IP Library › Granted Patent US 10,481,651
Granted Patent B2
US 10,481,651 · App. 15/834,173 · Granted Nov 19, 2019

Integrated PCU and GPU cooling system

Inventors: Ercan M. Dede (Ann Arbor, MI); Jongwon Shin (Ann Arbor, MI)
Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
G06F1/20G06F1/26H05K7/20927B60Y2306/05H05K7/209
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Quick Facts
Patent No.
US 10,481,651
App. No.
15/834,173
Granted
Nov 19, 2019
Kind
B2
Abstract

An electronics control system includes a power control unit disposed above a graphics processing unit and thermally connected to a cooling assembly inside. The system also includes a graphics processing unit disposed below the power control unit and thermally connected to the cooling assembly, an auxiliary DC-DC converter disposed below the power control unit and thermally connected to the cooling assembly, and a cooling assembly disposed at a predetermined location and configured to simultaneously transfer heat away from a power control unit, graphics processing unit, and auxiliary DC-DC converter via fluid circulation are presented.

Claims (16)

1. An electronics control system, comprising:

a cooling assembly;

a power controller thermally connected to a first side of the cooling assembly via a thermal interface material;

a processor thermally connected to a second side of the cooling assembly opposite the first side, the processor and the power controller are separated by at least one thermal spacer; and

an auxiliary DC-DC converter thermally connected to each of the cooling assembly and the processor, and the auxiliary DC-DC converter disposed between the cooling assembly and the processor, wherein

the cooling assembly is to simultaneously transfer heat away from the power controller and the processor, and

the auxiliary DC-DC converter and the cooling assembly are separated by the at least one thermal spacer, and the auxiliary DC-DC converter and the processor are separated by at least one heat sink thermally connected to the processor.

2. The electronics control system of claim 1 , further comprising:

a thermal transfer structure connecting the at least one heat sink and the at least one thermal spacer.

3. The electronics control system of claim 2 , wherein the processor is a graphical processor.

4. The electronics control system of claim 1 , wherein the processor is not independently powered.

5. The electronics control system of claim 1 , wherein the auxiliary DC-DC converter powers the processor.

6. The electronics control system of claim 1 , wherein the cooling assembly is to simultaneously cool the power controller, the processor, and the auxiliary DC-DC converter.

7. The electronics control system of claim 1 , wherein the processor is a graphical processor.

8. The electronics control system of claim 1 , further comprising:

a housing that houses the cooling assembly, the power controller, the processor, and the auxiliary DC-DC converter.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2019
From: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 051126/0239 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2017
From: DEDE, ERCAN M.; SHIN, JONGWON
To: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
Reel/Frame 044325/0753 →
Continuity (1)
Related Publication 20190179381A1 · Jun 13, 2019
Cited By (3)
US 12,457,716 US 12,608,167 US 12,707,602