IP Library › Granted Patent US 10,481,199
Granted Patent B2
US 10,481,199 · App. 15/829,632 · Granted Nov 19, 2019

Data analytics and computational analytics for semiconductor process control

Inventors: Raman K. Nurani (Chennai, IN); Anantha R. Sethuraman (Palo Alto, CA); Koushik Ragavan (Chennai, IN)
Assignee: APPLIED MATERIALS, INC.
G01R31/2862G01R31/318516G06F16/5838G06F17/5072G06T7/60
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Quick Facts
Patent No.
US 10,481,199
App. No.
15/829,632
Granted
Nov 19, 2019
Kind
B2
Abstract

Implementations described herein generally relate to detecting excursions in intended geometric features in an integrated circuit substrate. In one implementation, a method includes determining a set of suspect contours in a design window of the integrated circuit substrate based on proximities of a plurality of points of interest in the design window to intended geometric features. The method further includes obtaining a set of imaged contours from one or more images of a defect-free integrated circuit substrate. The method further includes comparing the set of imaged contours to the set of suspect contours to obtain a set of potential excursions from the imaged contours. The method further includes determining a probability that a potential excursion from the set of potential excursions is a valid excursion. The method further includes taking a corrective action based on the determined probability.

Claims (41)

1. A method for detecting excursions comprising deviations from expected geometric features in an integrated circuit substrate, comprising:

determining a set of contours suspected of having at least one excursion in a design window of the integrated circuit substrate based on a geometric distribution of proximities of a plurality of points of interest in the design window to a plurality of expected geometric features, wherein determining the geometric distribution comprises determining a design proximity index for each of the plurality of points of interest in the design window, wherein the design proximity index is a measure of how close a point of interest of the plurality of points of interest is to an adjacent expected geometric feature of the plurality of expected geometric features;

obtaining a set of imaged contours from one or more images of a defect-free integrated circuit substrate;

comparing the set of imaged contours to the set of suspected contours to obtain a set of potential excursions from the imaged contours;

determining a probability that a potential excursion from the set of potential excursions is a confirmed excursion, wherein the confirmed excursion is operable to cause a yield impacting defect within at least one of the expected geometric features of the design window of the substrate; and

taking a corrective action to eliminate a re-occurrence of the confirmed excursion based on the determined probability.

2. The method of claim 1 , wherein the set of potential excursions represent a set of deviations from an intended geometric feature.

3. The method of claim 1 , wherein determining the set of suspected contours comprises determining a Euclidian distance between a point of a plurality of points in an expected geometric feature of the plurality of geometric features.

4. The method of claim 3 , further comprising determining a location of the confirmed excursion from the determined Euclidian distance.

5. The method of claim 1 , further comprising, before determining the set of suspected contours, dividing the substrate into a plurality of geometric areas comprising a corresponding plurality of design windows.

6. The method of claim 1 , further comprising determining from the confirmed excursion a measure of compliance to a design process of the integrated circuit substrate.

7. The method of claim 6 , wherein the compliance is at least one of lithography compliance, deposition compliance, or planarization compliance.

8. The method of claim 6 , further comprising, providing instructions to at least one of altering a processing step in the manufacture of the integrated circuit substrate, changing a design parameter for the integrated circuit substrate, or replacing a defective sensor in response to the measure of compliance exceeding a predefined criteria.

9. The method of claim 1 , further comprising transmitting a notification of the confirmed excursion to a display that displays a dashboard of confirmed excursions and their associated probabilities.

10. The method of claim 9 , further comprising:

rank ordering confirmed excursions and

presenting the rank ordering on the display.

11. The method of claim 1 , further comprising:

identifying one or more steps in a recipe, a particular chamber, and a tool associated with a yield impacting defect that caused the confirmed excursion.

12. A computing system, comprising:

a memory; and

a processor configured to perform a method for detecting comprising deviations from expected geometric features in an integrated circuit substrate, the method comprising:

determining a set of contours suspected of having at least one excursion in a design window of the integrated circuit substrate based on a geometric distribution of proximities of a plurality of points of interest in the design window to a plurality of expected geometric features, wherein determining the geometric distribution comprises determining a design proximity index for each of the plurality of points of interest in the design window, wherein the design proximity index is a measure of how close a point of interest of the plurality of points of interest is to an adjacent expected geometric feature of the plurality of expected geometric features;

obtaining a set of imaged contours from one or more images of a defect-free integrated circuit substrate;

comparing the set of imaged contours to the set of suspected contours to obtain a set of potential excursions from the imaged contours;

determining a probability that a potential excursion from the set of potential excursions is a confirmed excursion, wherein the confirmed excursion is operable to cause a yield impacting defect within at least one of the expected geometric features of the design window of the substrate; and

taking a corrective action to eliminate a re-occurrence of the confirmed excursion based on the determined probability.

13. The computing system of claim 12 , wherein the set of potential excursions represent a set of deviations from an intended geometric feature.

14. The computing system of claim 13 , wherein determining the set of suspected contours comprises determining a Euclidian distance between a point of a plurality of points in an expected geometric feature of the plurality of geometric features.

15. The computing system of claim 14 , further comprising determining a location of the confirmed excursion from the determined Euclidian distance.

16. The computing system of claim 12 , further comprising, before determining the set of suspected contours, dividing the substrate into a plurality of geometric areas comprising a corresponding plurality of design windows.

17. A non-transitory computer-readable medium comprising instructions that when executed by a computing device cause the computing device to perform a method for detecting excursions comprising deviations from expected geometric features in an integrated circuit substrate, the method comprising:

determining a set of contours suspected of having at least one excursion in a design window of the integrated circuit substrate based on a geometric distribution of proximities of a plurality of points of interest in the design window to a plurality of expected geometric features, wherein determining the geometric distribution comprises determining a design proximity index for each of the plurality of points of interest in the design window, wherein the design proximity index is a measure of how close a point of interest of the plurality of points of interest is to an adjacent expected geometric feature of the plurality of expected geometric features;

obtaining a set of imaged contours from one or more images of a defect-free integrated circuit substrate;

comparing the set of imaged contours to the set of suspected contours to obtain a set of potential excursions from the imaged contours;

determining a probability that a potential excursion from the set of potential excursions is a confirmed excursion, wherein the confirmed excursion is operable to cause a yield impacting defect within at least one of the expected geometric features of the design window of the substrate; and

taking a corrective action to eliminate a re-occurrence of the confirmed excursion based on the determined probability.

18. The non-transitory computer-readable medium of claim 17 , wherein the set of potential excursions represent a set of deviations from an intended geometric feature.

19. The non-transitory computer-readable medium of claim 17 , wherein determining the set of suspected contours comprises determining a Euclidian distance between a point of a plurality of points in an expected geometric feature of the plurality of geometric features.

20. The non-transitory computer-readable medium of claim 19 , further comprising determining a location of the confirmed excursion from the determined Euclidian distance.

21. The non-transitory computer-readable medium of claim 17 , further comprising, before determining the set of suspected contours, dividing the substrate into a plurality of geometric areas comprising a corresponding plurality of design windows.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2017
From: NURANI, RAMAN K.; SETHURAMAN, ANANTHA R.; RAGAVAN, KOUSHIK
To: APPLIED MATERIALS, INC.
Reel/Frame 044328/0098 →
Continuity (1)
Related Publication 20190170812A1 · Jun 6, 2019
Cited By (1)
US 12,586,175