IP Library Granted Patent US 10,371,497
Granted Patent B2
US 10,371,497 · App. 15/832,184 · Granted Aug 6, 2019

Fully integral epoxy cap probe

Inventors: Eli Cole Warren (Wethersfield, CT); Peter J. Walsh (Wethersfield, CT)
Assignee: United Technologies Corporation
G01B7/023F01D11/12F01D11/14G01B7/14F05D2270/80F05D2300/44
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Quick Facts
Patent No.
US 10,371,497
App. No.
15/832,184
Granted
Aug 6, 2019
Kind
B2
Abstract

A fully integral epoxy cap probe may comprise a body having a cavity disposed radially outward of a fan blade and comprising a first material, a frame disposed within the cavity and comprising a second material, a first sensor element and a ground plane disposed within the frame, the first sensor element and the ground plane comprising a third material, and a first soft lead in electronic communication with the first sensor element and the ground plane.

Claims (39)

1. A fully integral epoxy cap probe, comprising:

a body having a cavity disposed radially outward of a fan blade and comprising a first material;

a frame disposed within the cavity and comprising a second material;

a first sensor element and a ground plane disposed within the frame, the first sensor element and the ground plane comprising a third material; and

a first soft lead in electronic communication with the first sensor element and the ground plane,

wherein the second material and the third material are at least one of a resin, epoxy, and/or thermoset material.

2. The fully integral epoxy cap probe of claim 1 , wherein the first material comprises at least one of a composite, a resin, epoxy, and/or thermoset material.

3. The fully integral epoxy cap probe of claim 2 , wherein the second material comprises at least one of a hydrophobic dielectric resin, epoxy, and/or thermoset material comprising bisphenol AF diglycidyl ether having fluorinated methyl groups.

4. The fully integral epoxy cap probe of claim 3 , wherein the third material comprises at least one of a hydrophobic conductive resin, epoxy, and/or thermoset material comprising bisphenol AF diglycidyl ether having fluorinated methyl groups.

5. The fully integral epoxy cap probe of claim 4 , wherein the body comprises a first passage wherein the first soft lead is disposed within the first passage.

6. The fully integral epoxy cap probe of claim 5 , wherein the frame comprises a first channel aligned with the first passage, wherein the first soft lead further comprises a lead shield disposed within the first channel.

7. The fully integral epoxy cap probe of claim 6 , wherein the frame further comprises a backplane and an enclosing wall extending perpendicular to the backplane, the enclosing wall having an inner face and an outer face, wherein the inner face defines a pocket, wherein the outer face and a sidewall of the cavity define a trench.

8. The fully integral epoxy cap probe of claim 7 , wherein the pocket comprises a pocket wall.

9. The fully integral epoxy cap probe of claim 7 , wherein the third material is disposed within the trench and the pocket.

10. The fully integral epoxy cap probe of claim 9 , further comprising a cap comprising the second material disposed within the cavity over the third material.

11. A gas turbine engine comprising:

a fan having a blade having a tip;

a fan case having an inner aerodynamic surface and a rub strip;

the tip proximate the inner aerodynamic surface; and

a fully integral epoxy cap probe, comprising:

a body having a cavity disposed radially outward of the tip and comprising a first material;

a frame disposed within the cavity and comprising a second material;

a first sensor element and a ground plane disposed within the frame, the first sensor element and the ground plane comprising a third material, wherein the second material and the third material are at least one of a resin, epoxy, and/or thermoset material; and

a first soft lead in electronic communication with the first sensor element and the ground plane.

12. The gas turbine engine of claim 11 , wherein the first material comprises at least one of a composite, a resin, epoxy, and/or thermoset material, the second material comprises at least one of a hydrophobic dielectric resin, epoxy, and/or thermoset material comprising bisphenol AF diglycidyl ether having fluorinated methyl groups, and the third material comprises at least one of a hydrophobic conductive resin, epoxy, and/or thermoset material comprising bisphenol AF diglycidyl ether having fluorinated methyl groups.

13. The gas turbine engine of claim 12 , wherein the body comprises a first passage wherein the first soft lead is disposed within the first passage.

14. The gas turbine engine of claim 13 , wherein the frame comprises a first channel aligned with the first passage, wherein the first soft lead further comprises a lead shield disposed within the first channel.

15. The gas turbine engine of claim 14 , wherein the frame further comprises a backplane and an enclosing wall extending perpendicular to the backplane, the enclosing wall having an inner face and an outer face, wherein the inner face defines a pocket, wherein the outer face and a sidewall of the cavity define a trench.

16. The gas turbine engine of claim 15 , wherein the pocket comprises a pocket wall.

17. The gas turbine engine of claim 15 , wherein the third material is disposed within the trench and the pocket.

18. The gas turbine engine of claim 17 , further comprising a cap comprising the second material disposed within the cavity over the third material.

19. The gas turbine engine of claim 18 , wherein the first material, the second material, and the third material comprise a monolithic structure.

20. A method of manufacturing a fully integral epoxy cap probe, the method comprising:

forming a cavity having a sidewall in a first material radially outward of a fan blade;

forming a frame comprising a backplane and an enclosing wall, the enclosing wall extending perpendicular to the backplane and defining a pocket radially inward of the enclosing wall, wherein the frame comprises a second material;

disposing the frame in the cavity such that the enclosing wall and the sidewall define a trench between the sidewall and the enclosing wall radially outward of the enclosing wall;

inserting a soft lead comprising a lead wire and a lead shield into the frame wherein the lead shield is disposed within the trench and the lead wire is disposed within the pocket;

filling the trench and the pocket with a third material and filling a remainder of the cavity with the second material; and

curing the first material, the second material, and the third material to form a monolithic structure.

Assignments (4)
CHANGE OF NAME Recorded Jul 27, 2023
From: RAYTHEON TECHNOLOGIES CORPORATION
To: RTX CORPORATION
Reel/Frame 064714/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE AND REMOVE PATENT APPLICATION NUMBER 11886281 AND ADD PATENT APPLICATION NUMBER 14846874. TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED AT REEL: 054062 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF ADDRESS. Recorded Mar 4, 2021
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 055659/0001 →
CHANGE OF NAME Recorded Sep 4, 2020
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 054062/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2017
From: WARREN, ELI COLE; WALSH, PETER J
To: UNITED TECHNOLOGIES CORPORATION
Reel/Frame 044302/0660 →
Continuity (1)
Related Publication 20190170495A1 · Jun 6, 2019