Computer circuit board cooling arrangement
A security arrangement ( 10 ) is adapted to improve heat dissipation from circuit board components ( 12, 14, 16, 18, 20 ) on a computer circuit board ( 22 ), where a plurality of the circuit components ( 12, 14, 16, 18, 20 ) are embedded in a security shield ( 5 ) and thermally connected to at least one heat exchanger device ( 24 ). The heat exchanger device ( 24 ) is located at a distance from the security shield ( 5 ), and at least a plurality of the circuit components ( 12, 14, 16, 18, 20 ) are thermally connected with said at least one heat exchanger device ( 24 ) via at least one heat dissipating lead ( 32, 33, 34 ) to enhance cooling of the circuit board components ( 12, 14, 16, 18, 20 ).
1. A security arrangement ( 10 ) adapted to improve heat dissipation from circuit board components ( 12 , 14 , 16 , 18 , 20 ) on a computer circuit board ( 22 ), wherein a plurality of said circuit components ( 12 , 14 , 16 , 18 , 20 ) are embedded in a security shield ( 5 ) formed by a potting on at least one surface of said circuit board ( 22 ) and thermally connected to at least one heat exchanger device ( 24 ), wherein said heat exchanger device ( 24 ) is located at a distance from said security shield ( 5 ), and that at least a plurality of said circuit components ( 12 , 14 , 16 , 18 , 20 ) are thermally connected with said at least one heat exchanger device ( 24 ) via at least one heat dissipating lead ( 32 , 33 , 34 ) to enhance cooling of said circuit board components ( 12 , 14 , 16 , 18 , 20 ), wherein said at least one heat dissipating lead ( 32 , 33 , 34 ) is formed as an elongated heat transferring member, having at least one part attached within said security shield ( 5 ) and another part thermally connected to said heat exchanger, wherein the at least one heat dissipating lead extends from within the potting to out of the potting.
2. A security arrangement according to claim 1 , wherein said at least one heat dissipating lead ( 32 , 33 , 34 ) forms a rod like member having one end thermally connected, in direct contact, to at least one heat sink device ( 26 , 28 , 30 ) in close proximity to at least one of said circuit board components ( 12 , 14 , 16 , 18 , 20 ).
3. A security arrangement according to claim 2 , wherein a plurality of heat dissipating leads ( 32 , 33 , 34 ) are arranged between a plurality of said heat sink devices ( 26 , 28 , 30 ) and said heat exchanger ( 24 ).
4. A security arrangement according to claim 2 , wherein said at least one heat dissipating lead ( 32 , 33 , 34 ) is in the form of a composite or solid rod or pipe having a thermal conductivity, above 200 W/mK, including at least one metal out of gold, silver or copper.
5. A security arrangement according to claim 1 , wherein said at least one heat dissipating lead ( 32 , 33 , 34 ) forms a loop like member.
6. A security arrangement according to claim 5 , wherein said loop like member is formed by a liquid filled tube, wherein said liquid is arranged to circulate to achieve cooling.
7. A security arrangement according to claim 1 , wherein said security shield ( 5 ) is formed by a potting enclosing all sides of said circuit board ( 22 ).
8. A security arrangement according to claim 7 , wherein said potting is constituted by an epoxy resin.
9. A security arrangement ( 10 ) according to claim 1 , wherein said security shield ( 5 ) further secures said components ( 12 , 14 , 16 , 18 , 20 ) to said circuit board ( 22 ).
10. A security arrangement ( 10 ) according to claim 7 , wherein said security shield has a minimum thickness (t) that is between 1 mm to 15 mm, and wherein preferably a thickest part of said security shield has a thickness that is between 2 t to 20 t, preferably 3 t to 10 t.
11. A security arrangement ( 10 ) according to claim 1 , wherein said security shield includes a-substantially enclosing box base.
12. A security arrangement ( 10 ) according to claim 11 , wherein said box includes or is in the form of a Faraday box, wherein preferably said Faraday box is embedded in a polymer or composite box.
13. A security arrangement ( 10 ) according to claim 11 , wherein said box includes or is in the form of a metal housing having a wall thickness of 2-10 mm.
14. A computer device ( 1 ), comprising a security arrangement ( 10 ) according to claim 1 .
15. The computer device of claim 1 , wherein the security shield secures components from intrusion.
16. A method for providing a security arrangement ( 10 ) adapted to improve heat dissipation from circuit board components ( 12 , 14 , 16 , 18 , 20 ) on a computer circuit board ( 22 ), comprising embedding a plurality of said circuit components ( 12 , 14 , 16 , 18 , 20 ) in a security shield ( 5 ) formed by a potting having inherent low thermal conductivity on at least one surface of said circuit board ( 22 ) and thermally connecting said circuit components ( 12 , 14 , 16 , 18 , 20 ) to at least one heat exchanger device ( 24 ), by locating said heat exchanger device ( 24 ) at a distance from said security shield ( 5 ), and thermally connecting at least a plurality of said circuit components ( 12 , 14 , 16 , 18 , 20 ) with said at least one heat exchanger device ( 24 ) via at least one heat dissipating lead ( 32 , 33 , 34 ) to enhance cooling of said secured circuit board components ( 12 , 14 , 16 , 18 , 20 ), and wherein said at least one heat dissipating lead ( 32 , 33 , 34 ) is formed as an elongated heat transferring member, having at least one part attached within said security shield ( 5 ) and another part thermally connected to said heat exchanger, wherein the at least one heat dissipating lead extends from within the potting to out of the potting.