Gate structure passivating species drive-in method and structure formed thereby
Generally, the present disclosure provides example embodiments relating to formation of a gate structure of a device, such as in a replacement gate process, and the device formed thereby. In an example method, a gate dielectric layer is formed over an active area on a substrate. A dummy layer that contains a passivating species (such as fluorine) is formed over the gate dielectric layer. A thermal process is performed to drive the passivating species from the dummy layer into the gate dielectric layer. The dummy layer is removed. A metal gate electrode is formed over the gate dielectric layer. The gate dielectric layer includes the passivating species before the metal gate electrode is formed.
1. A method comprising:
forming a high-k gate dielectric layer over an active area on a substrate;
after the forming the high-k gate dielectric layer, forming a capping layer over the high-k gate dielectric layer;
after the forming the capping layer, forming a barrier layer over the capping layer;
after the forming the barrier layer, forming a dummy fluorine-containing layer over the barrier layer, wherein the dummy fluorine-containing layer is formed by an atomic layer deposition process which utilizes a fluorine-containing precursor followed by a second precursor;
after the forming the dummy fluorine-containing layer, forming a capping layer over the dummy fluorine-containing layer;
after the forming the capping layer, performing a thermal process to drive fluorine from the dummy fluorine-containing layer into the high-k gate dielectric layer and from the dummy fluorine-containing layer into the capping layer, wherein the performing the thermal process reduces a concentration of fluorine within the barrier layer;
after the performing the thermal process, removing the dummy fluorine-containing layer; and
after the removing the dummy fluorine-containing layer, forming a metal gate electrode over the high-k gate dielectric layer, wherein the high-k gate dielectric layer includes fluorine before the metal gate electrode is formed.
2. The method of claim 1 further comprising:
forming gate spacers over the active area, wherein forming the high-k gate dielectric layer includes conformally forming the high-k gate dielectric layer along sidewalls of gate spacers.
3. The method of claim 1 , wherein:
the active area is a fin on the substrate; and
forming the high-k gate dielectric layer includes conformally forming the high-k gate dielectric layer along sidewalls and over a top surface of the fin.
4. The method of claim 1 wherein the forming the capping layer forms titanium nitride.
5. The method of claim 1 , wherein the high-k gate dielectric layer is a high dielectric constant material.
6. The method of claim 1 , wherein a metal is located between the high-k gate dielectric layer and the metal gate electrode after the metal gate electrode is formed.
7. The method of claim 1 , wherein forming the capping layer includes using an Atomic Layer Deposition (ALD) process.
8. The method of claim 1 , wherein the thermal process is a Rapid Thermal Anneal (RTA).
9. The method of claim 1 further comprising:
forming a work-function tuning layer over the high-k gate dielectric layer after the dummy fluorine-containing layer is removed; and
forming a barrier/adhesion layer over the work-function tuning layer, the metal gate electrode being formed over the barrier/adhesion layer.
10. The method of claim 1 , wherein the performing the thermal process also reduces a concentration of fluorine within a portion of the capping layer.
11. A method comprising:
conformally forming a high-k gate dielectric layer between gate spacers that are over a fin on a substrate, the high-k gate dielectric layer being conformally formed along sidewalls and a top surface of the fin and along respective sidewalls of the gate spacers;
after the conformally forming the high-k gate dielectric layer, forming a barrier layer over the high-k gate dielectric layer;
after the forming the barrier layer, conformally depositing a dummy layer over the barrier layer, wherein conformally depositing the dummy layer includes an atomic layer deposition process that cycles multiple times between a first fluorine precursor and a second non-fluorine precursor, the dummy layer comprising fluorine;
after the conformally depositing the dummy layer, forming a dummy capping layer over the dummy layer;
after the forming the dummy capping layer, driving the fluorine from the dummy layer into the high-k gate dielectric layer and also driving the fluorine from the dummy layer into the dummy capping layer, wherein the driving the fluorine from the dummy layer into the high-k gate dielectric layer also reduces a concentration of fluorine in the barrier layer;
after the driving the fluorine from the dummy layer into the high-k gate dielectric layer, removing the dummy layer; and
after the removing the dummy layer, forming a metal gate electrode over the high-k gate dielectric layer after the dummy layer is removed.
12. The method of claim 11 further comprising:
forming a capping layer over the high-k gate dielectric layer prior to the forming the barrier layer.
13. The method of claim 11 , wherein the second non-fluorine precursor is diborane.
14. The method of claim 11 , wherein driving the fluorine from the dummy layer into the high-k gate dielectric layer includes using a thermal process.
15. The method of claim 11 , wherein the first fluorine precursor is tungsten fluoride.
16. The method of claim 11 further comprising:
forming a work-function tuning layer over the high-k gate dielectric layer after the dummy layer is removed; and
forming a barrier/adhesion layer over the work-function tuning layer, the metal gate electrode being formed over the barrier/adhesion layer.
17. A method comprising:
forming a gate dielectric layer over a substrate;
after the forming the gate dielectric layer, depositing a first capping layer over the gate dielectric layer;
after the depositing the first capping layer, depositing a dummy fluorine-containing layer with an atomic layer deposition process over the first capping layer, wherein the dummy fluorine-containing layer comprises a first material and fluorine, wherein the fluorine is deposited with the first material, and wherein forming the dummy fluorine-containing layer is performed at a temperature sufficient to diffuse fluorine into the gate dielectric layer;
after the depositing the dummy fluorine-containing layer, depositing a dummy capping layer over the dummy fluorine-containing layer, wherein forming the dummy capping layer is performed at a temperature sufficient to diffuse fluorine from the dummy fluorine-containing layer into the gate dielectric layer;
after the depositing the dummy capping layer, performing an anneal after the depositing the dummy capping layer, the performing the anneal reducing a concentration of fluorine in a portion of the first capping layer, the anneal further diffusing fluorine from the dummy fluorine-containing layer into the dummy capping layer;
after the performing the anneal, removing the dummy capping layer;
after the removing the dummy capping layer, removing the dummy fluorine-containing layer; and
after removing the dummy fluorine-containing layer, forming a metal gate electrode over the gate dielectric layer.
18. The method of claim 17 , wherein the temperature is between 300° C. and 600° C.
19. The method of claim 17 , wherein forming the metal gate electrode over the gate dielectric layer comprises forming the metal gate electrode over the first capping layer.
20. The method of claim 17 , wherein the performing the anneal also reduces a concentration of fluorine within a barrier layer located between the first capping layer and the gate dielectric layer.