Flexible display device and method for manufacturing the same
A flexible display device comprises a substrate having a flat portion and a curved portion, wherein a pixel array is provided in the flat portion and a pad portion connected to the pixel array is provided in the curved portion; and an encapsulation layer provided on the substrate to cover the pixel array, wherein the encapsulation layer comprises a terminal portion; an Integrated Circuit (IC) portion having at least one driving IC; and a lead portion having leads which connect the terminal portion and the driving IC portion, and wherein the curved portion of the substrate is bent so that the pad portion and the terminal portion are in contact with each other.
1. A flexible display device comprising: a substrate having a flat portion and a curved portion; a pad portion; wherein a pixel array formed on the flat portion, and the pad portion electrically connecting the pixel array and the curved portion of the substrate; and an encapsulation layer on the substrate and covering the pixel array, wherein the encapsulation layer comprises: a terminal portion; an integrated circuit (IC) portion having at least one driving IC; and a lead portion having a plurality of leads which connect the terminal portion and the at least one driving IC portion, wherein the curved portion of the substrate is bent so that the pad portion and the terminal portion are in electrical contact with each other.
2. The flexible display device of claim 1 , further comprising:
a printed circuit board (PCB); and
a first connection member connecting the PCB and the encapsulation layer to transmit a signal to the driving IC.
3. The flexible display device of claim 1 , wherein the encapsulation layer further comprises an element portion which has a capacitor and a resistor.
4. The flexible display device of claim 3 , further comprising:
a system board; and
a second connection member connecting the system board and the encapsulation layer to transmit a signal to the element portion and the driving IC.
5. The flexible display device of claim 1 , wherein the encapsulation layer includes a single layer or multi-layers selected from the group consisting of COP (cyclic olefin polymer), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PC (polycarbonate), PI (polyimide), PTFE (polytetrafluoroethylene), PE (polyethylene), HDPE (high density polyethylene), PP (polypropylene), PES (polyethersulfone), PS (polystyrene), PVC (polyvinyl chloride).
6. The flexible display device of claim 1 , wherein the encapsulation layer comprises a metal material and an insulation material on the metal material.
7. The flexible display device of claim 1 , wherein the encapsulation layer includes multi-layers in which an inorganic insulation material and an organic insulation material are deposited alternatively.
8. The flexible display device of claim 1 , comprising a plurality of driving ICs, wherein the driving ICs are alternately arranged in a horizontal direction.
9. The flexible display device of claim 1 , further comprising:
a resin filled in an inner space formed by the curved portion.
10. The flexible display device of claim 1 , wherein the curved portion has a portion vertically overlapping the flat portion.
11. The flexible display device of claim 1 , wherein the terminal portion and the pad portion are connected through an anisotropic conductive film layer.
12. The flexible display device of claim 1 , wherein the lead portion includes a plurality of input leads and a plurality of output leads.
13. The flexible display device of claim 12 , wherein the plurality of input leads and the plurality of the output leads are distributed sufficient enough on the encapsulation layer not to restrict change in state of the display device.
14. The flexible display device of claim 12 , wherein the plurality of input leads and the plurality of output leads are arranged with a distance enough from each other to minimize a signal interference therebetween.
15. The flexible display device of claim 12 , wherein the plurality of input leads and the plurality of output leads are formed to have a width wide enough to minimize a line resistance.
16. A method for manufacturing a flexible display device, comprising:
attaching a substrate on a support substrate having a specific rigidity;
forming a pixel array and a pad portion connected to the pixel array on the substrate, and forming an encapsulation layer covering the pixel array;
forming a terminal portion, an integrated circuit (IC) portion, and a lead portion on the encapsulation layer;
removing the support substrate;
bending an end portion of the substrate, in which the pad portion is provided, to align the pad portion on the substrate and the terminal portion on the encapsulation layer; and
bonding the pad portion and the terminal portion with an anisotropic conductive film (ACF) layer therebetween.
17. The method of claim 16 , further comprising a laser lift off process prior to the bonding process.
18. The method of claim 16 , wherein the bonding process is performed on the encapsulation layer.
19. A flexible display device comprising: a substrate having a flat portion and a curved portion; a pixel array; a pad portion; wherein the pad portion is formed on the curved portion of a non-display region and electrically connects the pixel array and the curved portion of the substrate; an encapsulation layer on the substrate and covering the pixel array, wherein the encapsulation layer includes a terminal portion and an integrated circuit portion, and the terminal portion and the pad portion are in electrical contact with each other; and a plurality of input leads and a plurality of output leads connecting the terminal portion and the integrated circuit portion, wherein the plurality of input leads and the plurality of the output leads are distributed sufficient enough on the encapsulation layer not to restrict change in state of the flexible display device.
20. The flexible display device of claim 19 , further comprising at least one of a first connection member connecting a printed circuit board and the encapsulation layer to transmit a signal to the integrated circuit portion or a second connection member connected to a system board disposed outside the substrate.