IP Library Granted Patent US 11,396,688
Granted Patent B2
US 11,396,688 · App. 15/842,530 · Granted Jul 26, 2022

Cutting elements, and related structures and earth-boring tools

Inventors: Wanjun Cao (The Woodlands, TX); Marc W. Bird (Houston, TX)
Assignee: Baker Hughes Holdings LLC
C22C29/08B22F3/15B22F7/06B24D18/0009C22C29/005C22C29/067E21B10/5673E21B10/5735B22F2005/001B22F2998/10C22C26/00E21B10/55
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Quick Facts
Patent No.
US 11,396,688
App. No.
15/842,530
Granted
Jul 26, 2022
Kind
B2
Abstract

A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Al, Be, Ga, Ge, Si, and Sn, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Al, Be, Ga, Ge, Si, and Sn. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.

Claims (38)

1. A cutting element, comprising:

a supporting substrate comprising WC particles dispersed in a homogenized binder comprising Co within a range extending from 83 wt % Co to 98.75 wt % Co, W, C, and one or more of Be, Ga, Ge, Si, and Sn; and

a cutting table directly attached to an end of the supporting substrate, and comprising:

inter-bonded diamond particles; and

a thermally stable material within interstitial spaces between the inter-bonded diamond particles, the thermally stable material comprising κ-carbide precipitates.

2. A cutting element, comprising:

a supporting substrate comprising WC particles dispersed in a homogenized binder comprising Co within a range extending from 83 wt % Co to 98.75 wt % Co, W, C, and two or more of Al, Be, Ga, Ge, Si, and Sn; and

a cutting table directly attached to an end of the supporting substrate, and comprising:

inter-bonded diamond particles; and

a thermally stable material within interstitial spaces between the inter-bonded diamond particles, the thermally stable material comprising κ-carbide precipitates.

3. The cutting element of claim 2 , wherein at least some of the κ-carbide precipitates of the thermally stable material of the cutting table comprise Co, C, and two or more of Al, Be, Ga, Ge, Si, and Sn.

4. The cutting element of claim 2 , wherein the κ-carbide precipitates of the thermally stable material comprise one or more of Co 3 AlC 1-x precipitates, Co 3 (Al,Ga)C 1-x precipitates, Co 3 (Al,Sn)C 1-x precipitates, Co 3 (Al,Be)C 1-x precipitates, Co 3 (Al,Ge)C 1-x precipitates, Co 3 (Al,Si)C 1-x precipitates, Co 3 GaC 1-x precipitates, Co 3 (Ga,Sn)C 1-x precipitates, Co 3 (Ga,Be)C 1-x precipitates, Co 3 (Ga,Ge)C 1-x precipitates, Co 3 (Ga,Si)C 1-x precipitates, Co 3 SnC 1-x precipitates, Co 3 (Sn,Be)C 1-x precipitates, Co 3 (Sn,Ge)C 1-x precipitates, Co 3 SnSiC 1-x precipitates, Co 3 BeC 1-x precipitates, Co 3 (Be,Ge)C 1-x precipitates, Co 3 (Be,Si)C 1-x precipitates, Co 3 GeC 1-x precipitates, Co 3 (Ge,Si)C 1-x precipitates, and Co 3 SiC 1-x precipitates, wherein 0≤x≤0.5.

5. The cutting element of claim 2 , wherein the thermally stable material further comprises one or more of FCC L1 2 phase precipitates, FCC DO 22 phase precipitates, D8 5 phase precipitates, DO 19 phase precipitates, β phase precipitates, FCC L1 0 phase precipitates, WC precipitates, and M x C precipitates, where x>2 and M=Co,W.

6. The cutting element of claim 2 , wherein a ratio of a combined height of the supporting substrate and the cutting table to a maximum outer diameter of the cutting table is within a range of from about 0.1 to about 50.

7. The cutting element of claim 2 , wherein the cutting table exhibits a maximum thickness within a range of from about 0.3 mm to about 5 mm.

8. The cutting element of claim 2 , wherein the cutting table exhibits one or more chamfers individually having a width within a range of from about 0.001 inch to about 0.100 inch.

9. The cutting element of claim 2 , wherein the cutting table exhibits one or more radiused edges.

10. The cutting element of claim 2 , wherein the cutting table exhibits radiused edges and chamfered edges.

11. The cutting element of claim 2 , wherein the cutting table exhibits a substantially non-cylindrical shape.

12. The cutting element of claim 2 , wherein the cutting table exhibits a generally conical shape, a generally frusto-conical shape, a chisel shape, a generally hemispherical shape, or a generally semi-hemispherical shape.

13. The cutting element of claim 2 , wherein the cutting table comprises:

an apex; and

at least one side surface extending from at least one location at or proximate an interface between the supporting substrate and the cutting table toward the apex, the at least one side surface extending at at least one angle within a range of from about 5 degrees to about 85 degrees relative to a side surface of the supporting substrate.

14. The cutting element of claim 13 , wherein the at least one side surface of the cutting table comprises:

opposing conical side surfaces each individually extending upwardly and inwardly toward the apex; and

opposing flat side surfaces intervening between the opposing conical side surfaces, each of the opposing flat side surfaces individually extending upwardly and inwardly toward the apex.

15. The cutting element of claim 13 , wherein the apex of the cutting table is radiused.

16. The cutting element of claim 13 , wherein interfaces between the apex and the at least one side surface are one or more of at least partially chamfered and at least partially radiused.

17. The cutting element of claim 2 , wherein the cutting table comprises:

an apex; and

at least one at least partially arcuate side surface extending from at least one location at or proximate an interface between the supporting substrate and the cutting table toward the apex.

18. The cutting element of claim 17 , further comprising at least one flat side surface opposing the at least one at least partially arcuate side surface and extending from at least one other location at or proximate the interface between the supporting substrate and the cutting table toward the apex.

19. An earth-boring tool comprising the cutting element of claim 18 .

20. A cutting element, comprising:

a supporting substrate comprising WC particles dispersed in a homogenized binder comprising Co, W, C within a range extending from 0.25 wt % C to 2 wt % C, and one or more of Al, Be, Ga, Ge, Si, and Sn; and

a cutting table directly attached to an end of the supporting substrate and comprising:

inter-bonded diamond particles; and

a thermally stable material within interstitial spaces between the inter-bonded diamond particles, the thermally stable material comprising κ-carbide precipitates.

Assignments (3)
CHANGE OF NAME Recorded Dec 18, 2020
From: BAKER HUGHES, A GE COMPANY, LLC
To: BAKER HUGHES HOLDINGS LLC
Reel/Frame 054810/0716 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2018
From: BIRD, MARC W.
To: BAKER HUGHES, A GE COMPANY, LLC
Reel/Frame 045425/0731 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2017
From: CAO, WANJUN
To: BAKER HUGHES, A GE COMPANY, LLC
Reel/Frame 044402/0063 →
Continuity (2)
Continuation In Part 15594174 · May 12, 2017
Related Publication 20180327888A1 · Nov 15, 2018