Semiconductor device and method of manufacturing the same
Provided herein may be a semiconductor device. The semiconductor device may include a first substrate, a second substrate disposed on the first substrate, a stack which is disposed on the second substrate and includes stacked memory cells, and a discharge contact structure electrically coupling the second substrate with the first substrate such that charges in the second substrate are discharged to the first substrate.
1. A semiconductor device comprising:
a first substrate;
a second substrate disposed over the first substrate;
a stack with stacked memory cells disposed on the second substrate; and
a discharge contact structure electrically coupling the second substrate with the first substrate, wherein charges in the second substrate are discharged to the first substrate,
wherein the second substrate comprises a well region, and an erase bias is applied to the well region of the second substrate through the discharge contact structure.
2. The semiconductor device according to claim 1 , wherein the discharge contact structure comprises one or more contact plugs that contact with a front surface of the first substrate and a rear surface of the second substrate.
3. The semiconductor device according to claim 2 , wherein the stack comprises channel structures passing through the stack, and the contact plugs are disposed between the channel structures.
4. The semiconductor device according to claim 1 , wherein the first substrate comprises a junction that contacts with the discharge contact structure.
5. The semiconductor device according to claim 1 , further comprising:
a peripheral circuit formed on the first substrate.
6. The semiconductor device according to claim 1 , wherein each of the first substrate and the second substrate is a semiconductor substrate.
7. The semiconductor device according to claim 1 , wherein the discharge contact structure is disposed below the memory cells.
8. The semiconductor device according to claim 1 , further comprising:
an erase contact structure electrically coupling the second substrate with the first substrate, wherein the erase bias is applied to the well region of the second substrate.
9. A semiconductor device comprising:
a first substrate;
a second substrate disposed over the first substrate; and
a discharge contact structure electrically coupling the second substrate with the first substrate, wherein charges in the second substrate are discharged to the first substrate,
wherein the discharge contact structure is a passage for discharging the charges of the second substrate and a passage for applying an erase bias.
10. The semiconductor device according to claim 1 , wherein the stack includes conductive layers and insulating layers that are alternately stacked.
11. The semiconductor device according to claim 8 , wherein the erase contact structure comprises:
a first contact plug electrically coupled with a front surface of the second substrate;
a second contact plug electrically coupled with the front surface of the first substrate; and
a line electrically coupling the first contact plug with the second contact plug.
12. The semiconductor device according to claim 8 ,
wherein the stack comprises a cell region including the memory cells, and a contact region patterned in a stepped shape, and
wherein the discharge contact structure is disposed below the cell region, and the erase contact structure is disposed below the contact region.
13. The semiconductor device according to claim 12 ,
wherein the erase contact structure includes one or more contact plugs so that the contact plugs contact with a front surface of the first substrate and a rear surface of the second substrate.
14. The semiconductor device according to claim 1 ,
wherein the stack comprises a cell region including the memory cells, and a contact region patterned in a stepped shape, and
wherein the discharge contact structure is disposed below the contact region.
15. The semiconductor device according to claim 14 , further comprising:
an erase contact structure electrically coupling the second substrate with the first substrate, wherein an erase bias is applied to a well region of the second substrate.
16. The semiconductor device according to claim 15 , wherein the erase contact structure comprises:
a first contact plug electrically coupled with a front surface of the second substrate and disposed over the discharge contact structure;
a second contact plug electrically coupled with a front surface of the first substrate; and
a line electrically coupling the first contact plug with the second contact plug.
17. The semiconductor device according to claim 1 , wherein the discharge contact structure comprises:
a first contact plug electrically coupled with a front surface of the first substrate;
a second contact plug electrically coupled with a rear surface of the second substrate; and
a line electrically coupling the first contact plug with the second contact plug.
18. The semiconductor device according to claim 9 , wherein the discharge contact structure comprises one or more contact plugs that contact with a front surface of the first substrate and a rear surface of the second substrate.
19. The semiconductor device according to claim 9 , further comprising:
stacked memory cells over the second substrate, wherein the discharge contact structure is disposed below the memory cells.