electrical package of claim 4 , wherein the lower lid surface of the lid section interfaces with the second substrate.
9. The electrical package of claim 1 , wherein the pedestal comprises an angled taper between the first end and the second end.
10. The electrical package of claim 1 , wherein the second chip surface is substantially parallel to a first plane, and wherein an increase in the distance between the contact surface and the intersection of a second plane with the pedestal corresponds to an increase in a cross-sectional area of the pedestal at the intersection, wherein the second plane is parallel to the first plane.
11. A method of assembling an electronic package, the method comprising:
adhering a first surface of an electrical component to a first surface of a first substrate;
securing a stiffener to a second surface of a second substrate;
securing a heat-spreader assembly to a third surface of a third substrate, wherein the heat-spreader assembly comprises a tapered pedestal that thermally connects to a second surface of the electrical component; and
performing reflow soldering on the electronic package.
12. The method of claim 11 , wherein the second substrate is the same as the first substrate, and wherein the second surface of the second substrate is the same as the first surface of the first substrate.
13. The method of claim 12 , wherein the third substrate is the same as the first substrate, and wherein the third surface of the third substrate is the same as the first surface of the first substrate.
14. The method of claim 11 , wherein the performing the reflow soldering occurs before the securing the head-spreader assembly.
15. The method of claim 11 , wherein the tapered pedestal comprises a convex taper.
16. A method comprising:
transferring heat through a tapered pedestal in an electronic package, the electronic package comprising:
a first substrate with a first substrate surface;
a microprocessor chip connected to the first substrate surface, the microprocessor chip comprising:
a first chip surface that electrically connects to the first substrate surface; and
a second chip surface located opposite the first chip surface; and
a heat-spreader assembly, the heat-spreader assembly comprising:
a lid section;
a contact surface thermally connected to the second chip surface;
a pedestal between the contact surface and the lid section, the pedestal comprising:
a first end that is located near the contact surface; and
a second end that is connected to the lid section, wherein the pedestal is wider at the second end than at the first end.
17. The method of claim 16 , wherein the package further comprises a stiffener, the stiffener comprising:
a complementary stiffener surface that complements a shape of the pedestal, wherein the shape of the pedestal is defined by the first end of the pedestal and second end of the pedestal; and
a lower stiffener surface.
18. The method of claim 17 , wherein the stiffener further comprises a top stiffener surface, located opposite the lower stiffener surface with respect to a remainder of the stiffener.
19. The method of claim 16 , wherein first end of the pedestal is adjacent to the contact surface, and wherein the second end of the pedestal is adjacent to the lid section.
20. The method of claim 16 , wherein the tapered pedestal comprises a step taper.