Air void structures for semiconductor fabrication
Aspects of the disclosure provide for mechanisms for forming air voids for semiconductor fabrication. In accordance with some embodiments, a method for forming air voids may include forming a first semiconductor layer including a first group III material and a second group III material on a substrate; forming a plurality of air voids in the first semiconductor layer by removing at least a portion of the second group III material from the first semiconductor layer; and forming a second semiconductor layer on the first semiconductor layer. The second semiconductor layer may include an epitaxial layer of a group III-V material. In some embodiments, the first group III material and the second group III material may be gallium and indium, respectively.
1. A method, comprising:
forming a first semiconductor layer comprising a first group III material and a second group III material on a substrate, wherein the second group III material comprises indium;
forming a plurality of air voids in the first semiconductor layer, comprising:
flowing a gas flow comprising hydrogen gas to remove at least a portion of the second group III material from the first semiconductor layer, comprising:
flowing the gas flow to remove idium droplets from a surface of the first semiconductor layer; and
forming a second semiconductor layer on the first semiconductor layer, wherein the second semiconductor layer comprises an epitaxial layer of a group III-V material.
2. The method of claim 1 , wherein the first group III material comprises gallium.
3. The method of claim 1 , wherein forming the first semiconductor layer comprises initiating a process for epitaxial growth of the group III-V material.
4. The method of claim 3 , wherein the process for epitaxial growth of the group III-V material comprises at least one of a metal organic chemical vapor deposition (MOCVD) process or a molecular beam epitaxy (MBE) process.
5. The method of claim 1 , wherein forming the first semiconductor layer further comprises adjusting a temperature in a processing chamber to a first temperature, and wherein forming the plurality of air voids in the first semiconductor layer comprises adjusting the temperature in the processing chamber to a second temperature.
6. The method of claim 5 , wherein the second temperature is higher than the first temperature.
7. The method of claim 6 , wherein the first temperature is between 300° C. and 800° C.
8. The method of claim 6 , wherein the second temperature is higher than 800° C.
9. The method of claim 1 , wherein forming the first semiconductor layer comprises:
flowing a first precursor comprising the first group III material in a processing chamber; and
flowing a second precursor comprising the second group III material in the processing chamber.
10. The method of claim 9 , wherein the first precursor comprises at least one of triethylgallium (TEGa) or trimethylgallium (TMGa).
11. The method of claim 9 , wherein the second precursor comprises trimethylindium (TMIn).
12. The method of claim 9 , wherein forming the plurality of air voids in the first semiconductor layer further comprises:
stopping flowing the second precursor in the processing chamber.
13. The method of claim 1 , wherein the gas flow further comprises ammonia.
14. The method of claim 1 , wherein forming the second semiconductor layer further comprises growing an epitaxial layer of the group III-V material on the first semiconductor layer.
15. The method of claim 1 , wherein the group III-V material comprises the first group III material.
16. The method of claim 15 , wherein the III-V material comprises gallium nitride.
17. The method of claim 1 , wherein forming the first semiconductor layer comprises forming an InGaN layer.
18. The method of claim 1 , wherein forming the first semiconductor layer comprises forming a layer of the group III-V material.
19. The method of claim 1 , further comprising separating the second semiconductor layer from the substrate via the first semiconductor layer.