IP Library Granted Patent US 10,056,234
Granted Patent B2
US 10,056,234 · App. 15/827,929 · Granted Aug 21, 2018

Plasma equipment for treating powder

Inventors: Dong Chan Seok (Daejeon, KR); Yong Ho Jung (Seoul, KR); Hyun Young Jeong (Gunsan-si, KR)
Assignee: KOREA BASIC SCIENCE INSTITUTE
H01J37/32568B01J19/088H01J37/32348H05H1/48B01J2219/0835B01J2219/0879H05H2001/2412
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Quick Facts
Patent No.
US 10,056,234
App. No.
15/827,929
Granted
Aug 21, 2018
Kind
B2
Abstract

A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.

Claims (26)

1. A method of processing a powder using a powder surface processing apparatus of a plate-like surface discharge plasma module:

the apparatus comprising:

a chamber configured to perform plasma processing on a powder; and

a plate-like surface discharge plasma module disposed in the chamber,

wherein the plate-like surface discharge module comprises:

an insulating layer;

a plate-like electrode layer which is disposed on one side of the insulating layer; and

a plurality of plasma generating electrodes in the form of a bar which are disposed on the other side of the insulating layer at intervals,

wherein the plate-like surface discharge plasma module is configured to apply an alternating voltage to the plurality of plasma generating electrodes and the plate-like electrode layer to generate plasma around the plurality of plasma generating electrodes, and the plate-like surface discharge plasma module is configured to position a powder on the plasma generating electrodes and treat the surface of the powder by the generated plasma,

the method comprising:

generating a plasma with the plasma generating electrodes of the powder surface processing apparatus; and

contacting a powder with the plasma generated from the plate-like plasma generating electrodes and treating the surface of the powder.

2. The method of claim 1 , wherein the plasma is generated from a plasma reaction gas injected into the surface discharge plasma module.

3. The method of claim 2 , wherein the plasma reaction gas comprises an inert gas and a gas containing oxygen, fluorine, or chlorine.

4. The method of claim 3 , wherein the inert gas comprises Ar or N 2 .

5. The method of claim 3 , wherein the gas containing oxygen comprises O 2 or N 2 O.

6. The method of claim 3 , wherein the gas containing fluorine comprises CF 4 or SF 6 .

7. The method of claim 3 , wherein the gas containing chlorine comprises Cl 2 or BCl 3 .

8. The method of claim 1 , wherein a high voltage is applied to the plate-like electrode layer, and the plurality of plasma generating electrodes are ground electrodes.

9. The method of claim 8 , wherein the apparatus comprises at least two of the plate-like surface discharge modules, the ground electrode or the high-voltage-applying electrodes in each module are disposed to face each other within the chamber.

10. The method of claim 1 , wherein a high voltage is applied to the plurality of plasma generating electrodes, and the plate-like electrode layer is a ground electrode.

11. The method of claim 10 , wherein the apparatus comprises at least two of the plate-like surface discharge modules, the ground electrode or the high-voltage-applying electrodes in each module are disposed to face each other within the chamber.

12. The method of claim 1 , wherein the apparatus comprises a powder supply unit disposed in an upper portion of the chamber, wherein the plate-like surface discharge plasma module is disposed below the powder supply unit and positioned within the chamber, wherein the surface of the plate-like surface discharge plasma module is not perpendicular to a direction in which the powder is supplied.

13. The method of claim 12 , further comprising an inclination adjusting unit configured to adjust an angle of inclination of the plate-like surface discharge plasma module to a predetermined angle within the chamber.

14. The method of claim 12 , wherein an upper portion of the plate-like surface discharge plasma module is positioned below the powder supply unit, a lower portion of the plate-like surface discharge plasma module is positioned in a direction inclined toward one side from the upper portion, and the powder supplied through the powder supply unit falls down in the inclined direction of the plate-like surface discharge plasma module inclined toward the one side.

15. The method of claim 12 , wherein the plurality of plasma generating electrodes are disposed in parallel with a direction in which the powder falls along the plate-like surface discharge plasma module to guide the powder to fall down.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY POSTAL CODE PREVIOUSLY RECORDED ON REEL 055585 FRAME 0627. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 24, 2021
From: KOREA BASIC SCIENCE INSTITUTE
To: KOREA INSTITUTE OF FUSION ENERGY
Reel/Frame 055695/0192 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2021
From: KOREA BASIC SCIENCE INSTITUTE
To: KOREA INSTITUTE OF FUSION ENERGY
Reel/Frame 055585/0627 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2018
From: SEOK, DONG CHAN; JUNG, YONG HO; JEONG, HYUN YOUNG
To: KOREA BASIC SCIENCE INSTITUTE
Reel/Frame 045078/0600 →
Priority Claims (1)
KR 10-2012-0142763 · Dec 10, 2012 · national
Continuity (2)
Division 14409357
Related Publication 20180090302A1 · Mar 29, 2018