IP Library › Granted Patent US 10,403,491
Granted Patent B2
US 10,403,491 · App. 15/854,778 · Granted Sep 3, 2019

Method for treating pattern structure, method for manufacturing electronic device, and treatment liquid for inhibiting collapse of pattern structure

Inventors: Atsushi Mizutani (Shizuoka, JP); Tadashi Inaba (Shizuoka, JP)
Assignee: FUJIFILM Corporation
H01L21/0206B08B3/08B81C1/00952C08K3/16C08K5/17H01L21/02057H01L21/02071B81B2203/0361B81B2207/056
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Quick Facts
Patent No.
US 10,403,491
App. No.
15/854,778
Granted
Sep 3, 2019
Kind
B2
Abstract

Provided are a method for treating a pattern structure which is capable of inhibiting collapse of a pattern structure, a method for manufacturing an electronic device including such a treatment method, and a treatment liquid for inhibiting collapse of a pattern structure. The method for treating a pattern structure includes applying a treatment liquid containing a fluorine-based polymer having a repeating unit containing a fluorine atom to a pattern structure formed of an inorganic material.

Claims (34)

1. A method for treating a pattern structure, comprising:

applying a treatment liquid containing a fluorine-based polymer having a repeating unit containing a fluorine atom to the pattern structure formed of an inorganic material, wherein the fluorine-based polymer includes a fluoroalkyl (meth)acrylate polymer, and the fluoroalkyl (meth)acrylate polymer has a repeating unit derived from a polymerizable compound having a cationic group.

2. The method for treating a pattern structure according to claim 1 , wherein the treatment liquid includes water.

3. The method for treating a pattern structure according to claim 1 , wherein the pattern structure includes at least one selected from the group consisting of Si, SiO 2 , SiN, Ge, and SiGe.

4. The method for treating a pattern structure according to claim 1 , wherein the pattern structure includes all of Si, SiO 2 , and SiN.

5. The method for treating a pattern structure according to claim 1 , wherein the treatment liquid has a pH of 11 or less.

6. The method for treating a pattern structure according to claim 1 , wherein the treatment liquid has a pH of 4 or more and 11 or less.

7. The method for treating a pattern structure according to claim 1 , wherein the treatment liquid further contains a buffer.

8. The method for treating a pattern structure according to claim 1 , wherein a rinsing liquid containing an organic solvent is applied to the pattern structure to which the treatment liquid has been applied.

9. A method for manufacturing an electronic device, comprising:

the method for treating a pattern structure according to claim 1 .

10. A treatment liquid for inhibiting collapse of a pattern structure, comprising:

a fluorine-based polymer having a repeating unit containing a fluorine atom, wherein the treatment liquid is applied to the pattern structure formed of an inorganic material, the fluorine-based polymer includes a fluoroalkyl (meth)acrylate polymer and the fluorine-based polymer has a repeating unit derived from a polymerizable compound having a cationic group.

11. The treatment liquid for inhibiting collapse of a pattern structure according to claim 10 , further comprising:

water.

12. The treatment liquid for inhibiting collapse of a pattern structure according to claim 10 , wherein the pattern structure includes at least one selected from the group consisting of Si, SiO 2 , SiN, Ge, and SiGe.

13. The treatment liquid for inhibiting collapse of a pattern structure according to claim 10 , wherein the pattern structure includes all of Si, SiO 2 , and SiN.

14. The treatment liquid for inhibiting collapse of a pattern structure according to claim 10 , wherein the treatment liquid has a pH of 11 or less.

15. The treatment liquid for inhibiting collapse of a pattern structure according to claim 10 , wherein the treatment liquid has a pH of 4 or more and 11 or less.

16. The treatment liquid for inhibiting collapse of a pattern structure according to claim 10 , further comprising:

a buffer.

17. A treatment liquid for inhibiting collapse of a pattern structure, comprising:

a fluorine-based polymer having a repeating unit containing a fluorine atom, wherein the treatment liquid is applied to the pattern structure formed of an inorganic material, and

wherein the treatment liquid contains an alkanol having a surface tension of 30 mN/m or less, the fluorine-based polymer includes a fluoroalkyl (meth)acrylate polymer, and the fluoroalkyl (meth)acrylate polymer has a repeating unit derived from a polymerizable compound having a cationic group.

18. The treatment liquid for inhibiting collapse of a pattern structure according to claim 17 , further comprising:

water.

19. The treatment liquid for inhibiting collapse of a pattern structure according to claim 17 , wherein the pattern structure includes at least one selected from the group consisting of Si, SiO 2 , SiN, Ge, and SiGe.

20. The treatment liquid for inhibiting collapse of a pattern structure according to claim 17 wherein the pattern structure includes all of Si, SiO 2 , and SiN.

21. The treatment liquid for inhibiting collapse of a pattern structure according to claim 17 , wherein the treatment liquid has a pH of 11 or less.

22. The treatment liquid for inhibiting collapse of a pattern structure according to claim 17 , wherein the treatment liquid has a pH of 4 or more and 11 or less.

23. The treatment liquid for inhibiting collapse of a pattern structure according to claim 17 , further comprising:

a buffer.

24. The treatment liquid for inhibiting collapse of a pattern structure according to claim 17 , wherein the alkanol is 2-propanol.

25. The treatment liquid for inhibiting collapse of a pattern structure according to claim 17 , wherein the content of the alkanol is 0.1 to 80 mass % in the treatment liquid.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 9, 2018
From: MIZUTANI, ATSUSHI; INABA, TADASHI
To: FUJIFILM CORPORATION
Reel/Frame 044566/0500 →
Priority Claims (1)
JP 2015-139598 · Jul 13, 2015 · national
Continuity (2)
Continuation PCTJP2016069663 · Jul 1, 2016
Related Publication 20180122628A1 · May 3, 2018
Cited By (1)
US 12,713,866