Precursor composition, photosensitive resin composition, method for producing precursor composition, cured film, method for producing cured film, and semiconductor device

1. A photosensitive resin composition comprising:

at least one kind of heterocycle-containing polymer precursor, and

a photoradical polymerization initiator,

wherein the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor, and

the dispersity, which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor, is from 2.5 to 3.1, wherein the heterocycle-containing polymer precursor has a polymerizable unsaturated group.

2. The photosensitive resin composition according to claim 1 ,

wherein the dispersity is from 2.8 to 3.1.

3. The photosensitive resin composition according to claim 1 ,

wherein two or more kinds of heterocycle-containing polymer precursors having a difference in at least one of the weight-average molecular weight or a constituting repeating unit are included as the heterocycle-containing polymer precursor.

4. The photosensitive resin composition according to claim 1 ,

wherein the at least one kind of heterocycle-containing polymer precursor is a precursor having a repeating unit represented by General Formula (1-1),

in General Formula (1-1), A 1 and A 2 each independently represent an oxygen atom or NH, R 111 represents a divalent organic group, R 112 represents a single bond or a divalent group, and R 113 and R 114 each independently represent a hydrogen atom or a monovalent organic group.

5. The photosensitive resin composition according to claim 4 ,

wherein at least one of A 1 or A 2 is an oxygen atom.

6. The photosensitive resin composition according to claim 4 ,

wherein R 112 is a single bond, or a group selected from a hydrocarbon group having 1 to 10 carbon atoms, which may be substituted with a fluorine atom, —O—, —C(═O)—, —S—, —SO 2 —, —NHCO—, and a combination thereof.

7. The photosensitive resin composition:

according to claim 1 , further comprising a photoacid generator.

8. The photosensitive resin composition according to claim 1 , further comprising:

a curable compound.

9. The photosensitive resin composition according to claim 8 ,

wherein the curable compound includes a compound having an ethylenically unsaturated bond.

10. The photosensitive resin composition according to claim 8 ,

wherein the curable compound is a compound having two or more ethylenically unsaturated groups.

11. The photosensitive resin composition according to claim 1 , which is used for forming an interlayer insulating film for a re-wiring layer.

12. A method for producing the precursor composition according to claim 1 , comprising:

using two or more kinds of heterocycle-containing polymer precursors having different weight-average molecular weights as the heterocycle-containing polymer precursor,

wherein the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor.

13. A cured film formed by curing the precursor composition according to claim 1 .

14. The cured film according to claim 13 , which is an interlayer insulating film for a re-wiring layer.

15. A method for producing a cured film, comprising:

using the precursor composition according to claim 1 .

16. The method for producing a cured film according to claim 15 , comprising:

applying the precursor composition or the photosensitive resin composition onto a substrate; and

curing the precursor composition or the photosensitive resin composition applied onto the substrate.

17. A semiconductor device comprising:

the cured film according to claim 13 .