Adhesive-bonded thermal interface structures
A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.
1. A method for attaching a heat sink to a heat-producing electronic device, wherein the heat-producing electronic device is a processor, one of the heat sink and the heat-producing electronic device having a first surface, the first surface having a protrusion of the heat sink extending away from the first surface, the protrusion including four contiguous sides that define an inner perimeter on the first surface, and the other of the heat sink and the heat-producing electronic device having a second surface, the method comprising:
aligning a pressure-sensitive adhesive (PSA) to the first surface, wherein the PSA is a double-sided adhesive tape;
applying the PSA to the first surface to form an outer perimeter;
applying, within the outer perimeter, a thermally conductive material to the first surface;
aligning the second surface to the first surface;
assembling the heat sink to the heat-producing electronic device by bringing the second surface into contact with the PSA; and
affixing the heat sink to the heat-producing electronic device by applying a compressive force to the heat sink and to the heat-producing electronic device, the compressive force activating the PSA,
wherein, once activated, the PSA holds the first surface in an adjacent, coplanar orientation to the second surface such that an outer cavity is formed, wherein the outer cavity is bounded by the outer perimeter, the first surface and the second surface, wherein a thermally conductive material is contained in an inner cavity fully enclosed within the outer cavity, the inner cavity fully enclosed by the inner perimeter, the first surface and the second surface, and wherein the thermally conductive material is configured to cool the heat-producing electronic device by providing a thermally conductive path between the first surface and the second surface.