IP Library › Granted Patent US 10,752,809
Granted Patent B2
US 10,752,809 · App. 15/852,712 · Granted Aug 25, 2020

Reusable attaching apparatus and methods of making and using a reusable attaching apparatus

Inventors: Seok Kim (Champaign, IL); Jeffrey D. Eisenhaure (Champaign, IL); Jun Kyu Park (Champaign, IL)
Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
C09J7/35B29C65/02B29C65/48C09J5/06C09J9/00F16B1/0014F16B11/006F16B47/003C09J163/00C09J2205/302C09J2463/00
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Quick Facts
Patent No.
US 10,752,809
App. No.
15/852,712
Granted
Aug 25, 2020
Kind
B2
Abstract

A reusable attaching apparatus includes (a) a reversible adhesive comprising a shape memory polymer and (b) a mounting structure bonded to the reversible adhesive. The shape memory polymer has a glass transition temperature (T g ) and comprises a deformable state at temperatures above the T g and a rigid state at temperatures below the T g .

Claims (33)

1. A reusable attaching apparatus comprising:

a reversible adhesive comprising a shape memory polymer having a glass transition temperature (T g ) and comprising a deformable state at temperatures above the T g and a rigid state at temperatures below the T g ; and

a mounting structure bonded to the reversible adhesive,

wherein the shape memory polymer is prepared from a formulation comprising a shape memory polymer precursor and a crosslinking agent, the shape memory polymer precursor comprising a mixture of at least two epoxy monomers each having a different molecular weight, wherein an average molecular weight of the mixture is at least 400 g/mol.

2. The reusable attaching apparatus of claim 1 , wherein the shape memory polymer comprises a polymer selected from the group consisting of: polyepoxide, polyurethane, poly(ethylene-co-vinyl acetate) and polycyclooctene.

3. The reusable attaching apparatus of claim 1 , wherein the mounting structure includes one or more of the following: hook, bracket and peg.

4. The reusable attaching apparatus of claim 1 , further comprising an internal heating element embedded in the reversible adhesive.

5. The reusable attaching apparatus of claim 1 , wherein the reversible adhesive exhibits an adhesion strength of at least about 1 MPa.

6. The reusable attaching apparatus of claim 1 , wherein the shape memory polymer comprises a storage modulus of about 4 MPa or less in the deformable state.

7. The reusable attaching apparatus of claim 6 , wherein the storage modulus is about 2 MPa or less in the deformable state.

8. A method of fabricating a reusable attaching apparatus, the method comprising:

forming a reversible adhesive comprising a shape memory polymer having a glass transition temperature (T g ) and comprising a deformable state at temperatures above the T g and a rigid state at temperatures below the T g ; and

during or after the forming, bonding a mounting structure to the reversible adhesive,

wherein forming the reversible adhesive comprises:

preparing a formulation comprising a shape memory polymer precursor and a crosslinking agent, the shape memory polymer precursor comprising a mixture of at least two epoxy monomers each having a different molecular weight, wherein an average molecular weight of the mixture is at least 400 g/mol; and

curing the formulation to form the shape memory polymer.

9. The method of claim 8 , wherein a molar ratio of the shape memory polymer precursor to the crosslinking agent is from about 0.5:1 to about 1.5:1.

10. The method of claim 8 , wherein the bonding of the mounting structure occurs after forming the reversible adhesive and comprises:

placing a bonding agent between the reversible adhesive and the mounting structure; and

curing or drying the bonding agent.

11. The method of claim 8 , wherein the bonding of the mounting structure occurs during the formation of the reversible adhesive and comprises:

contacting the mounting structure with the formulation during curing, the mounting structure being bonded to the reversible adhesive as the curing is completed.

12. The method of claim 11 , wherein the mounting structure includes holes, indentations or protrusions into which or about which the shape memory polymer precursor may flow, thereby promoting attachment of the mounting structure to the reversible adhesive upon curing.

13. The method of claim 8 , wherein an internal heating element is added to the formulation prior to curing, thereby embedding the internal heating element in the reversible adhesive upon curing.

14. The method of claim 8 , wherein the mounting structure includes one or more of the following: hook, bracket and peg.

15. A reusable attaching apparatus comprising:

a reversible adhesive comprising a shape memory polymer having a glass transition temperature (T g ) and comprising a deformable state at temperatures above the T g and a rigid state at temperatures below the T g ; and

a mounting structure bonded to the reversible adhesive,

wherein the shape memory polymer is prepared from a formulation comprising a shape memory polymer precursor comprising a mixture of at least two epoxy monomers each having a different molecular weight; and a crosslinking agent, and

wherein a first of the epoxy monomers has a molecular weight of 362 g/mole and a second of the epoxy monomers has a molecular weight of 1075 g/mol.

16. The reusable attaching apparatus of claim 15 , wherein the shape memory polymer comprises a storage modulus of about 4 MPa or less in the deformable state.

17. The reusable attaching apparatus of claim 16 , wherein the storage modulus is about 2 MPa or less in the deformable state.

18. The reusable attaching apparatus of claim 15 , wherein the mounting structure includes one or more of the following: hook, bracket and peg.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2018
From: KIM, SEOK; EISENHAURE, JEFFREY D.; PARK, JUN KYU
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 044783/0330 →
Continuity (2)
Provisional Application 62438738 · Dec 23, 2016
Related Publication 20180179421A1 · Jun 28, 2018