IP Library Granted Patent US 10,877,118
Granted Patent B2
US 10,877,118 · App. 15/840,451 · Granted Dec 29, 2020

System and method for manufacturing magnetic resonance imaging gradient coil assemblies

Inventors: Jean-Baptiste Mathieu (Clifton Park, NY); Saban Kurucay (Menomonee Falls, WI); Thomas Kwok-Fah Foo (Clifton Park, NY); Yanzhe Yang (Schenectady, NY)
Assignee: GE Precision Healthcare LLC
G01R33/3858H01F41/04G01R33/3856
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Quick Facts
Patent No.
US 10,877,118
App. No.
15/840,451
Granted
Dec 29, 2020
Kind
B2
Abstract

The embodiments disclosed herein relate generally to magnetic resonance imaging systems and, more specifically, to the manufacturing of a gradient coil assembly for magnetic resonance imaging (MRI) systems. For example, in one embodiment, a method of manufacturing a gradient coil assembly for a magnetic resonance imaging system includes depositing a first layer comprising a base material onto a surface to form a substrate and depositing a second layer onto the first layer. The second layer may enable bonding between a conductor material and the substrate. The method also includes depositing a third layer onto the second layer using a consolidation process. The consolidation process uses the conductor material to form at least a portion of a gradient coil.

Claims (39)

1. A method of manufacturing, comprising:

producing a gradient coil assembly comprising one or more gradient coils for a magnetic resonance imaging system by an additive manufacturing process, wherein the additive manufacturing process comprises:

depositing a first layer comprising a base material onto a surface to form a substrate of the gradient coil assembly;

depositing a second layer onto the first layer, wherein the second layer is configured to enable bonding between a conductor material and the substrate, wherein depositing the second layer further comprises spraying or soldering a radio frequency shielding material onto the substrate to form a bonding layer; and

depositing a third layer onto the second layer using a consolidation process, wherein the consolidation process uses the conductor material to form at least a portion of an inductor.

2. The method of claim 1 , wherein depositing the first layer comprises:

depositing the base material onto the surface, wherein the base material comprises a composite ceramic material; and

curing the composite ceramic material to form a base layer.

3. The method of claim 1 , wherein the consolidation process forms the inductor as at least one of the one or more gradient coils and a resistive shim coil.

4. The method of claim 1 , wherein the consolidation process comprises:

depositing layers of the conductor material to form a consolidated structure;

forming a cooling channel in the consolidated structure; and

depositing additional layers of the conductor material to form the inductor.

5. The method of claim 1 , wherein the consolidation process uses ultrasound, a laser, an electron beam, or a combination thereof, to form a consolidated structure.

6. The method of claim 1 , comprising depositing a spacer onto the third layer, wherein the spacer is configured to isolate the one or more gradient coils from one or more conductors used to provide current to and from the one or more gradient coils, except at contact points between the one or more gradient coils and the one or more conductors where the current is provided to and from the one or more gradient coils.

7. The method of claim 6 , wherein the spacer comprises a dielectric material.

8. The method of claim 1 , wherein the substrate is cylindrical.

9. The method of claim 1 , comprising depositing a sacrificial material between the second layer and the third layer to form shim pockets.

10. The method of claim 1 , wherein the consolidation process forms an electrical connector, a coolant connector, or a combination thereof, coupled to the inductor without soldered or brazed joints.

11. A method of manufacturing, comprising:

producing a gradient coil assembly comprising one or more gradient coils for a magnetic resonance imaging system by a process, wherein the process comprises:

depositing a first layer comprising a base material onto a surface to form a substrate;

depositing a second layer onto the first layer, wherein the second layer is configured to enable bonding between a conductor material and the substrate, and depositing a second layer further comprises spraying or soldering a radio frequency shielding material onto the substrate to form a bonding layer; and

depositing a third layer onto the second layer using a consolidation process, wherein the consolidation process uses the conductor material to form at least a portion of an inductor.

12. The method of claim 11 , wherein the consolidation process forms the inductor as at least one of the one or more gradient coils and a resistive shim coil.

13. The method of claim 11 , further comprising depositing a spacer onto the third layer, wherein the spacer is configured to isolate the one or more gradient coils from one or more conductors used to provide current to and from the one or more gradient coils, except at contact points between the one or more gradient coils and the one or more conductors where the current is provided to and from the one or more gradient coils.

14. The method of claim 13 , wherein the spacer comprises a dielectric material.

15. The method of claim 11 , wherein the consolidation process forms an electrical connector, a coolant connector, or a combination thereof, coupled to the inductor without soldered or brazed joints.

16. A method of manufacturing, comprising:

producing a gradient coil assembly comprising one or more gradient coils for a magnetic resonance imaging system by a process, wherein the process comprises:

depositing a first layer comprising a base material onto a surface to form a substrate;

depositing a second layer onto the first layer, wherein the second layer is configured to enable bonding between a conductor material and the substrate; and

depositing a third layer onto the second layer using a consolidation process, wherein the consolidation process uses the conductor material to form at least a portion of an inductor, wherein the consolidation process comprises:

depositing layers of the conductor material to form a consolidated structure;

forming a cooling channel in the consolidated structure; and

depositing additional layers of the conductor material to form the inductor.

17. The method of claim 16 , wherein the consolidation process uses ultrasound, a laser, an electron beam, or a combination thereof, to form the consolidated structure.

18. The method of claim 16 , further comprising depositing a sacrificial material between the second layer and the third layer to form shim pockets.

19. The method of claim 16 , wherein the consolidation process forms an electrical connector, a coolant connector, or a combination thereof, coupled to the inductor without soldered or brazed joints.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2020
From: GENERAL ELECTRIC COMPANY
To: GE PRECISION HEALTHCARE LLC
Reel/Frame 052381/0908 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 13, 2017
From: MATHIEU, JEAN-BAPTISTE; KURUCAY, SABAN; FOO, THOMAS KWOK-FAH; YANG, YANZHE
To: GENERAL ELECTRIC COMPANY
Reel/Frame 044389/0205 →
Continuity (2)
Division 13859586 · Apr 9, 2013
Related Publication 20180100905A1 · Apr 12, 2018