3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
An adhesive with self-connecting interconnects is provided. The adhesive layer provides automatic 3D joining of microelectronic components with a conductively self-adjusting anisotropic matrix. In an implementation, the adhesive matrix automatically makes electrical connections between two surfaces that have opposing electrical contacts, and bonds the two surfaces together. Conductive members in the adhesive matrix are aligned to automatically establish electrical connections between at least partially aligned contacts on each of the two surfaces while providing nonconductive adhesion between parts of the two surfaces lacking aligned contacts. An example method includes forming an adhesive matrix between two surfaces to be joined, including conductive members anisotropically aligned in an adhesive medium, then pressing the two surfaces together to automatically connect corresponding electrical contacts that are at least partially aligned on the two surfaces. The adhesive medium in the matrix secures the two surfaces together.
1. A self-adjusting adhesive containing self-connecting interconnects, comprising:
an adhesive medium capable of solidifying into a permanent adhesive between surfaces;
conductive members aligned vertically in the adhesive medium with a pitch averaging approximately 1 micrometer (μm) or less from each other, the adhesive medium electrically insulating the vertically aligned conductive members from horizontal electrical conduction between each other; and
wherein the conductive members are configured to penetrate into a solder when the conductive members are vertically aligned with the solder on one of the surfaces while configured at the same time to bend, kink, or break upon engaging a nonconductive part of one of the surfaces.
2. The adhesive of claim 1 , wherein the adhesive medium comprises a flowable medium.
3. The adhesive of claim 1 , further comprising anisotropically aligned conductive members.
4. The adhesive of claim 1 , further comprising automatically formed electrical interconnects between opposing electrical contacts at least partially vertically aligned on each of two respective surfaces being adhered together, the automatically formed electrical interconnects comprising sets of the conductive members aligned vertically.
5. The adhesive of claim 4 , further comprising automatically formed electrical interconnects between misaligned opposing electrical contacts.
6. The adhesive of claim 1 , further comprising electrically nonconductive adhesive between parts of the surfaces lacking at least partially aligned electrical contacts, the electrically nonconductive adhesive comprising sets of the conductive members aligned vertically in the adhesive medium.
7. The adhesive of claim 1 , wherein the conductive members are selected from the group consisting of carbon nanotubes, densely packed conductive wires, coated carbon nanotubes, a conductive aligned film of single-walled carbon nanotubes (SWNT), carbon nanotubes with a surfactant outer layer, carbon nanotubes with a dispersant outer layer, carbon nanotubes with a hydrophobic outer layer, carbon nanotubes with a hydrophilic outer layer, copper wires, silver wires, aluminum wires, nickel wires, gold wires, and alloy wires.
8. The adhesive of claim 1 , further comprising conductive members with first ends and second ends, wherein at least the first ends or the second ends of the conductive members are flush with a surface of a layer of the adhesive.
9. The adhesive of claim 1 , further comprising a release layer, the adhesive capable of being applied to a surface with the release layer, prior to the release layer being removed from the adhesive.
10. The adhesive of claim 1 , wherein the conductive members are capable of penetrating into a solder of an electrical contact on a surface.
11. The adhesive of claim 10 , wherein the adhesive medium comprises a solid thermoplastic material having a melting temperature or a glass transition temperature higher than the melting temperature of the solder.
12. The adhesive of claim 10 , wherein the adhesive medium comprises a thermoset material having a curing temperature or a setting temperature lower than the melting temperature of the solder.
13. The adhesive of claim 10 , wherein the adhesive medium comprises a thermoset material having a curing temperature or a setting temperature higher than the melting temperature of the solder, and the thermoset material is capable of being cured prior to joining two surfaces being adhered with the adhesive.
14. The adhesive of claim 1 , wherein the conductive members are configured to penetrate into the solder and capable of bending, kinking, or breaking upon engaging a nonconductive part of a surface being adhered by the adhesive only at a temperature higher than a setting temperature of the adhesive.
15. The adhesive of claim 1 , wherein the adhesive medium and the conductive members are capable of transmitting a heat or a pressure during application to cause a solder or a flowable joining material coating electrical contacts of surfaces being joined to flow before the adhesive medium flows.
16. The adhesive of claim 1 , wherein the adhesive medium is capable of softening and flowing under a vacuum while the conductive members connect the vertically corresponding electrical contacts of two surfaces being adhered together.
17. The adhesive of claim 1 , wherein the conductive members are capable of complying to variances in distances between parts of two surfaces being adhered by the adhesive.
18. The adhesive of claim 17 , wherein the conductive members compliantly establish electrical connections between at least partially aligned contacts at various distances apart from each other on each of the two respective surfaces.
19. The adhesive of claim 17 , wherein the adhesive medium provides compliant nonconductive adhesion between nonelectrical parts of the two surfaces at various distances apart from each other.
20. The adhesive of claim 1 , wherein the conductive members dissipate a heat away from at least one surface being adhered by the adhesive.