Tunnel barrier schottky
A diode includes: a semiconductor substrate; a cathode metal layer contacting a bottom of the substrate; a semiconductor drift layer on the substrate; a graded aluminum gallium nitride (AlGaN) semiconductor barrier layer on the drift layer and having a larger bandgap than the drift layer, the barrier layer having a top surface and a bottom surface between the drift layer and the top surface, the barrier layer having an increasing aluminum composition from the bottom surface to the top surface; and an anode metal layer directly contacting the top surface of the barrier layer.
1. A method of making a semiconductor structure, comprising:
forming a semiconductor drift layer on a semiconductor substrate;
forming a nitride semiconductor barrier layer on the drift layer, the barrier layer having a larger bandgap than the drift layer, the barrier layer having a top surface and a bottom surface between the drift layer and the top surface, the forming of the barrier layer comprising grading a composition of the barrier layer so that the bandgap of the barrier layer increases from a portion of the barrier layer near the bottom surface to a portion of the barrier layer near the top surface; and
forming an ion implantation region at a peripheral portion of the barrier layer, leaving a non-ion implanted region at a central portion of the barrier layer.
2. The method of claim 1 , further comprising:
forming an anode metal layer contacting a top surface of the barrier layer, completely covering the non-ion implanted region at the central portion of the barrier layer, and overlapping the ion implantation region at the peripheral portion of the barrier layer.
3. The method of claim 1 , further comprising:
forming an anode metal layer contacting the top surface of the barrier layer; and
forming a cathode metal layer contacting a bottom of the substrate.
4. The method of claim 3 , wherein
the barrier layer comprises aluminum gallium nitride (AIGaN), and
the forming of the barrier layer comprises grading a composition of the barrier layer so that a composition of aluminum in the barrier layer increases from a portion of the barrier layer near the bottom surface to a portion of the barrier layer near the top surface.
5. The method of claim 1 , wherein the forming of the barrier layer comprises forming the barrier layer contacting the drift layer.
6. The method of claim 1 , further comprising forming a second semiconductor drift layer on the drift layer.
7. The method of claim 6 , wherein the second semiconductor drift layer has a lower doping concentration than the drift layer.
8. A method of making a semiconductor structure, comprising:
forming a semiconductor drift layer on a semiconductor substrate;
forming a nitride semiconductor barrier layer on the drift layer, the barrier layer having a larger bandgap than the drift layer, the barrier layer having a top surface and a bottom surface between the drift layer and the top surface, the forming of the barrier layer comprising grading a composition of the barrier layer so that the bandgap of the barrier layer increases from a portion of the barrier layer near the bottom surface to a portion of the barrier layer near the top surface;
forming an ion implantation region at edges of the barrier layer, leaving a single non-ion implanted region at a central portion of the barrier layer, and
forming an anode metal layer contacting a top surface of the barrier layer, completely covering the single non-ion implanted region at the central portion of the barrier layer, and overlapping the ion implantation region at the edge portion of the barrier layer.