IP Library › Granted Patent US 10,270,952
Granted Patent B2
US 10,270,952 · App. 15/826,937 · Granted Apr 23, 2019

Imaging module with two cameras and electronic device

Inventors: Yougen Liu (Guangdong, CN); Ke Ran (Guangdong, CN)
Assignee: Guangdong Oppo Mobile Telecommunications Corp., Ltd.
H04N5/2257H04M1/0277H04N5/2253H04N5/2254H04N5/2258H04N5/247H04M1/0264
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Quick Facts
Patent No.
US 10,270,952
App. No.
15/826,937
Granted
Apr 23, 2019
Kind
B2
Abstract

An imaging module and an electronic device including the imaging module are provided. The imaging module includes a flexible printed circuit board and an imaging unit including two cameras arranged side by side and connected to the flexible printed circuit board. The flexible printed circuit board includes a projection portion projecting to a side edge of the imaging unit. The side edge extends along an arranging direction of the two cameras, and a width of the projection portion in the arranging direction is less than a length of the side edge.

Claims (47)

1. An imaging module, comprising:

a flexible printed circuit board; and

an imaging unit comprising a first camera and a second camera arranged side by side and connected to the flexible printed circuit board, wherein

the flexible printed circuit board comprises a projection portion projecting to a side edge of the imaging unit, the side edge extends along an arranging direction of the first and second cameras, and a width of the projection portion in the arranging direction is less than a length of the side edge;

each of the first and second cameras comprises a printed circuit board, and the flexible printed circuit board is coupled to the two printed circuit boards;

the flexible printed circuit board further comprises:

a first connection portion coupled to the printed circuit board of the first camera and a second connection portion coupled to the printed circuit board of the second camera; and

an extension portion extending from the second connection portion towards the first connection portion and covering the first connection portion;

the projection portion comprises a first projection sub-portion projecting from the first connection portion and beyond the side edge and a second projection sub-portion projecting from the extension portion and beyond the side edge, wherein the first projection sub-portion and the second projection sub-portion are arranged to be stacked.

2. The imaging module of claim 1 , wherein a ratio of the width of the projection portion to the length of the side edge of the imaging unit ranges from ⅓ to ⅔.

3. The imaging module of claim 2 , wherein the ratio of the width of the projection portion to the length of the side edge of the imaging unit ranges from ⅓ to ½.

4. The imaging module of claim 1 , wherein the length of the side edge of the imaging unit is 8 to 12 mm, and the width of the projection portion is 4 to 6 mm.

5. The imaging module of claim 1 , wherein the projection portion is located at one side of the first camera.

6. The imaging module of claim 5 , wherein the width of the projection portion is no greater than a length of the first camera in the arranging direction.

7. The imaging module of claim 5 , wherein each of the first and second cameras further comprise an image sensor disposed on the printed circuit board, and a lens assembly located above the image sensor, wherein the two printed circuit boards are spaced apart.

8. The imaging module of claim 1 , wherein the first projection sub-portion comprises:

a first projection section projecting to the first camera; and

a second projection section, connected to one end of the first projection section away from the first camera and projecting along the arranging direction.

9. The imaging module of claim 1 , wherein the imaging module further comprises a first connector and a second connector, the first connector being provided on a first surface of the first projection sub-portion, the second connector being provided on a second surface of the second projection sub-portion, and the second surface is opposite the first surface.

10. The imaging module of claim 5 , wherein each of the first and second cameras comprises an image sensor and a lens assembly located above the image sensor, wherein the two image sensors are disposed on one printed circuit board, and the flexible printed circuit board is a single continuous flexible printed circuit board coupled to the printed circuit board.

11. The imaging module of claim 10 , wherein the projection portion comprises a first elongation portion coupled to the printed circuit board and a second elongation portion elongating along the arranging direction from one end of the first elongation portion away from the printed circuit board.

12. An electronic device, comprising:

a main circuit board; and

an imaging module comprising:

a flexible printed circuit board coupled to the main circuit board; and

an imaging unit comprising a first camera and a second camera arranged side by side and connected to the flexible printed circuit board, wherein

the flexible printed circuit board comprises a projection portion projecting to a side edge of the imaging unit, the side edge extends along an arranging direction of the two cameras, and a width of the projection portion in the arranging direction is less than a length of the side edge;

each of the first and second cameras comprises a printed circuit board, and the flexible printed circuit board is coupled to the two printed circuit boards;

the flexible printed circuit board further comprises:

a first connection portion coupled to the printed circuit board of the first camera and a second connection portion coupled to the printed circuit board of the second camera; and

an extension portion extending from the second connection portion towards the first connection portion and covering the first connection portion;

the projection portion comprises a first projection sub-portion projecting from the first connection portion and beyond the side edge and a second projection sub-portion projecting from the extension portion and beyond the side edge, wherein the first projection sub-portion and the second projection sub-portion are arranged to be stacked, and the main circuit board is located between the first projection sub-portion and the second projection sub-portion.

13. The electronic device of claim 12 , wherein a ratio of the width of the projection portion to the length of the side edge of the imaging unit ranges from ⅓ to ⅔.

14. The electronic device of claim 12 , wherein the projection portion is located at one side of the first camera.

15. The electronic device of claim 14 , wherein each of the first and second cameras further comprises an image sensor disposed on the printed circuit board, and a lens assembly located above the image sensor, wherein the two printed circuit boards are spaced apart.

16. The electronic device of claim 14 , wherein each of the first and second cameras comprises an image sensor and a lens assembly located above the image sensor, wherein the two image sensors are disposed on one printed circuit board, and the flexible printed circuit board is a single continuous flexible printed circuit board coupled to the printed circuit board.

17. An imaging module, comprising:

a flexible printed circuit board; and

an imaging unit comprising a first camera and a second camera arranged side by side and connected to the flexible printed circuit board, wherein

the flexible printed circuit board comprises a projection portion projecting to a side edge of the imaging unit, the side edge extends along an arranging direction of the first and second cameras;

the flexible printed circuit board further comprises:

a first connection portion coupled to the first camera and a second connection portion coupled to the second camera; and

an extension portion extending from the second connection portion towards the first connection portion and covering the first connection portion;

the projection portion comprises a first projection sub-portion projecting from the first connection portion and beyond the side edge and a second projection sub-portion projecting from the extension portion and beyond the side edge, wherein the first projection sub-portion and the second projection sub-portion are arranged to be stacked.

18. The imaging module of claim 17 , wherein a width of the projection portion in the arranging direction is less than a length of the side edge.

19. The imaging module of claim 18 , wherein each of the first and second cameras comprises a printed circuit board, an image sensor disposed on the printed circuit board, and a lens assembly located above the image sensor, wherein the two printed circuit boards are spaced apart, and the flexible printed circuit board is coupled to the two printed circuit boards.

20. The imaging module of claim 19 , wherein the imaging module further comprises a first connector and a second connector, the first connector being provided on a first surface of the first projection sub-portion, the second connector being provided on a second surface of the second projection sub-portion, and the second surface is opposite the first surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2017
From: LIU, YOUGEN; RAN, KE
To: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
Reel/Frame 044555/0849 →
Priority Claims (1)
CN 2016 1 1121719 · Dec 8, 2016 · national
Continuity (1)
Related Publication 20180167540A1 · Jun 14, 2018
Cited By (1)
US 12,526,495