Liquid supply unit, substrate treating apparatus, and method for removing bubbles

1. A substrate treating apparatus comprising:

a substrate support unit configured to support a substrate; and

a liquid supply unit configured to supply a treatment liquid in which a first liquid and a second liquid are mixed, onto the substrate supported by the substrate support unit,

wherein the liquid supply unit includes:

a nozzle configured to discharge the treatment liquid;

a first liquid supply line configured to supply the first liquid to the nozzle; and

a second liquid supply line configured to supply the second liquid to the nozzle, and

wherein the nozzle includes:

a body having a mixing space in which the first liquid and the second liquid are mixed and a buffer space extending from the mixing space, in the interior of the body; and

a collision member located in the buffer space and configured to decrease a flow velocity of the treatment liquid supplied to the buffer space; and

wherein the collision member includes:

a collision body configured to divide the buffer space into an upper space and a lower space and having an open-topped vessel shape, wherein the upper space is between the mixing space and the lower space; and

a ring plate surrounding the collision body and having an annular ring shape extending radially between a free edge of the collision body and the body, wherein a plurality of ring holes are formed in the ring plate and arranged along a circumferential direction of the ring plate.

2. The substrate treating apparatus of claim 1 , wherein the nozzle further includes:

a separation plate configured to separate the mixing space and the buffer space from each other and having a first hole.

3. The substrate treating apparatus of claim 2 , wherein if viewed from upstream to the collision body, the collision body overlaps the first hole.

4. The substrate treating apparatus of claim 3 , wherein the treatment liquid accommodated in the collision body overflows the collision body, and is supplied to the lower space through the ring holes.

5. The substrate treating apparatus of claim 4 , wherein the body further has a discharge space extending from the lower space and including a discharge end,

wherein the nozzle further includes:

a lower plate configured to separate the lower space and the discharge space from each other and having a lower hole, and

wherein if viewed from upstream to the collision body, the lower hole is located to overlap the collision body.

6. The substrate treating apparatus of claim 5 , wherein the discharge space is provided such that a width of a lower area of the discharge space is smaller than a width of an upper area thereof.

7. The substrate treating apparatus of claim 2 , wherein the first liquid includes sulfuric acid, and

wherein the second liquid includes hydrogen peroxide.

8. The substrate treating apparatus of claim 2 , wherein the first hole includes a plurality of first holes,

wherein the separation plate further has a second hole,

wherein the second hole is located in a central area of the separation plate,

wherein the first holes are located to surround the second hole, and

wherein if viewed from upstream to the collision body, the collision body overlaps the first and second holes.

9. The substrate treating apparatus of claim 8 , wherein the diameters of the first holes are larger than the diameter of the second hole.

10. The substrate treating apparatus of claim 9 , wherein the body further has a first passage extending to the mixing space and to which the first liquid supply line is connected, and a second passage extending to the mixing space and to which the second liquid supply line is connected,

wherein the first passage faces a downward direction at a location that is adjacent to an inner surface of the mixing space,

wherein the second passage is provided in a spiral direction at a location that is adjacent to the inner surface of the mixing space,

wherein the downward direction is parallel to an axial axis of the nozzle, and

wherein the spiral direction is along a radial direction of the nozzle and perpendicular to the downward direction.

11. A liquid supply unit for supplying a treatment liquid in which a first liquid and a second liquid are mixed, the liquid supply unit comprising:

a nozzle configured to discharge the treatment liquid;

a first liquid supply line configured to supply the first liquid to the nozzle; and

a second liquid supply line configured to supply the second liquid to the nozzle, and

wherein the nozzle includes:

a body having a mixing space in which the first liquid and the second liquid are mixed and a buffer space extending from the mixing space, in the interior of the body; and

a collision member located in the buffer space and configured to decrease a flow velocity of the treatment liquid supplied to the buffer space; and

wherein the collision member includes:

a collision body configured to divide the buffer space into an upper space and a lower space and having an open-topped vessel shape, wherein the upper space is between the mixing space and the lower space; and

a ring plate surrounding the collision body and having an annular ring shape extending radially between a free edge of the collision body and the body, wherein a plurality of ring holes are formed in the ring plate and arranged along a circumferential direction of the ring plate.

12. The liquid supply unit of claim 11 , wherein the nozzle further includes:

a separation plate configured to separate the mixing space and the buffer space from each other and having a first hole, and

wherein if viewed from upstream to the collision body, the collision body overlaps the first hole.

13. The liquid supply unit of claim 12 , wherein the treatment liquid accommodated in the collision body overflows the collision body and is supplied to the lower space through the ring holes.

14. The liquid supply unit of claim 11 , wherein the first liquid includes sulfuric acid, and

wherein the second liquid includes hydrogen peroxide.