Apparatus for spin injection enhancement and method of making the same
A switching device is disclosed. The switching device includes a spin-orbit coupling (SOC) layer, a pure spin conductor (PSC) layer disposed atop the SOC layer, a ferromagnetic (FM) layer disposed atop the PSC layer, and a normal metal (NM) layer sandwiched between the PSC layer and the FM layer. The PSC layer is a ferromagnetic insulator (FMI) is configured to funnel spins from the SOC layer onto the NM layer and to further provide a charge insulation so as to substantially eliminate current shunting from the SOC layer while allowing spins to pass through. The NM layer is configured to funnel spins from the PSC layer into the FM layer.
1. A switching device, comprising:
a spin-orbit coupling (SOC) layer;
a pure spin conductor (PSC) layer disposed atop the SOC layer; and
a ferromagnetic (FM) layer disposed atop the PSC layer,
the PSC layer is a ferromagnetic insulator (FMI) configured to funnel spins from the SOC layer onto the FM layer and to further provide a charge insulation so as to substantially eliminate current shunting from the SOC layer while allowing spins to pass through.
2. The switching device of claim 1 , further comprising a first terminal disposed near a first end of the SOC layer and a second terminal disposed near a second end of the SOC layer.
3. The switching device of claim 2 , the SOC layer comprises a Giant Spin Hall Effect (GSHE) material.
4. The switching device of claim 3 , further comprising a normal metal (NM) layer sandwiched between the PSC layer and the FM layer, the NM layer configured to funnel spins from the PSC layer into the FM layer, and wherein the NM layer has a resistivity of between about 1.5×10 −8 Ω·m. to about 3.0×10 −8 Ω·m.
5. The switching device of claim 2 , wherein the ratio of J s /(θ SH J c ) as a function of spin diffusion length (λ n ) is substantially the same based on a charge current density flowing in the SOC layer (J′ c ) as compared to a charge current density flowing through the first and second terminals (J c ).
6. A method of manufacturing a switching device, comprising:
providing a substrate;
applying a spin-orbit coupling (SOC) layer atop the substrate;
applying a pure spin conductor (PSC) layer atop the SOC layer, generating an intermediate device;
patterning the intermediate device so that the area of the PSC layer is a fraction of the area of the SOC layer;
applying a first terminal disposed near a first end of the SOC layer and a second terminal disposed near a second end of the SOC layer; and
applying a ferromagnetic (FM) layer disposed atop the PSC layer, the PSC layer is a ferromagnetic insulator (FMI) configured to funnel spins from the SOC layer onto the FM layer and to further provide a charge insulation so as to substantially eliminate current shunting from the SOC layer while allowing spins to pass through.
7. The method of claim 6 , the SOC layer comprises a Giant Spin Hall Effect (GSHE) material.
8. The method of claim 6 , further comprising the step of applying a normal metal (NM) layer atop the PSC layer after the step of applying the PSC layer, such that the patterning step results in the NM layer to have substantially the same area as that of the PSC layer.
9. The method of claim 8 , the NM layer has a resistivity of between about 1.5×10 −8 Ω·m. to about 3.0×10 −8 Ω·m.
10. The method of claim 9 , wherein the NM layer comprises one of copper, aluminum, silver, gold, or an alloy constituting a combination thereof.