Solid-state imaging device

1. A solid-state imaging device comprising:

a detector substrate having a first main-surface, on which a plurality of first lands are arranged in a matrix;

a signal-circuit substrate having a second main-surface, on which plurality of second lands are arranged so as to face the arrangement of the first lands; and

a plurality of tubular bumps, each of which having a flattened plane pattern, and is provided between each of the plurality of first lands and each of the plurality of second lands, the plurality of tubular bumps respectively having major-axis directions to define inclined angles, being arranged in the matrix such that the inclined angles differ depending on locations of the plurality of tubular bumps.

2. The solid-state imaging device of claim 1 , wherein the second main-surface shares a common center with the first main-surface in a plane pattern.

3. The solid-state imaging device of claim 2 , wherein at least a part of the plurality of tubular bumps implement a linear arrangement such that the major-axis directions of the plurality of tubular bumps are respectively aligned with a specified line radiating from the center.

4. The solid-state imaging device of claim 3 , wherein the detector substrate further has a plurality of solid-state detectors arranged in the matrix,

and wherein the plurality of first lands are arranged in the matrix on the first main-surface corresponding to positions of the plurality of solid-state detectors.

5. The solid-state imaging device of claim 4 , wherein the signal-circuit substrate further has signal read-out circuits arranged in the matrix for reading out signals from the plurality of solid-state detectors.

6. The solid-state imaging device of claim 2 , wherein

a region where the plurality of tubular bumps is arranged is divided into a plurality of regions according to a plurality of lines radiating from the center, and

first tubular bumps of the plurality of tubular bumps are arranged linearly in each of the plurality of regions such that a major-axis direction of the first tubular bumps is aligned with each of the specified lines, each of the specified lines being a central line of each of the plurality of regions.

7. The solid-state imaging device of claim 6 , wherein

second tubular bumps of the plurality of tubular bumps are arranged in each of the plurality of regions at an inclined angle identical to that of the first tubular bumps on each of the specified lines.

8. The solid-state imaging device of claim 2 , wherein

on the specified lines radiating from the center, the major-axis directions of the plurality of tubular bumps are respectively in line with directions of thermal stress due to a difference in coefficient of thermal expansion between the signal-circuit substrate and the detector substrate.

9. The solid-state imaging device of claim 1 , wherein

each of the plurality of tubular bumps includes a tubular side wall having a first end connected to each of the plurality of second lands and having a second end connected to each of the plurality of first lands, and

the tubular side wall along a major-axis direction thereof is thinner than the tubular side wall along a minor-axis direction orthogonal to the major-axis direction.

10. The solid-state imaging device of claim 9 , wherein the tubular side wall has inner and outer peripheries decreasing toward the second end from the first end.

11. The solid-state imaging device of claim 10 , wherein the tubular side wall has a minimum thickness at the second end.