Systems and methods for modulation and mapping of brain tissue using an ultrasound assembly
Methods and systems for modulation and mapping of brain tissue in a subject using an ultrasound assembly are provided. An exemplary method for modulation uses an ultrasound assembly including a housing and an ultrasound transducer joined to the housing. The method includes securing the housing to the head of the subject with the ultrasound transducer aligned with a region of the brain tissue to target the region of the brain tissue for modulating, and providing focused ultrasound at an acoustic pressure to the targeted region using the ultrasound transducer to induce cavitation proximate the targeted region. The method further includes detecting a cavitation signal magnitude from the induced cavitation corresponding to the acoustic pressure and modulating the targeted region.
1. A system for modulation of brain tissue in a subject, comprising:
a wearable ultrasound assembly comprising a housing configured to be secured to the head of the subject;
at least one flexible circuit comprising two or more transducers including a piezoelectric material joined to the housing for providing focused ultrasound at an acoustic pressure to a targeted region in the brain tissue to induce cavitation proximate the targeted region and for detecting a cavitation signal magnitude from the induced cavitation corresponding to the acoustic pressure;
two or more EEG sensors joined to the wearable ultrasound assembly for detecting a neuronal signal; and
one or more processors configured to control the ultrasound assembly and/or the transducers, wherein the one or more processors are configured to spatially map the cavitation signal magnitude and compare the cavitation signal magnitude to a predetermined threshold cavitation signal magnitude, wherein the one or more processors are configured to modulate the acoustic pressure based on the map of the cavitation signal magnitude for simultaneous modulation of the brain tissue.
2. The system of claim 1 , wherein the flexible circuit comprises a CMOS chip.
3. The system of claim 1 , wherein each flexible circuit is disposed on a printed circuit board tethered to the wearable ultrasound assembly.
4. The system of claim 1 , wherein each flexible circuit further comprises a power amplifier and phase modulator for each transducer.