Display device and method of manufacturing the same
A display device including: a flexible substrate having a first surface and a second surface opposite the first surface; a display unit arranged on the first surface of the flexible substrate; and a lower protective film arranged on the second surface and including a base film, an adhesive layer arranged on one side of the base film, a light-shielding layer arranged on the other side of the base film, and a conductive material layer interposed between the base film and the light-shielding layer.
1. A display device comprising:
a flexible substrate comprising a first surface and a second surface opposite the first surface;
a display unit arranged on the first surface of the flexible substrate; and
a lower protective film arranged on the second surface and comprising a base film, an adhesive layer arranged on one side of the base film, a light-shielding layer arranged on an other side of the base film, and a conductive material layer interposed between the base film and the light-shielding layer.
2. The display device of claim 1 , wherein
the conductive material layer comprises a first organic material and conductive particles dispersed in the first organic material.
3. The display device of claim 2 , wherein
the light-shielding layer comprises a second organic material and light-shielding particles dispersed in the second organic material.
4. The display device of claim 3 , wherein
the first organic material and the second organic material comprise an identical material.
5. The display device of claim 3 , wherein
the light-shielding layer is disposed directly on the conductive material layer.
6. The display device of claim 5 , wherein
the light-shielding layer is coated on the conductive material layer by using a thermal transfer method.
7. The display device of claim 1 , wherein
the base film, the conductive material layer, and the light-shielding layer are sequentially stacked on the adhesive layer and are integrally formed, and the adhesive layer is in direct contact with the second surface of the flexible substrate.
8. The display device of claim 1 , wherein
the light-shielding layer has a thickness of about 1 μm to about 3 μm.
9. The display device of claim 1 , wherein
the base film comprises an organic material that is flexible.
10. The display device of claim 1 , further comprising:
a heat dissipation layer disposed on a side of the light-shielding layer that is away from the display unit, and a shock absorbing layer interposed between the light-shielding layer and the heat dissipation layer.
11. A method of manufacturing a display device, the method comprising:
manufacturing a display panel by preparing a flexible substrate comprising a first surface and a second surface opposite the first surface, and forming a display unit on the first surface of the flexible substrate;
forming a lower protective film by forming a base film and an adhesive layer on one side of the base film, forming a conductive material layer on the other side of the base film, and forming a light-shielding layer on the conductive material layer; and
attaching the lower protective film on the second surface.
12. The method of claim 11 , wherein
the conductive material layer comprises a first organic material and conductive particles dispersed in the first organic material.
13. The method of claim 12 , wherein
the light-shielding layer comprises a second organic material and light-shielding particles dispersed in the second organic material.
14. The method of claim 13 , wherein
the first organic material and the second organic material comprise an identical material.
15. The method of claim 13 , wherein
the light-shielding layer is disposed directly on the conductive material layer.
16. The method of claim 15 , wherein
the light-shielding layer is formed on the conductive material layer by using a thermal transfer method.
17. The method of claim 11 , wherein
the base film, the adhesive layer, the conductive material layer, and the light-shielding layer of the lower protective film are integrally formed.
18. The method of claim 11 , wherein
the light-shielding layer has a thickness of about 1 μm to about 3 μm.
19. The method of claim 11 , wherein
the base film comprises an organic material that is flexible.
20. The method of claim 11 , further comprising:
disposing a heat dissipation layer on a side of the light-shielding layer that is away from the display panel; and
disposing a shock absorbing layer on a side of the heat dissipation layer that is away from the light-shielding layer.