IP Library Granted Patent US 11,574,809
Granted Patent B2
US 11,574,809 · App. 15/832,255 · Granted Feb 7, 2023

Nitride semiconductor template and nitride semiconductor device

Inventors: Hajime Fujikura (Hitachi, JP); Taichiro Konno (Hitachi, JP); Hideto Miyake (Tsu, JP)
Assignees: SUMITOMO CHEMICAL COMPANY, LIMITED; MIE UNIVERSITY
H01L21/02502C30B25/02C30B29/38C30B29/403C30B29/68C30B33/02H01L21/0242H01L21/0243H01L21/0254H01L21/0262H01L21/02378H01L21/02433H01L21/02458H01L21/02694H01L21/3245H01L33/007
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Quick Facts
Patent No.
US 11,574,809
App. No.
15/832,255
Granted
Feb 7, 2023
Kind
B2
Abstract

There is provided a method for manufacturing a nitride semiconductor template constituted by forming a nitride semiconductor layer on a substrate, comprising: (a) forming a first layer by epitaxially growing a nitride semiconductor containing aluminum on the substrate; (b) applying annealing to the first layer in an inert gas atmosphere; and (c) forming a second layer by epitaxially growing a nitride semiconductor containing aluminum on the first layer by a vapor phase growth after performing (b), and constituting the nitride semiconductor layer by the first layer and the second layer.

Claims (15)

1. A nitride semiconductor template having a nitride semiconductor layer formed on a substrate,

the nitride semiconductor layer comprising:

a first layer formed on the substrate, made of nitride semiconductor containing aluminum, with a substrate-side surface being nitrogen polarity plane, and with a surface on a side opposing to the nitrogen polarity plane being a group-III polarity plane; and

a second layer formed on the group-III polarity plane of the first layer, and made of nitride semiconductor containing aluminum,

wherein the first layer and the second layer are distinguished depending on a difference of an impurity concentration,

an average dislocation density on a front surface of the first layer is 1×10 9 numbers/cm 2 or less,

an average dislocation density on a front surface of the second layer is 1×10 9 numbers/cm 2 or less, and

the substrate is a sapphire substrate or a silicon carbide substrate.

2. The nitride semiconductor template according to claim 1 , wherein

the first layer has a surface roughness RMS of the group-III polarity plane of 1 to 50 nm, and

the second layer has a surface roughness RMS of a front surface of 10 nm or less.

3. The nitride semiconductor template according to claim 1 , wherein the first layer and the second layer are made of aluminum nitride, indium aluminum nitride, aluminum gallium nitride, or aluminum gallium indium nitride which are represented by In 1-x-y Al x Ga y N (0≤x+y≤1, 0<x≤1, 0≤y≤1).

4. A nitride semiconductor device, comprising

the nitride semiconductor template of claim 1 , and

a nitride semiconductor lamination structure grown and formed on the nitride semiconductor template.

Assignments (2)
MERGER Recorded Nov 30, 2022
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 062019/0652 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2017
From: FUJIKURA, HAJIME; KONNO, TAICHIRO; MIYAKE, HIDETO
To: SCIOCS COMPANY LIMITED; SUMITOMO CHEMICAL COMPANY, LIMITED; MIE UNIVERSITY
Reel/Frame 044331/0132 →
Priority Claims (1)
JP JP2016-236873 · Dec 6, 2016 · national
Continuity (1)
Related Publication 20180158680A1 · Jun 7, 2018