Wire bond clamp design and lead frame capable of engaging with same
Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.
1. A semiconductor device comprising:
a first die supporting pad including a first extension, a second extension, and a third extension from the first die supporting pad;
a second die supporting pad a fourth extension from the second die supporting pad; and
a first semiconductor die attached to the first die supporting pad, and a second semiconductor die attached to the second die supporting pad, the first semiconductor die and the second semiconductor die electrically connected to at least some leads of a plurality of leads of the semiconductor device, the first semiconductor die electrically connected to the second semiconductor die; wherein:
the first extension, and the second extension are parallel to each other from a top view of the semiconductor device;
the third extension includes a wire bond attached thereto; and
the fourth extension extends from two adjacent sides at an angle substantially perpendicular to each of the two adjacent sides of the second die supporting pad.
2. The semiconductor device of claim 1 , wherein the third extension is capable of engaging directly with a wire bonding clamp.
3. The semiconductor device of claim 2 , wherein the third extension extends from two adjacent sides of the first die supporting pad.
4. The semiconductor device of claim 3 , wherein each of the third extension and the fourth extension includes a cavity.
5. The semiconductor device of claim 4 , wherein the second extension is longer than the first extension.
6. The semiconductor device of claim 1 , wherein the first die supporting pad is larger in area than the second die supporting pad.
7. The semiconductor device of claim 1 , wherein the first semiconductor die is larger than the second semiconductor die.
8. A semiconductor device comprising:
a first die supporting pad including a first extension, a second extension, and a third extension from the first die supporting pad;
a second die supporting pad a fourth extension from the second die supporting pad; and
a first semiconductor die attached to the first die supporting pad, and a second semiconductor die attached to the second die supporting pad, the first semiconductor die and the second semiconductor die electrically connected to at least some leads of a plurality of leads of the semiconductor device, the first semiconductor die electrically connected to the second semiconductor die; wherein the first extension, and the second extension extend in opposite directions parallel to each other from a top view of the semiconductor device, and wherein each of the third extension and the fourth extension includes a cavity.
9. The semiconductor device of claim 8 , wherein the third extension includes a wire bond attached thereto.
10. The semiconductor device of claim 8 , wherein the fourth extension extends from two adjacent sides of the second die supporting pad.
11. The semiconductor device of claim 8 , wherein the fourth extension extends from two adjacent sides at an angle substantially perpendicular to each of the two adjacent sides of the second die supporting pad.
12. The semiconductor device of claim 8 , wherein surfaces of the first die supporting pad and the second die supporting pad are parallel to each other.
13. The semiconductor device of claim 8 , wherein the third extension and the fourth extension are part of the plurality of leads of the semiconductor device.